The XC3S4000-5FGG900C is a high-capacity, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-3 family. Designed for high-volume, performance-sensitive applications, this device combines 4 million system gates, 62,208 logic cells, and a 900-pin Fine-Pitch Ball Grid Array (FBGA) package — making it a go-to solution for engineers working in consumer electronics, broadband, industrial control, and embedded systems.
Whether you’re looking for the XC3S4000-5FGG900C datasheet, comparing it with alternative Spartan-3 devices, or ready to buy, this guide covers everything you need to know.
What Is the XC3S4000-5FGG900C?
The XC3S4000-5FGG900C is part of the Xilinx Spartan-3 FPGA family — an eight-member series ranging from 50K to 5M system gates. Built on 90nm process technology and operating at 1.2V core supply, it delivers robust logic density and I/O flexibility at a competitive price point. It is manufactured as a commercial-grade device (0°C to 85°C junction temperature) and packaged in a Tray format for volume production.
If you are evaluating Xilinx FPGA options for your next design, the XC3S4000-5FGG900C offers an excellent balance of gate density, memory, and I/O resources within the Spartan-3 platform.
XC3S4000-5FGG900C Key Specifications
## General Device Overview
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Part Number |
XC3S4000-5FGG900C |
| Family |
Spartan-3 |
| Series |
XC3S4000 |
| Process Technology |
90nm |
| System Gates |
4,000,000 (4M) |
| Logic Cells |
62,208 |
| Speed Grade |
-5 |
| Core Supply Voltage |
1.2V |
| Operating Voltage Range |
1.14V – 1.26V |
| Package |
900-Pin FBGA (Fine-Pitch BGA) |
| Mounting Type |
Surface Mount |
| Operating Temperature (TJ) |
0°C to 85°C (Commercial) |
| Packaging |
Tray |
| RoHS Status |
Not Compliant |
## Logic and Memory Resources
| Resource |
XC3S4000 Value |
| CLB Array Size |
96 × 72 |
| Total CLB Slices |
27,648 |
| Logic Cells |
62,208 |
| Maximum Distributed RAM |
432 Kbits |
| Total Block RAM |
1,728 Kbits (96 × 18Kbit blocks) |
| Dedicated 18×18 Multipliers |
96 |
| Digital Clock Managers (DCMs) |
4 |
| Global Clock Lines |
8 |
## I/O and Signaling Capabilities
| I/O Feature |
Detail |
| Total Package Pins |
900 |
| Maximum User I/O Pins |
712 |
| Single-Ended Signal Standards |
18 (including LVTTL, LVCMOS, HSTL, SSTL) |
| Differential Signal Standards |
8 (including LVDS, RSDS, LVPECL) |
| Double Data Rate (DDR) Support |
Yes |
| Digitally Controlled Impedance (DCI) |
Yes |
| JTAG Boundary Scan |
IEEE 1149.1 / 1532 compliant |
XC3S4000-5FGG900C Feature Highlights
### SelectIO™ Multi-Standard I/O
The XC3S4000-5FGG900C supports up to 712 user I/O pins and is compatible with 18 single-ended and 8 differential signaling standards. Differential pair support includes LVDS and RSDS, making the device suitable for high-speed data transmission interfaces. Double Data Rate (DDR) capability is available on all I/O banks.
### SelectRAM™ Hierarchical Memory Architecture
The device provides two tiers of on-chip memory:
- Block RAM: 96 dual-port 18Kbit RAM blocks = 1,728 Kbits total, each paired with a dedicated 18×18-bit hardware multiplier for efficient DSP operations.
- Distributed RAM: Up to 432 Kbits of logic-based RAM embedded across the CLB array for small, fast data storage.
### Digital Clock Manager (DCM)
Four on-chip DCMs enable advanced clock management:
- Clock skew elimination for synchronous designs
- Frequency synthesis — multiply or divide clock frequencies
- High-resolution phase shifting for fine-grained timing control
- Eight global clock lines ensure low-skew distribution across the entire device
### Dedicated 18×18 Hardware Multipliers
With 96 dedicated 18×18-bit multipliers, the XC3S4000-5FGG900C accelerates DSP-intensive tasks such as filtering, signal processing, and arithmetic-heavy control algorithms — without consuming CLB slice resources.
### JTAG Configuration and Boundary Scan
The device is fully IEEE 1149.1 and IEEE 1532 compliant, supporting in-system programming, boundary-scan testing, and integration into automated test equipment (ATE) environments.
XC3S4000-5FGG900C Ordering Information
## Part Number Decoder
| Code |
Meaning |
| XC |
Xilinx commercial silicon |
| 3S |
Spartan-3 family |
| 4000 |
4,000K system gates |
| -5 |
Speed grade (-4 = slowest, -6 = fastest) |
| FGG |
Fine-pitch Ball Grid Array, lead-free (G = Pb-free) |
| 900 |
900-pin package |
| C |
Commercial temperature range (0°C to 85°C) |
## Available Speed Grades for XC3S4000 (900-Pin Package)
| Part Number |
Speed Grade |
Temperature |
Package |
| XC3S4000-4FGG900C |
-4 |
Commercial |
900-FBGA |
| XC3S4000-5FGG900C |
-5 |
Commercial |
900-FBGA |
| XC3S4000-4FGG900I |
-4 |
Industrial |
900-FBGA |
XC3S4000-5FGG900C vs. Spartan-3 Family Comparison
| Device |
System Gates |
Logic Cells |
Block RAM |
Multipliers |
Max I/O (FGG900) |
| XC3S1000 |
1M |
17,280 |
432 Kbits |
24 |
391 |
| XC3S2000 |
2M |
33,280 |
720 Kbits |
40 |
565 |
| XC3S4000 |
4M |
62,208 |
1,728 Kbits |
96 |
712 |
| XC3S5000 |
5M |
74,880 |
1,872 Kbits |
104 |
784 |
The XC3S4000-5FGG900C sits near the top of the Spartan-3 lineup, offering significantly more logic, memory, and multiplier resources than the XC3S2000 while remaining more cost-effective than stepping up to the XC3S5000.
