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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1150C: Xilinx Spartan-II FPGA — Complete Product Guide

Product Details

The XC2S200-6FGG1150C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s proven Spartan-II family, engineered for cost-sensitive, high-volume digital design applications. With 200,000 system gates, 5,292 logic cells, and a 1,150-pin Fine-Pitch BGA package, this device delivers the programmability, speed, and I/O density that embedded engineers and PCB designers demand.

Whether you are prototyping a new communication system, building industrial automation control, or developing consumer electronics, the XC2S200-6FGG1150C provides a flexible, reconfigurable solution that replaces expensive mask-programmed ASICs — without the risk or up-front NRE cost.


What Is the XC2S200-6FGG1150C? — Part Number Breakdown

Understanding the part number helps you quickly identify the exact device variant:

Code Segment Meaning
XC2S200 Xilinx Spartan-II, 200K-gate device
-6 Speed grade -6 (fastest available; Commercial range only)
FGG Fine-Pitch Ball Grid Array, Pb-Free (RoHS-compliant) package
1150 1,150 pins/balls in the BGA package
C Commercial temperature range (0°C to +85°C)

Note: The -6 speed grade is exclusively available in the Commercial temperature range — it is not offered in the industrial (I) variant.


XC2S200-6FGG1150C Key Specifications

Core Logic Resources

Parameter Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits (56,000 bits)

Electrical & Technology Characteristics

Parameter Value
Core Voltage (VCCINT) 2.5 V
Technology Node 0.18 µm CMOS
Maximum System Frequency Up to 263 MHz
Speed Grade -6 (fastest in Spartan-II family)
I/O Standards Supported LVTTL, LVCMOS2, PCI, GTL, HSTL, SSTL, CTT

Package Information

Parameter Value
Package Type Fine-Pitch Ball Grid Array (FBGA)
Package Code FGG1150
Total Pins 1,150
Pb-Free / RoHS Yes (“GG” designator confirms Pb-free)
Temperature Range Commercial (0°C to +85°C)

Spartan-II Family Comparison — Where XC2S200 Fits

The XC2S200 sits at the top of the Spartan-II product line, providing the highest gate count, most CLBs, and most distributed RAM in the family:

Device Logic Cells System Gates CLB Array Max User I/O Dist. RAM (bits) Block RAM (bits)
XC2S15 432 15,000 8×12 86 6,144 16K
XC2S30 972 30,000 12×18 92 13,824 24K
XC2S50 1,728 50,000 16×24 176 24,576 32K
XC2S100 2,700 100,000 20×30 176 38,400 40K
XC2S150 3,888 150,000 24×36 260 55,296 48K
XC2S200 5,292 200,000 28×42 284 75,264 56K

The XC2S200 is the largest and most capable device in the Spartan-II range, making the XC2S200-6FGG1150C the go-to choice when maximum logic density and I/O count are required.


XC2S200-6FGG1150C Architecture Overview

Configurable Logic Blocks (CLBs)

At the heart of the XC2S200-6FGG1150C are 1,176 CLBs arranged in a 28×42 grid. Each CLB contains:

  • Four function generators (LUTs) capable of implementing any 4-input Boolean function
  • Four storage elements (flip-flops or latches)
  • Dedicated carry logic for fast arithmetic
  • Wide-function multiplexers for efficient logic packing

Block RAM

The device includes 56K bits of block RAM organized in two columns on opposite sides of the CLB array. Each block RAM can be configured as a synchronous dual-port memory, making it ideal for FIFOs, lookup tables, and data buffering.

Input/Output Blocks (IOBs)

Up to 284 user I/Os surround the CLB array, each featuring:

  • Programmable drive strength and slew rate
  • Support for multiple I/O standards (LVTTL, LVCMOS, PCI, HSTL, SSTL, GTL/GTL+)
  • Optional input delay for hold-time management
  • Three-state control for bidirectional interfacing

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (one per corner of the die) provide:

  • Clock deskew and distribution
  • Frequency synthesis (multiply/divide)
  • Phase shifting for synchronous system design

Routing Architecture

A hierarchical, versatile routing matrix interconnects all CLBs and IOBs, enabling high-performance timing closure across the full 28×42 array.


Speed Grade -6: Performance Highlights

The -6 speed grade is the highest-performance offering in the Spartan-II family, available only in the commercial temperature range (as in the XC2S200-6FGG1150C). Key performance characteristics include:

Timing Parameter -6 Grade Typical Value
Maximum System Clock 263 MHz
CLB-to-CLB Propagation Delay Fast (refer to DS001 for exact values)
Pin-to-Pin Logic Delay Optimized for -6 grade
Setup Time (Flip-Flop) Minimized at -6

For full timing specifications, refer to the official Xilinx Spartan-II datasheet (DS001).


Configuration Modes

The XC2S200-6FGG1150C supports multiple configuration methods for flexible system integration:

Configuration Mode Description
Master Serial FPGA drives configuration clock; uses serial PROM
Slave Serial External controller drives configuration
Master Parallel (x8) Faster byte-wide configuration
Slave Parallel (SelectMAP) Processor or controller-driven byte-wide
JTAG (Boundary Scan) IEEE 1149.1 compliant; supports in-system programming
Express Mode Fastest configuration mode

Boundary Scan (JTAG) support is built in, enabling in-circuit test and programming without physical socketing.


