The XCKU115-L1FLVF1924I is a high-performance Xilinx FPGA from AMD’s Kintex® UltraScale™ family. Built on advanced 20nm architecture, it delivers the best price-per-performance-per-watt ratio in its class, making it the go-to solution for engineers designing complex signal processing, 100G networking, and next-generation video systems. With 1,451,100 system logic cells and 728 user I/Os in a robust 1924-pin FCBGA package, the XCKU115-L1FLVF1924I is a flagship mid-range FPGA that bridges the gap between cost sensitivity and ultra-high performance.

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What Is the XCKU115-L1FLVF1924I?

The XCKU115-L1FLVF1924I belongs to AMD Xilinx’s Kintex UltraScale series — a family engineered specifically for compute-intensive workloads where power efficiency and DSP density matter most. The “L1” speed grade designation indicates a low-power variant at speed grade 1, while the “FLVF1924” suffix identifies the flip-chip low-voltage FCBGA package with 1924 pins. The trailing “I” denotes the industrial temperature range (-40°C to 100°C), making this device suitable for demanding environments beyond standard commercial use cases.

This device leverages both monolithic die construction and next-generation stacked silicon interconnect (SSI) technology, giving designers the flexibility to target cost-optimized or high-density implementations within the same architecture.

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XCKU115-L1FLVF1924I Key Specifications at a Glance

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XCKU115-L1FLVF1924I Part Number Decoder

Understanding the part number helps engineers quickly identify the exact variant needed for their design.

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Logic Resources & Programmable Fabric

CLB Architecture and Flip-Flops

The XCKU115-L1FLVF1924I features 663,360 Configurable Logic Blocks (CLBs), each containing 6-input Look-Up Tables (LUTs) and dedicated carry logic. With 1,326,720 CLB flip-flops, this device supports extremely deep pipelining, enabling designers to achieve high clock frequencies even in complex multi-stage datapath architectures.

DSP Signal Processing Engine

One of the standout features of the XCKU115-L1FLVF1924I is its 5,520 DSP48E2 slices — the largest DSP count available in a mid-range FPGA device. Each DSP slice includes a pre-adder, 27×18-bit multiplier, and 48-bit accumulator, enabling efficient implementation of:

• FIR and IIR digital filters
• FFT engines for radar and communications
• Matrix multiplication for AI/ML inference
• Floating-point arithmetic pipelines

On-Chip Memory Resources

This large on-chip memory footprint supports high-bandwidth buffering, deep FIFO queues, and lookup table storage without needing costly external memory interfaces.

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I/O and Connectivity

User I/O Configuration

The device provides 728 user-configurable I/O pins organized across multiple High-Performance (HP) and High-Range (HR) I/O banks. HP banks support lower voltage levels with high-speed operation, while HR banks support a wider voltage range for interfacing with diverse external logic.

GTH High-Speed Serial Transceivers

The XCKU115-L1FLVF1924I integrates 48 GTH transceivers, enabling high-throughput serial communication essential for modern networking and data center designs.

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Power and Electrical Characteristics

Supply Voltage Requirements

The XCKU115-L1FLVF1924I is designed for low-voltage operation, which directly reduces dynamic and static power consumption compared to older FPGA generations.

Thermal and Environmental Ratings

The industrial temperature rating makes the XCKU115-L1FLVF1924I suitable for applications exposed to harsh environments, wide temperature swings, and extended operational lifetimes.

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Package Information

1924-FCBGA (FLVF) Package Details

The flip-chip construction provides superior thermal performance and shorter electrical paths between the die and PCB, contributing to higher signal integrity at high clock frequencies.

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Target Applications for XCKU115-L1FLVF1924I

The combination of massive DSP resources, high-speed transceivers, and industrial temperature tolerance makes the XCKU115-L1FLVF1924I an ideal choice across multiple demanding sectors.

#### 100G Networking and Data Centers

With 48 GTH transceivers capable of 16.3 Gb/s per lane, the device supports full 100GbE implementations using 10×10G or 4×25G lane configurations. Its packet-processing fabric handles line-rate forwarding, deep packet inspection, and network function virtualization (NFV) workloads.

#### DSP-Intensive Signal Processing

The 5,520 DSP slices give the XCKU115-L1FLVF1924I the signal processing firepower required for software-defined radio (SDR), phased-array radar, and electronic warfare systems. The device can implement thousands of parallel multiply-accumulate (MAC) operations per clock cycle.