Typical Applications for XC3S4000-5FGG900C
The Xilinx Spartan-3 XC3S4000-5FGG900C is optimized for high-volume, cost-sensitive applications across a wide range of industries:
| Application Segment |
Use Cases |
| Broadband Communications |
DSL modems, cable head-end equipment, network switches |
| Consumer Electronics |
Digital TVs, set-top boxes, display and projection systems |
| Home Networking |
Routers, gateways, wireless access points |
| Industrial Control |
Motor drives, PLC interfaces, sensor fusion |
| Embedded Processing |
MicroBlaze soft-core processor implementations |
| Automotive Electronics |
Infotainment, ADAS prototyping (non-AEC-Q100 grade) |
| Digital Signal Processing |
FIR/IIR filters, FFT engines, image processing pipelines |
Why Choose the XC3S4000-5FGG900C?
### Cost-Effective High Density
The Spartan-3 family was designed specifically to challenge mask-programmed ASICs in high-volume, cost-driven markets. The XC3S4000-5FGG900C avoids the high NRE (Non-Recurring Engineering) costs, long production cycles, and irreversibility of ASICs — while delivering comparable gate density.
### In-Field Reprogrammability
Unlike ASICs, the XC3S4000-5FGG900C supports complete in-field reprogramming via JTAG or serial configuration interfaces. Design updates, bug fixes, or feature additions can be deployed without replacing hardware — a critical advantage for products in active deployment.
### Virtex-II-Derived Architecture
The Spartan-3 architecture incorporates enhancements derived from Xilinx’s Virtex-II platform, including dedicated multipliers, improved block RAM structures, and advanced DCM capabilities — bringing high-performance features into an accessible price tier.
### Broad I/O Standard Support
With 18 single-ended and 8 differential standards — including LVDS, HSTL, SSTL, and LVCMOS at various voltages — the XC3S4000-5FGG900C interfaces easily with DDR memory, high-speed serial links, and mixed-voltage systems.
Development Tools & Software Support
The XC3S4000-5FGG900C is supported by Xilinx ISE Design Suite, which provides:
- Synthesis, implementation, and place-and-route for Spartan-3 devices
- Simulation support via ISim
- IP core generation via CORE Generator™
- MicroBlaze embedded processor support
- ChipScope Pro for in-system debug
Note: The XC3S4000-5FGG900C is not supported in Vivado Design Suite, which targets 7-series and newer devices. ISE 14.7 remains the recommended tool for Spartan-3 design.
XC3S4000-5FGG900C Package and Physical Specifications
| Parameter |
Detail |
| Package Type |
FBGA (Fine-Pitch Ball Grid Array) |
| Pin Count |
900 |
| Ball Pitch |
1.0mm |
| Package Designation |
FGG900 |
| Mounting Method |
Surface Mount Technology (SMT) |
| ESD Sensitivity |
Electrostatic Discharge sensitive — handle with ESD precautions |
| Storage |
Anti-static bag recommended |
Frequently Asked Questions (FAQ)
Q: What is the difference between XC3S4000-5FGG900C and XC3S4000-4FGG900C? The only difference is the speed grade. The -5 variant runs at a higher maximum frequency than the -4 grade. Both share identical logic resources, I/O count, and package.
Q: Is the XC3S4000-5FGG900C RoHS compliant? No. The standard “FGG” package designation is not RoHS compliant. For lead-free (RoHS) compliance, look for the “FGG” Pb-free variant or confirm with your distributor.
Q: Can I use ISE or Vivado for the XC3S4000-5FGG900C? Only ISE Design Suite (up to version 14.7) supports Spartan-3 devices. Vivado does not support the Spartan-3 family.
Q: What configuration memory is recommended for this device? Xilinx recommends the XCF16P Platform Flash PROM for configuring the XC3S4000. It supports master serial and slave serial configuration modes.
Q: What is the maximum operating frequency? The XC3S4000-5FGG900C supports internal fabric operation and DCM-generated clocks up to 725MHz on internal logic paths, with actual system frequency depending on design complexity and routing.
Summary
The XC3S4000-5FGG900C is a proven, versatile FPGA that continues to see strong demand in legacy system maintenance, cost-optimized new designs, and ASIC prototyping workflows. With 4M system gates, 62,208 logic cells, 1,728 Kbits of block RAM, 96 dedicated multipliers, and 712 user I/Os in a compact 900-pin FBGA package, it delivers outstanding capability for the Spartan-3 tier.
For engineers sourcing Xilinx Spartan-3 devices for production or prototype quantities, the XC3S4000-5FGG900C remains a dependable and widely available choice.