Applications & Use Cases

The XC2S200-6FGG1150C is widely deployed across industries where flexible, reconfigurable digital logic is required:

✅ Communications & Networking

  • Protocol bridging (UART, SPI, I2C, Ethernet MAC)
  • Network routing and packet filtering
  • High-speed data serialization/deserialization

✅ Industrial Automation

  • Motor control and PWM generation
  • PLC I/O expansion
  • Real-time sensor data acquisition

✅ Medical & Test Equipment

  • Imaging system data pipelines
  • Signal conditioning for diagnostic instruments
  • High-channel-count ADC/DAC interfacing

✅ Consumer Electronics

  • Display timing controllers
  • Audio DSP pre-processing
  • Set-top box interface logic

✅ Defense & Aerospace (Commercial Grade Designs)

  • Radar signal processing front-end
  • Avionics bus interface (ARINC, MIL-STD-1553 bridging)

Why Choose the XC2S200-6FGG1150C Over an ASIC?

Factor ASIC XC2S200-6FGG1150C FPGA
NRE Cost High ($100K–$1M+) None
Time to Market 6–18 months Days to weeks
Design Changes Require new mask set Reprogrammed in the field
Risk High (one-shot) Low (iterative)
Volume Suitability Best at very high volume Cost-effective at medium-high volume
Prototyping Expensive Ideal

The XC2S200-6FGG1150C eliminates NRE risk and dramatically shortens development cycles — a significant advantage for time-sensitive product launches.


Development Tools & Software Support

Xilinx Spartan-II devices are supported by a mature toolchain:

Tool Description
Xilinx ISE Design Suite Primary synthesis, P&R, and bitstream generation tool for Spartan-II
XST (Xilinx Synthesis Technology) HDL synthesis engine within ISE
ModelSim / XSIM Behavioral and timing simulation
iMPACT Device programming via JTAG
ChipScope Pro In-system logic analysis (ILA)
VHDL / Verilog / SystemVerilog Supported HDL languages

For current-generation Xilinx FPGA families with Vivado support, see our full Xilinx FPGA catalog.


Ordering Information & Part Number Variants

The XC2S200 is available in multiple package and speed grade combinations. Below are key variants of the same core device:

Part Number Speed Grade Package Pins Temp Range Pb-Free
XC2S200-6FGG1150C -6 FBGA 1150 Commercial Yes
XC2S200-6FGG456C -6 FBGA 456 Commercial Yes
XC2S200-6FG456C -6 FBGA 456 Commercial No
XC2S200-6FG256C -6 FBGA 256 Commercial No
XC2S200-5FGG456C -5 FBGA 456 Commercial Yes
XC2S200-5FGG456I -5 FBGA 456 Industrial Yes
XC2S200-6PQ208C -6 PQFP 208 Commercial No

For 284 user I/O pins and maximum pin density, the FGG1150 package is the optimal choice — enabling the highest connectivity among all XC2S200 package options.


Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1150C used for?

The XC2S200-6FGG1150C is a 200K-gate Xilinx Spartan-II FPGA used in communications, industrial control, consumer electronics, medical devices, and test equipment. Its 1,150-pin BGA package and 284 user I/Os make it ideal for high pin-count system designs.

What is the core voltage of the XC2S200-6FGG1150C?

The core operating voltage (VCCINT) is 2.5V, consistent across the entire Spartan-II family.

Is the XC2S200-6FGG1150C RoHS compliant?

Yes. The “GG” designation in the package code (FGG1150) indicates a Pb-free, RoHS-compliant package.

What is the maximum clock frequency?

The XC2S200 at speed grade -6 supports system clock frequencies up to 263 MHz.

What software do I use to program the XC2S200-6FGG1150C?

Use Xilinx ISE Design Suite for synthesis, place-and-route, and bitstream generation. Programming is done via iMPACT using a JTAG cable or via serial/parallel PROM.

Can the XC2S200-6FGG1150C be reprogrammed in the field?

Yes. Like all SRAM-based FPGAs, it is fully reconfigurable. New bitstreams can be loaded at power-up via JTAG or from an external configuration PROM.

What is the difference between the -5 and -6 speed grades?

The -6 speed grade offers faster timing performance (lower propagation delays, higher max frequency) than the -5. Importantly, the -6 grade is only available in the commercial temperature range (0°C to +85°C).


Summary: XC2S200-6FGG1150C at a Glance

Attribute Value
Manufacturer Xilinx (AMD)
Family Spartan-II
Part Number XC2S200-6FGG1150C
System Gates 200,000
Logic Cells 5,292
User I/O 284
Block RAM 56K bits
Distributed RAM 75,264 bits
Speed Grade -6 (Commercial only)
Max Frequency 263 MHz
Core Voltage 2.5V
Package 1,150-pin FBGA (Pb-Free)
Temperature Range 0°C to +85°C (Commercial)
Configuration JTAG, Serial, Parallel, SelectMAP
Design Tools Xilinx ISE Design Suite

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.