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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
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XC3S400-4FG320I: Xilinx Spartan-3 FPGA 400K Gates 320-Pin FBGA — Full Specifications & Buying Guide

Product Details

The XC3S400-4FG320I is a high-performance, cost-optimized Xilinx FPGA from the industry-proven Spartan-3 family. With 400,000 system gates, 8,064 logic cells, and a robust 320-pin Fine-pitch Ball Grid Array (FBGA) package, this device is engineered for demanding industrial and embedded applications that require reliable operation across an extended temperature range.


What Is the XC3S400-4FG320I?

The XC3S400-4FG320I is a Field Programmable Gate Array (FPGA) manufactured by AMD Xilinx, built on 90nm technology. The part number breaks down as follows:

Part Number Segment Meaning
XC3S Xilinx Spartan-3 Family
400 400,000 System Gates
-4 Speed Grade –4 (Standard Speed)
FG Fine-pitch Ball Grid Array (FBGA) Package
320 320 Pins
I Industrial Temperature Range (–40°C to +100°C)

This device is the industrial-grade variant of the XC3S400, making it the preferred choice for systems that must operate reliably under harsh environmental conditions.


XC3S400-4FG320I Key Specifications

Core Logic & Memory

Parameter Value
System Gates 400,000
Logic Cells 8,064
Configurable Logic Blocks (CLBs) 896
CLB Array Size 32 × 28
CLB Flip-Flops 7,168
Maximum Distributed RAM 56K bits
Block RAM (Total) 288K bits (294,912 bits)
Number of Block RAMs 16
Maximum User I/O 221

DSP & Clock Resources

Parameter Value
Dedicated Multipliers (18×18) 16
Digital Clock Managers (DCMs) 4
Maximum System Clock Frequency 630 MHz
DLL Frequency Range 25 – 326 MHz

Electrical & Physical Characteristics

Parameter Value
Core Voltage (VCCINT) 1.14V – 1.26V (nominal 1.2V)
I/O Voltage (VCCO) 1.2V / 1.5V / 1.8V / 2.5V / 3.3V
Technology Node 90nm
Package Type 320-Pin FBGA (Fine-pitch BGA)
Package Dimensions 19mm × 19mm
Ball Pitch 1.0mm
Mounting Type Surface Mount
Operating Temperature –40°C to +100°C (Industrial)

XC3S400-4FG320I Package & Ordering Information

Attribute Detail
Manufacturer AMD (Xilinx)
Part Number XC3S400-4FG320I
Manufacturer Series Spartan-3
Package / Case 320-FBGA (19×19)
Supplier Device Package 320-FBGA (19×19)
Base Part Number XC3S400
RoHS Status Compliant
Moisture Sensitivity Level (MSL) 3 (168-Hour Floor Life)

Functional Overview: How the XC3S400-4FG320I Works

#### Configurable Logic Blocks (CLBs)

The XC3S400-4FG320I contains 896 CLBs arranged in a 32×28 matrix. Each CLB consists of four logic slices, and every slice includes two 4-input Look-Up Tables (LUTs), two storage elements (flip-flops or latches), and dedicated carry logic. This architecture enables efficient implementation of arithmetic functions, state machines, and complex combinational logic.

#### Block RAM

Sixteen dedicated 18Kb Block RAM tiles provide a total of 288Kb of on-chip synchronous memory. Each block can be configured as a true dual-port memory, supporting independent read and write operations. This is ideal for FIFO buffers, look-up tables, and local data storage in embedded processor designs.

#### Digital Clock Manager (DCM)

The device includes four DCMs, each capable of clock multiplication, division, phase shifting, and deskewing. The DCM supports system frequencies from 25MHz to 326MHz, making it straightforward to generate multiple derived clocks from a single input reference — a critical feature for synchronous design and interface timing.

#### Dedicated 18×18 Multipliers

Sixteen dedicated hardware multipliers deliver high-throughput integer multiplication without consuming CLB resources. These are essential for digital signal processing (DSP) tasks such as filtering, correlation, and Fourier transforms in applications like motor control and communications.

#### SelectIO Technology

The 221 user I/Os support a wide range of single-ended and differential I/O standards, including LVCMOS, LVTTL, HSTL, SSTL, LVDS, RSDS, and PPDS. This flexibility allows the XC3S400-4FG320I to interface directly with processors, ADCs, DACs, memory devices, and communication controllers without external level shifters.


