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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1147C: Xilinx Spartan-II FPGA – Full Specifications & Buying Guide

Product Details

The XC2S200-6FGG1147C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. Built on advanced 0.18µm technology, this 200,000-gate FPGA delivers reliable programmable logic performance for a wide range of commercial and industrial applications. Whether you are designing telecommunications equipment, embedded control systems, or digital signal processing circuits, the XC2S200-6FGG1147C offers the logic density, I/O flexibility, and speed grade needed to bring your design to life.

In this guide, you will find a complete overview of the XC2S200-6FGG1147C including its technical specifications, key features, package details, applications, and ordering information — everything you need to make an informed purchasing decision.


What Is the XC2S200-6FGG1147C?

The XC2S200-6FGG1147C is a member of the Xilinx Spartan-II FPGA family, one of the most widely deployed cost-optimized FPGA product lines ever produced. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200,000 system gates
-6 Speed grade 6 (fastest commercially available grade)
FGG Fine-pitch Ball Grid Array (FBGA), Pb-free package
1147 1,147-pin package
C Commercial temperature range (0°C to +85°C)

The -6 speed grade is the highest performance tier available in the Spartan-II commercial range, and the FGG1147 package provides a very high pin count for designs requiring extensive I/O connectivity. This makes the XC2S200-6FGG1147C ideal for large, complex system designs where maximizing available I/O is a priority.

For a broader look at the full Xilinx Spartan product portfolio, visit Xilinx FPGA.


XC2S200-6FGG1147C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array (Rows × Columns) 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM Bits 75,264
Total Block RAM Bits 56K (56,000 bits)

Electrical & Performance Specifications

Parameter Value
Core Supply Voltage (VCCINT) 2.5V
I/O Supply Voltage (VCCO) 2.375V – 2.625V
Technology Node 0.18µm
Maximum Clock Frequency 263 MHz
Speed Grade -6 (Commercial only)
Operating Temperature Range 0°C to +85°C (Commercial)

Package Information

Parameter Value
Package Type FBGA (Fine-Pitch Ball Grid Array)
Package Code FGG1147
Pin Count 1,147
Lead-Free (Pb-Free) Yes (indicated by “G” suffix in FGG)
Mounting Type Surface Mount
RoHS Compliant Yes

XC2S200-6FGG1147C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1147C features a regular, flexible programmable architecture built around 1,176 Configurable Logic Blocks (CLBs). Each CLB contains look-up tables (LUTs), flip-flops, and carry logic that can be configured to implement virtually any combinatorial or sequential logic function. The 28×42 CLB array provides a dense and efficiently routable logic fabric.

Input/Output Blocks (IOBs)

Surrounding the CLB core is a perimeter of programmable Input/Output Blocks (IOBs). With up to 284 maximum user I/Os available, the XC2S200 provides extensive connectivity to external systems. IOBs support multiple I/O standards including LVCMOS, LVTTL, GTL, HSTL, and SSTL.

Block RAM

The XC2S200 includes two columns of block RAM located on opposite sides of the die, between the CLB columns and the IOB perimeter. These block RAM resources offer 56Kbits of dedicated synchronous memory, supporting dual-port operation for simultaneous read/write access.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) are integrated into the XC2S200 — one at each corner of the die. DLLs enable zero-delay clock distribution, phase shifting, and frequency synthesis, helping eliminate clock skew across the device and supporting high-speed synchronous design.

Configuration Modes

The XC2S200-6FGG1147C supports multiple configuration modes to accommodate various system architectures:

Configuration Mode CCLK Direction Data Width Serial DOUT
Master Serial Output 1-bit Yes
Slave Serial Input 1-bit Yes
Slave Parallel Input 8-bit No
Boundary-Scan (JTAG) N/A 1-bit No

Why Choose the XC2S200-6FGG1147C?

#### Speed Grade -6: Maximum Commercial Performance

The -6 speed grade is the highest speed grade available in the Spartan-II commercial temperature range. With a maximum system clock frequency of 263 MHz, this part is designed for time-critical applications where every nanosecond of propagation delay matters.

#### High Pin Count FGG1147 Package

The 1,147-pin FBGA package gives designers access to the maximum available I/O resources of the XC2S200. This is especially beneficial for large data-bus designs, memory interfaces, and multi-channel signal routing applications that require extensive external connectivity.

#### ASIC Alternative with Reprogrammability

The Xilinx Spartan-II XC2S200 was designed from the ground up as a cost-effective alternative to mask-programmed ASICs. Unlike ASICs, the XC2S200-6FGG1147C eliminates non-recurring engineering (NRE) costs, avoids lengthy ASIC development cycles, and supports in-field reprogramming — allowing design updates without any hardware replacement.

#### Pb-Free and RoHS Compliant

The “G” character in the FGG package code confirms that this component is packaged in a lead-free (Pb-free) configuration, meeting international RoHS environmental compliance directives. This makes it suitable for modern product designs that must adhere to environmental regulations in Europe, Asia, and North America.