#### Next-Generation Medical Imaging

Real-time image reconstruction for MRI, CT scanners, and ultrasound systems demands both high arithmetic throughput and deterministic latency. The XCKU115-L1FLVF1924I’s large on-chip RAM and DSP density support these demanding imaging pipelines without external co-processors.

#### 8K4K Video Processing

High-resolution video processing for broadcast, cinema, and professional AV applications requires enormous pixel-throughput bandwidth. The device’s large logic fabric and high-speed I/O support multi-channel 8K video encode, decode, and compositing pipelines.

#### Heterogeneous Wireless Infrastructure

5G baseband processing, massive MIMO, and fronthaul/backhaul interfaces leverage the CPRI and JESD204B protocol support offered by the GTH transceivers, combined with the large DSP array for channel equalization and beamforming.

#### High-Performance Computing and FPGA Acceleration

As an FPGA accelerator card co-processor, the XCKU115-L1FLVF1924I integrates seamlessly with host CPUs via PCIe Gen3 ×8/×16 interfaces, supporting applications in AI inference, financial analytics, genomics, and scientific simulations.

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Ordering Information and Variants

The XCKU115 device is available in several speed grades and temperature configurations. The table below summarizes closely related variants to help engineers select the correct part.

Note: The “L1” speed grade offers reduced power consumption compared to standard Grade 1 (-1), making it ideal for power-constrained deployments where maximum clock frequency is not the primary design constraint.

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Development and Design Tools

AMD Vivado Design Suite

The XCKU115-L1FLVF1924I is fully supported by AMD Vivado Design Suite, the industry-standard FPGA design environment. Vivado provides:

• RTL synthesis and implementation
• Timing closure with intelligent place-and-route
• IP Integrator for block design
• Integrated Logic Analyzer (ILA) for in-system debugging
• Power analysis and optimization

Supported IP Cores

The device is compatible with AMD’s extensive library of production-ready IP cores, including PCIe controllers, DDR4 memory controllers, Ethernet subsystems, and DSP libraries — dramatically reducing design cycle time.

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Compliance and Certifications

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Frequently Asked Questions (FAQ)

What does the “L1” speed grade mean in XCKU115-L1FLVF1924I?

The “L” prefix indicates a low-power process variant, and “1” denotes speed grade 1. This combination prioritizes reduced static and dynamic power consumption over achieving the highest possible clock frequency, making it ideal for battery-sensitive or thermally constrained deployments.

What is the maximum operating temperature of the XCKU115-L1FLVF1924I?

This device carries an industrial temperature rating, supporting junction temperatures from -40°C to 100°C (TJ). This makes it suitable for outdoor, automotive-adjacent, and industrial environments requiring extended operating ranges.

How many DSP slices does the XCKU115-L1FLVF1924I have?

The device contains 5,520 DSP48E2 slices, giving it one of the highest DSP densities available in a mid-range FPGA. This makes it particularly well-suited for radar, medical imaging, video processing, and 5G signal processing tasks.

Is the XCKU115-L1FLVF1924I still in production?

Yes. As of the current date, the XCKU115-L1FLVF1924I carries an Active product status from AMD. Lead times may vary by distributor; a typical manufacturer lead time is approximately 48 weeks.

What design tools are required for the XCKU115-L1FLVF1924I?

AMD’s Vivado Design Suite supports the full XCKU115 device family. The Vivado ML Edition provides access to advanced optimization features. Designers may also use Vitis for high-level synthesis (HLS) and accelerated application development.

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Summary

The XCKU115-L1FLVF1924I is an industrial-grade, low-power Kintex UltraScale FPGA delivering an exceptional combination of logic density, DSP throughput, and high-speed serial connectivity. With 1.45 million system logic cells, 5,520 DSP slices, 77.7 Mb of on-chip RAM, and 48 GTH transceivers — all housed in a 1924-pin FCBGA package rated for industrial temperatures — this device is purpose-built for the most demanding real-world applications in networking, medical imaging, video, and wireless infrastructure.

For engineers seeking the optimal balance between power consumption and processing capability in an FPGA design, the XCKU115-L1FLVF1924I represents a compelling solution backed by AMD Xilinx’s mature UltraScale ecosystem and Vivado toolchain.