XC3S400-4FG320I vs. Related Spartan-3 Devices

Part Number Gates Logic Cells Block RAM I/Os (Max) Package Temp Grade
XC3S400-4FG320I 400K 8,064 288Kb 221 320-FBGA Industrial
XC3S400-4FG320C 400K 8,064 288Kb 221 320-FBGA Commercial
XC3S200-4FT256I 200K 4,320 216Kb 173 256-FBGA Industrial
XC3S1000-4FG320I 1,000K 17,280 432Kb 391 320-FBGA (456-pin alt) Industrial
XC3S1500-4FG320I 1,500K 29,952 576Kb 487 Higher pin-count Industrial

The XC3S400-4FG320I occupies the mid-range of the Spartan-3 family, offering a strong balance between logic density, memory, and I/O count at a competitive price point.


Target Applications

The XC3S400-4FG320I is well-suited for a broad range of embedded and industrial applications:

  • Industrial Control & Automation — Motor control, PLC co-processing, industrial Ethernet interfaces
  • Communications Equipment — Protocol bridging, UART/SPI/I2C controllers, line interfaces
  • Embedded Vision — Image preprocessing pipelines, edge detection, frame buffering
  • Test & Measurement — Data acquisition front ends, pattern generators, instrument control
  • Consumer Electronics — Digital TV signal processing, broadband access equipment, set-top box logic
  • Military & Defense — Sensor fusion, ruggedized control systems (industrial grade suits harsh environments)
  • Automotive — In-vehicle network gateways, driver assistance logic (–40°C rating is a key enabler)

Design Tool Support

The XC3S400-4FG320I is supported by the following Xilinx/AMD design environments:

Tool Version Notes
Xilinx ISE Design Suite 14.7 (final) Primary legacy tool for Spartan-3
Xilinx Vivado Not supported Vivado targets 7-series and newer
ModelSim / Questa All major versions RTL simulation
Synopsys Synplify Supported Third-party synthesis option
Mentor Precision Supported Third-party synthesis option
iMPACT Included in ISE Programming and boundary-scan

HDL design flows using VHDL and Verilog are fully supported. The device can be configured via JTAG or from external serial/parallel configuration PROMs such as the XCF02S.


Configuration & Programming

The XC3S400-4FG320I supports multiple configuration modes:

Mode Description
Master Serial From Xilinx Platform Flash PROM (e.g., XCF02S)
Slave Serial Driven by external microcontroller
Master SPI From standard SPI Flash memory
Master BPI From parallel NOR Flash
JTAG Boundary-scan and in-system programming

The recommended companion configuration device is the XCF02S (1.7M-bit Platform Flash), which stores the approximately 1.7Mbit bitstream required to configure the XC3S400.


Frequently Asked Questions

Q: What is the XC3S400-4FG320I used for? It is primarily used as a programmable logic device in industrial control, communications, embedded vision, and signal processing applications where extended temperature operation (–40°C to +100°C) is required.

Q: What is the difference between XC3S400-4FG320I and XC3S400-4FG320C? The suffix “I” denotes the industrial temperature grade (–40°C to +100°C), while “C” denotes the commercial grade (0°C to +85°C). All other electrical characteristics are identical.

Q: Is the XC3S400-4FG320I RoHS compliant? Yes, the device is RoHS compliant.

Q: What programming software does the XC3S400-4FG320I require? The Xilinx ISE Design Suite 14.7 is the standard tool chain. The iMPACT programmer within ISE handles device configuration via JTAG.

Q: What is the core voltage of the XC3S400-4FG320I? The internal core voltage (VCCINT) is nominally 1.2V, with an acceptable range of 1.14V to 1.26V.


Summary

The XC3S400-4FG320I delivers a proven, cost-effective FPGA solution with 400,000 system gates, 8,064 logic cells, 16 block RAMs, 16 hardware multipliers, and 221 user I/Os — all in a compact 320-pin FBGA package rated for industrial temperature operation. Its combination of logic density, dedicated DSP resources, flexible I/O standards, and robust –40°C to +100°C temperature range makes it a dependable choice for engineers designing industrial, communications, and embedded systems that demand both performance and long-term reliability.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.