The XC2S200-6FGG1150C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s proven Spartan-II family, engineered for cost-sensitive, high-volume digital design applications. With 200,000 system gates, 5,292 logic cells, and a 1,150-pin Fine-Pitch BGA package, this device delivers the programmability, speed, and I/O density that embedded engineers and PCB designers demand.
Whether you are prototyping a new communication system, building industrial automation control, or developing consumer electronics, the XC2S200-6FGG1150C provides a flexible, reconfigurable solution that replaces expensive mask-programmed ASICs — without the risk or up-front NRE cost.
What Is the XC2S200-6FGG1150C? — Part Number Breakdown
Understanding the part number helps you quickly identify the exact device variant:
| Code Segment |
Meaning |
| XC2S200 |
Xilinx Spartan-II, 200K-gate device |
| -6 |
Speed grade -6 (fastest available; Commercial range only) |
| FGG |
Fine-Pitch Ball Grid Array, Pb-Free (RoHS-compliant) package |
| 1150 |
1,150 pins/balls in the BGA package |
| C |
Commercial temperature range (0°C to +85°C) |
Note: The -6 speed grade is exclusively available in the Commercial temperature range — it is not offered in the industrial (I) variant.
XC2S200-6FGG1150C Key Specifications
Core Logic Resources
| Parameter |
Value |
| Logic Cells |
5,292 |
| System Gates (Logic + RAM) |
200,000 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
Electrical & Technology Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
2.5 V |
| Technology Node |
0.18 µm CMOS |
| Maximum System Frequency |
Up to 263 MHz |
| Speed Grade |
-6 (fastest in Spartan-II family) |
| I/O Standards Supported |
LVTTL, LVCMOS2, PCI, GTL, HSTL, SSTL, CTT |
Package Information
| Parameter |
Value |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Package Code |
FGG1150 |
| Total Pins |
1,150 |
| Pb-Free / RoHS |
Yes (“GG” designator confirms Pb-free) |
| Temperature Range |
Commercial (0°C to +85°C) |
Spartan-II Family Comparison — Where XC2S200 Fits
The XC2S200 sits at the top of the Spartan-II product line, providing the highest gate count, most CLBs, and most distributed RAM in the family:
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Dist. RAM (bits) |
Block RAM (bits) |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
6,144 |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
13,824 |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
24,576 |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
38,400 |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
55,296 |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
75,264 |
56K |
The XC2S200 is the largest and most capable device in the Spartan-II range, making the XC2S200-6FGG1150C the go-to choice when maximum logic density and I/O count are required.
XC2S200-6FGG1150C Architecture Overview
Configurable Logic Blocks (CLBs)
At the heart of the XC2S200-6FGG1150C are 1,176 CLBs arranged in a 28×42 grid. Each CLB contains:
- Four function generators (LUTs) capable of implementing any 4-input Boolean function
- Four storage elements (flip-flops or latches)
- Dedicated carry logic for fast arithmetic
- Wide-function multiplexers for efficient logic packing
Block RAM
The device includes 56K bits of block RAM organized in two columns on opposite sides of the CLB array. Each block RAM can be configured as a synchronous dual-port memory, making it ideal for FIFOs, lookup tables, and data buffering.
Input/Output Blocks (IOBs)
Up to 284 user I/Os surround the CLB array, each featuring:
- Programmable drive strength and slew rate
- Support for multiple I/O standards (LVTTL, LVCMOS, PCI, HSTL, SSTL, GTL/GTL+)
- Optional input delay for hold-time management
- Three-state control for bidirectional interfacing
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (one per corner of the die) provide:
- Clock deskew and distribution
- Frequency synthesis (multiply/divide)
- Phase shifting for synchronous system design
Routing Architecture
A hierarchical, versatile routing matrix interconnects all CLBs and IOBs, enabling high-performance timing closure across the full 28×42 array.
Speed Grade -6: Performance Highlights
The -6 speed grade is the highest-performance offering in the Spartan-II family, available only in the commercial temperature range (as in the XC2S200-6FGG1150C). Key performance characteristics include:
| Timing Parameter |
-6 Grade Typical Value |
| Maximum System Clock |
263 MHz |
| CLB-to-CLB Propagation Delay |
Fast (refer to DS001 for exact values) |
| Pin-to-Pin Logic Delay |
Optimized for -6 grade |
| Setup Time (Flip-Flop) |
Minimized at -6 |
For full timing specifications, refer to the official Xilinx Spartan-II datasheet (DS001).
Configuration Modes
The XC2S200-6FGG1150C supports multiple configuration methods for flexible system integration:
| Configuration Mode |
Description |
| Master Serial |
FPGA drives configuration clock; uses serial PROM |
| Slave Serial |
External controller drives configuration |
| Master Parallel (x8) |
Faster byte-wide configuration |
| Slave Parallel (SelectMAP) |
Processor or controller-driven byte-wide |
| JTAG (Boundary Scan) |
IEEE 1149.1 compliant; supports in-system programming |
| Express Mode |
Fastest configuration mode |
Boundary Scan (JTAG) support is built in, enabling in-circuit test and programming without physical socketing.