XC2S200-6FGG1147C vs. Other XC2S200 Variants

The XC2S200 logic core is available in multiple package and speed grade combinations. The table below compares the FGG1147 variant with other common options:

Part Number Speed Grade Package Pin Count Pb-Free Temperature
XC2S200-6FGG1147C -6 FBGA 1,147 Yes Commercial
XC2S200-6FGG456C -6 FBGA 456 Yes Commercial
XC2S200-6FG256C -6 FBGA 256 No Commercial
XC2S200-5FG456C -5 FBGA 456 No Commercial
XC2S200-5PQ208I -5 QFP 208 No Industrial

The XC2S200-6FGG1147C stands out for offering the highest pin count and fastest speed grade in a lead-free package — the optimal choice when I/O density and performance are both priorities.


XC2S200-6FGG1147C Applications

The XC2S200-6FGG1147C is well-suited for a broad range of commercial and industrial applications:

#### Networking & Telecommunications

  • High-speed packet switching and routing logic
  • Protocol bridging (Ethernet, SONET, ATM)
  • Wireless base station signal processing
  • Line-rate data encoding and decoding

#### Digital Signal Processing (DSP)

  • Audio and video processing pipelines
  • Filter implementation (FIR, IIR)
  • FFT/IFFT accelerators
  • Image processing and compression

#### Embedded Control Systems

  • Custom state machine controllers
  • Motor drive control
  • Industrial automation interfaces
  • PLC logic replacement

#### High-Performance Computing

  • Hardware accelerators for data centers
  • Memory interface controllers
  • FPGA-based co-processing boards
  • Prototype platform for ASIC development

#### Aerospace & Defense (with appropriate screening)

  • Signal intelligence (SIGINT) processing
  • Radar and sonar signal chains
  • Secure communications hardware
  • Avionics bus interface controllers

Spartan-II Family Comparison Table

Device Logic Cells System Gates CLB Array Max I/O Dist. RAM Block RAM
XC2S15 432 15,000 8×12 86 6,144 16K
XC2S30 972 30,000 12×18 92 13,824 24K
XC2S50 1,728 50,000 16×24 176 24,576 32K
XC2S100 2,700 100,000 20×30 176 38,400 40K
XC2S150 3,888 150,000 24×36 260 55,296 48K
XC2S200 5,292 200,000 28×42 284 75,264 56K

The XC2S200 is the largest device in the Spartan-II family, delivering the most logic cells, I/O, and memory resources of any device in the series.


Ordering Information & Part Number Decoder

When ordering Spartan-II devices, it is important to understand the full part number structure to ensure you receive the correct component:

XC2S200 - 6 - FGG - 1147 - C
   |       |    |      |     |
Device   Speed Package Pins  Temp
  Type   Grade  Type        Range
Field Options Description
Device XC2S15 to XC2S200 Logic density (gates)
Speed Grade -4, -5, -6 Higher number = faster
Package PQ, FG, FGG FGG = Pb-free FBGA
Pin Count 208, 256, 456, 1147 Total package pins
Temperature C = Commercial, I = Industrial Operating temp range

Note: The -6 speed grade is exclusively available in the Commercial (C) temperature range. Industrial temperature range (-40°C to +100°C) devices are only offered in -4 and -5 speed grades.


Design & Development Tools

The XC2S200-6FGG1147C is supported by Xilinx (now AMD) design tools. While the Spartan-II family predates Vivado, it is supported by the Xilinx ISE Design Suite, which includes:

  • ISE Project Navigator – RTL design entry and synthesis
  • CORE Generator – Pre-built IP core instantiation
  • ChipScope Pro – On-chip logic analyzer for debug
  • iMPACT – Configuration file download and JTAG programming

Summary: XC2S200-6FGG1147C at a Glance

Attribute Value
Manufacturer Xilinx (AMD)
Series Spartan-II
Part Number XC2S200-6FGG1147C
System Gates 200,000
Logic Cells 5,292
Max Clock 263 MHz
Package FBGA-1147 (Pb-Free)
Core Voltage 2.5V
User I/O 284
Block RAM 56Kbits
Temp Range 0°C to +85°C (Commercial)
RoHS Compliant
Status Obsolete (Legacy)

Frequently Asked Questions (FAQ)

Q: Is the XC2S200-6FGG1147C still in production? The Spartan-II family, including the XC2S200, has been declared obsolete and is no longer manufactured by Xilinx/AMD. However, authorized distributors and component brokers may carry existing inventory.

Q: What is the difference between FG and FGG packages? The “G” in FGG indicates a Pb-free (lead-free) packaging option. The FG package uses standard tin-lead solder, while FGG is the RoHS-compliant, lead-free equivalent.

Q: Can the XC2S200-6FGG1147C be reconfigured in-system? Yes. Like all Spartan-II FPGAs, the XC2S200-6FGG1147C supports in-system reconfiguration. The device can be reprogrammed via its configuration pins (Master Serial, Slave Serial, Slave Parallel, or JTAG Boundary-Scan modes) without any hardware changes.

Q: What is the configuration bitstream size for the XC2S200? The XC2S200 requires approximately 1,335,840 configuration bits to fully program the device.

Q: What are good substitute parts for the XC2S200-6FGG1147C? For new designs, Xilinx Spartan-3 or Spartan-6 family parts offer improved logic density, lower power consumption, and more modern tool support. The XC3S400 or XC3S1000 are commonly considered functional successors.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.