The XC3S4000-4FGG1156C is a high-performance, cost-optimized Xilinx FPGA from the Spartan-3 family. Designed for high-volume, logic-intensive applications, this device delivers 4 million system gates, 1,156-ball Fine-Pitch Ball Grid Array (FBGA) packaging, and a –4 speed grade — making it an industry-preferred choice for embedded systems, communications, and consumer electronics.
What Is the XC3S4000-4FGG1156C?
The XC3S4000-4FGG1156C is part of AMD Xilinx’s Spartan-3 FPGA series, engineered to meet demanding performance requirements at a competitive price point. The device number breaks down as follows:
| Code Segment |
Meaning |
| XC3S |
Spartan-3 Family |
| 4000 |
4,000,000 System Gates |
| -4 |
Speed Grade (–4, fastest in series) |
| FGG |
Fine-Pitch Ball Grid Array Package |
| 1156 |
1,156 Total Package Balls |
| C |
Commercial Temperature Range (0°C to +85°C) |
XC3S4000-4FGG1156C Key Specifications
General Device Information
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Series |
Spartan-3 |
| Part Number |
XC3S4000-4FGG1156C |
| Package Type |
FBGA (Fine-Pitch BGA) |
| Ball Count |
1,156 |
| Operating Temperature |
0°C ~ 85°C (Commercial) |
| Supply Voltage (VCC) |
1.2V |
| I/O Voltage |
1.2V ~ 3.3V |
| RoHS Status |
RoHS Compliant |
Logic & Configuration Resources
| Resource |
Quantity |
| System Gates |
4,000,000 |
| Logic Cells |
62,208 |
| CLBs (Configurable Logic Blocks) |
3,888 |
| Slices per CLB |
4 |
| Total Slices |
15,552 (est.) |
| Flip-Flops |
62,208 |
| 4-input LUTs |
62,208 |
| Maximum Distributed RAM |
520 Kb |
Memory & DSP Resources
| Resource |
Quantity |
| Block RAM (BRAM) |
96 × 18Kb |
| Total Block RAM |
1,728 Kb |
| Dedicated Multipliers (18×18) |
96 |
| Digital Clock Managers (DCMs) |
4 |
I/O & Connectivity
| Parameter |
Value |
| User I/O (Max) |
712 |
| I/O Standards Supported |
LVCMOS, LVTTL, SSTL, HSTL, LVDS, PCI, GTL+ |
| Differential I/O Pairs |
348 |
| Single-Ended I/O |
16 |
| Speed Grade |
–4 (Fastest) |
XC3S4000-4FGG1156C Package & Physical Dimensions
Package Details
| Attribute |
Value |
| Package Code |
FGG1156 |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Balls |
1,156 |
| Pitch |
1.0 mm |
| Body Size |
35mm × 35mm |
| Ball Matrix |
34 × 34 |
| Height (Seated) |
2.55 mm (max) |
| Lead Finish |
Pb-Free (RoHS) |
| MSL (Moisture Sensitivity Level) |
MSL 3 |
PCB Design Recommendations
For reliable PCB assembly with the XC3S4000-4FGG1156C, consider the following layout guidelines:
- Via Type: Use via-in-pad or micro-vias for fine-pitch BGA routing
- Layer Count: Minimum 8-layer PCB recommended for signal integrity
- Decoupling Caps: Place 100 nF ceramic capacitors per power pin, as close to the BGA as possible
- Power Planes: Dedicate planes to VCC (1.2V) and VCCAUX (2.5V) for clean power delivery
- IBIS Models: Use AMD Xilinx IBIS models for signal integrity simulation
XC3S4000-4FGG1156C vs. Comparable Spartan-3 Devices
| Part Number |
System Gates |
Package |
I/O Pins |
BRAMs |
Speed Grade |
| XC3S400-4FG456C |
400,000 |
FG456 |
264 |
16 × 18Kb |
–4 |
| XC3S1000-4FG456C |
1,000,000 |
FG456 |
391 |
24 × 18Kb |
–4 |
| XC3S2000-4FG900C |
2,000,000 |
FG900 |
565 |
56 × 18Kb |
–4 |
| XC3S4000-4FGG1156C |
4,000,000 |
FGG1156 |
712 |
96 × 18Kb |
–4 |
| XC3S5000-4FGG1156C |
5,000,000 |
FGG1156 |
784 |
104 × 18Kb |
–4 |
The XC3S4000-4FGG1156C is the optimal choice for designs requiring more than 2M gates but not needing the premium cost of the XC3S5000. It provides 96 block RAMs and 712 user I/Os, making it highly versatile.
Top Use Cases for the XC3S4000-4FGG1156C
H3: Industrial & Embedded Control Systems
The large logic capacity and robust I/O bank support make this FPGA ideal for motor control, PLC replacements, and industrial automation, where deterministic timing and parallel processing are critical.
H3: High-Speed Communications & Networking
With support for LVDS, HSTL, and other high-speed I/O standards, the XC3S4000-4FGG1156C handles multi-channel serial interfaces, Ethernet MAC implementations, and protocol bridging.
H3: Digital Signal Processing (DSP)
The 96 dedicated 18×18 multipliers and large distributed RAM make this device well-suited for FIR/IIR filtering, FFT processing, and audio/video pipelines.