Applications & Use Cases
The XC2S200-6FGG1150C is widely deployed across industries where flexible, reconfigurable digital logic is required:
✅ Communications & Networking
- Protocol bridging (UART, SPI, I2C, Ethernet MAC)
- Network routing and packet filtering
- High-speed data serialization/deserialization
✅ Industrial Automation
- Motor control and PWM generation
- PLC I/O expansion
- Real-time sensor data acquisition
✅ Medical & Test Equipment
- Imaging system data pipelines
- Signal conditioning for diagnostic instruments
- High-channel-count ADC/DAC interfacing
✅ Consumer Electronics
- Display timing controllers
- Audio DSP pre-processing
- Set-top box interface logic
✅ Defense & Aerospace (Commercial Grade Designs)
- Radar signal processing front-end
- Avionics bus interface (ARINC, MIL-STD-1553 bridging)
Why Choose the XC2S200-6FGG1150C Over an ASIC?
| Factor |
ASIC |
XC2S200-6FGG1150C FPGA |
| NRE Cost |
High ($100K–$1M+) |
None |
| Time to Market |
6–18 months |
Days to weeks |
| Design Changes |
Require new mask set |
Reprogrammed in the field |
| Risk |
High (one-shot) |
Low (iterative) |
| Volume Suitability |
Best at very high volume |
Cost-effective at medium-high volume |
| Prototyping |
Expensive |
Ideal |
The XC2S200-6FGG1150C eliminates NRE risk and dramatically shortens development cycles — a significant advantage for time-sensitive product launches.
Development Tools & Software Support
Xilinx Spartan-II devices are supported by a mature toolchain:
| Tool |
Description |
| Xilinx ISE Design Suite |
Primary synthesis, P&R, and bitstream generation tool for Spartan-II |
| XST (Xilinx Synthesis Technology) |
HDL synthesis engine within ISE |
| ModelSim / XSIM |
Behavioral and timing simulation |
| iMPACT |
Device programming via JTAG |
| ChipScope Pro |
In-system logic analysis (ILA) |
| VHDL / Verilog / SystemVerilog |
Supported HDL languages |
For current-generation Xilinx FPGA families with Vivado support, see our full Xilinx FPGA catalog.
Ordering Information & Part Number Variants
The XC2S200 is available in multiple package and speed grade combinations. Below are key variants of the same core device:
| Part Number |
Speed Grade |
Package |
Pins |
Temp Range |
Pb-Free |
| XC2S200-6FGG1150C |
-6 |
FBGA |
1150 |
Commercial |
Yes |
| XC2S200-6FGG456C |
-6 |
FBGA |
456 |
Commercial |
Yes |
| XC2S200-6FG456C |
-6 |
FBGA |
456 |
Commercial |
No |
| XC2S200-6FG256C |
-6 |
FBGA |
256 |
Commercial |
No |
| XC2S200-5FGG456C |
-5 |
FBGA |
456 |
Commercial |
Yes |
| XC2S200-5FGG456I |
-5 |
FBGA |
456 |
Industrial |
Yes |
| XC2S200-6PQ208C |
-6 |
PQFP |
208 |
Commercial |
No |
For 284 user I/O pins and maximum pin density, the FGG1150 package is the optimal choice — enabling the highest connectivity among all XC2S200 package options.
Frequently Asked Questions (FAQ)
What is the XC2S200-6FGG1150C used for?
The XC2S200-6FGG1150C is a 200K-gate Xilinx Spartan-II FPGA used in communications, industrial control, consumer electronics, medical devices, and test equipment. Its 1,150-pin BGA package and 284 user I/Os make it ideal for high pin-count system designs.
What is the core voltage of the XC2S200-6FGG1150C?
The core operating voltage (VCCINT) is 2.5V, consistent across the entire Spartan-II family.
Is the XC2S200-6FGG1150C RoHS compliant?
Yes. The “GG” designation in the package code (FGG1150) indicates a Pb-free, RoHS-compliant package.
What is the maximum clock frequency?
The XC2S200 at speed grade -6 supports system clock frequencies up to 263 MHz.
What software do I use to program the XC2S200-6FGG1150C?
Use Xilinx ISE Design Suite for synthesis, place-and-route, and bitstream generation. Programming is done via iMPACT using a JTAG cable or via serial/parallel PROM.
Can the XC2S200-6FGG1150C be reprogrammed in the field?
Yes. Like all SRAM-based FPGAs, it is fully reconfigurable. New bitstreams can be loaded at power-up via JTAG or from an external configuration PROM.
What is the difference between the -5 and -6 speed grades?
The -6 speed grade offers faster timing performance (lower propagation delays, higher max frequency) than the -5. Importantly, the -6 grade is only available in the commercial temperature range (0°C to +85°C).
Summary: XC2S200-6FGG1150C at a Glance
| Attribute |
Value |
| Manufacturer |
Xilinx (AMD) |
| Family |
Spartan-II |
| Part Number |
XC2S200-6FGG1150C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| User I/O |
284 |
| Block RAM |
56K bits |
| Distributed RAM |
75,264 bits |
| Speed Grade |
-6 (Commercial only) |
| Max Frequency |
263 MHz |
| Core Voltage |
2.5V |
| Package |
1,150-pin FBGA (Pb-Free) |
| Temperature Range |
0°C to +85°C (Commercial) |
| Configuration |
JTAG, Serial, Parallel, SelectMAP |
| Design Tools |
Xilinx ISE Design Suite |