H3: Military, Aerospace & Defense (COTS)
Though rated for commercial temperature, the XC3S4000 architecture is widely used in COTS designs for radar pre-processing, image acquisition, and data acquisition systems.
H3: ASIC Prototyping
The XC3S4000-4FGG1156C’s gate capacity allows full prototyping of mid-size ASICs, reducing time-to-market and design risk before tape-out.
Programming & Configuration
Configuration Modes Supported
| Mode |
Description |
| Master Serial |
FPGA drives configuration clock, reads from SPI Flash |
| Slave Serial |
External device drives clock and data |
| Master Parallel (SelectMAP) |
Fast parallel byte-wide configuration |
| Slave Parallel (SelectMAP) |
Processor-controlled fast configuration |
| JTAG |
Boundary scan and in-circuit programming |
| Master SPI |
Boot from standard SPI Flash devices |
Recommended Configuration Devices
| Flash Device |
Interface |
Capacity |
| Xilinx XCF08P |
Platform Flash |
8 Mb |
| Xilinx XCF16P |
Platform Flash |
16 Mb |
| Winbond W25Q128 |
SPI Flash |
128 Mb |
Bitstream Size: The XC3S4000 requires approximately 11.9 Mb for a full configuration bitstream.
Power Consumption & Thermal Characteristics
Power Supply Requirements
| Supply |
Voltage |
Function |
| VCCINT |
1.2V |
Core logic power |
| VCCAUX |
2.5V |
Auxiliary logic & DCMs |
| VCCO (Bank-specific) |
1.2V – 3.3V |
I/O bank voltage |
Thermal Data
| Parameter |
Value |
| Junction-to-Ambient (θJA) |
7.9°C/W (still air) |
| Junction-to-Board (θJB) |
~3.0°C/W |
| Max Junction Temperature |
125°C |
| Operating Temp (Commercial) |
0°C to +85°C |
Thermal Tip: For high-utilization designs (>70% logic usage), attach a heatspreader to the top of the BGA package and ensure adequate airflow across the PCB.
Ordering & Availability Information
Part Number Variants
| Part Number |
Speed Grade |
Temp Range |
Package |
Status |
| XC3S4000-4FGG1156C |
–4 (Fastest) |
Commercial |
FGG1156 |
Active |
| XC3S4000-5FGG1156C |
–5 |
Commercial |
FGG1156 |
Active |
| XC3S4000-4FGG1156I |
–4 |
Industrial |
FGG1156 |
Active |
Where to Buy
The XC3S4000-4FGG1156C is available through authorized distributors including Digi-Key, Mouser, Avnet, and Arrow Electronics. Always purchase from authorized sources to ensure authenticity, RoHS compliance, and manufacturer warranty.
⚠️ Caution: Counterfeit FPGAs are common in the secondary market. Verify lot traceability and request test reports when purchasing from non-authorized channels.
Development Tools & Ecosystem
AMD Xilinx Design Tools
| Tool |
Purpose |
| Vivado Design Suite |
Primary synthesis & implementation (not supported – use ISE) |
| ISE Design Suite 14.7 |
Official tool for Spartan-3 design (free download) |
| ChipScope Pro |
In-system debugging via JTAG |
| PlanAhead |
Advanced floorplanning |
| CORE Generator |
IP core generation (memory controllers, PCIe, etc.) |
Note: The Spartan-3 family is not supported by Vivado. Use ISE Design Suite 14.7, available as a free download from the AMD Xilinx website, for all design, simulation, and implementation tasks.
Supported HDL Languages
- VHDL
- Verilog / SystemVerilog (subset)
- Schematic Entry (ISE Schematic Editor)
- MATLAB/Simulink (via System Generator for DSP)
Frequently Asked Questions (FAQ)
Q: Is the XC3S4000-4FGG1156C still in production? A: Yes, as of current information, this device is still listed as active by AMD Xilinx, though lead times may vary. Check with distributors for current stock.
Q: What is the difference between FGG and FG packages? A: Both are fine-pitch BGA formats. The “FGG” designation typically indicates a slightly different ball array configuration from the standard “FG” variant — always verify the PCB footprint against the latest AMD Xilinx package files.
Q: Can the XC3S4000-4FGG1156C be used for image processing? A: Yes. With 96 block RAMs, 96 hardware multipliers, and 712 I/O pins, it is well-suited for video frame buffering, edge detection, and real-time image filtering pipelines.
Q: What is the bitstream encryption capability? A: The Spartan-3 family supports AES-128 bitstream encryption for IP protection, using a battery-backed or eFUSE key (device-dependent).
Q: Is the –4 speed grade the fastest available? A: In standard commercial parts, –4 is the fastest (lower number = slower in Xilinx notation). There is no –5 faster grade for this device family.
Summary
The XC3S4000-4FGG1156C delivers an exceptional combination of logic density (4M gates), memory resources (1,728 Kb BRAM), dedicated DSP multipliers (96×), and broad I/O flexibility (712 pins) in a proven 1,156-ball FBGA package. It remains a workhorse device for cost-sensitive, high-complexity designs in industrial, communications, and embedded computing markets.
Whether you are prototyping a new ASIC, designing a multi-channel data acquisition system, or implementing a high-speed communications interface, the XC3S4000-4FGG1156C provides the resources, performance, and ecosystem support to bring your design to production confidently.
