The XC2S200-6FGG1146C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, a 1146-ball Fine Pitch BGA package, and a -6 speed grade, this device is engineered for engineers and designers who require maximum I/O density combined with powerful programmable logic in commercial-temperature applications. Whether you’re designing telecom systems, industrial controllers, or high-speed data interfaces, the XC2S200-6FGG1146C delivers a proven, flexible, and cost-effective solution.

What Is the XC2S200-6FGG1146C? Overview and Key Features

The XC2S200-6FGG1146C belongs to Xilinx’s Spartan-II family — a range of 2.5V FPGAs built on 0.18µm CMOS process technology. As the largest member of the Spartan-II lineup, the XC2S200 core offers up to 5,292 logic cells and 200,000 system gates, making it the go-to choice for complex digital designs that demand high logic density within a cost-constrained budget.

The “6” in the part number denotes the -6 speed grade — the fastest available in the Spartan-II family, exclusively offered in the commercial temperature range. The “FGG1146” designates the 1146-ball Fine Pitch Ball Grid Array (FBGA) package, which provides an exceptionally high I/O pin count for large-scale parallel interfaces and multi-bus designs.

Explore our full range of Xilinx FPGA solutions for more compatible parts and accessories.

Key Features at a Glance

• 200,000 system gates (logic + RAM)
• 5,292 configurable logic cells in a 28×42 CLB array
• 1,176 total CLBs arranged in a flexible routing matrix
• 284 maximum user I/O pins (in supported package configurations)
• 75,264 bits of distributed RAM
• 56K bits of dedicated block RAM (4× 14K-bit block RAMs)
• Four Delay-Locked Loops (DLLs) for precise clock management
• 2.5V core voltage with 5V-tolerant I/O options
• 0.18µm, 6-layer metal CMOS process technology
• -6 speed grade — fastest in the Spartan-II family
• Commercial temperature range: 0°C to +85°C
• JTAG boundary scan (IEEE 1149.1 compliant)

XC2S200-6FGG1146C Part Number Decoder

Understanding the part number helps engineers quickly identify the exact device variant needed for procurement and design:

Note: The “G” in “FGG” indicates a Pb-free (RoHS-compliant) package variant, distinguishing it from the standard “FG” package with conventional solder.

XC2S200-6FGG1146C Electrical and Timing Specifications

Absolute Maximum Ratings

DC Operating Conditions

Speed and Performance (–6 Speed Grade)

XC2S200 Logic Architecture: CLBs, IOBs, and Routing

Configurable Logic Blocks (CLBs)

The XC2S200’s logic fabric is organized in a 28-column × 42-row CLB array, totaling 1,176 CLBs. Each CLB contains two slices, and each slice contains:

• Two 4-input Look-Up Tables (LUTs) — usable as logic or 16-bit distributed RAM
• Two D-type flip-flops with optional clock enable
• Fast carry and arithmetic logic chains
• Wide-function multiplexers

This architecture provides the design flexibility needed for implementing complex state machines, DSP functions, arithmetic units, and memory interfaces.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1146C features programmable IOBs that support multiple I/O standards:

Each IOB includes programmable pull-up/pull-down resistors, a 3-state output buffer, and optional output slew rate control (fast/slow).

Block RAM

The XC2S200 includes four dedicated block RAM columns, each providing 14K bits of synchronous dual-port SRAM, for a total of 56K bits of block RAM. These memories support:

• Independent read/write port widths (1, 2, 4, 8, or 16 bits per port)
• Synchronous or asynchronous read operation
• Byte-wide write enables

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide:

• Zero-delay clock distribution
• Clock phase shifting (0°, 90°, 180°, 270°)
• Clock frequency synthesis (divide/multiply)
• Reduced clock skew across the entire device

XC2S200-6FGG1146C Package Information

1146-Ball Fine Pitch BGA (FGG1146)

The FGG1146 package is the largest available for the XC2S200 device, offering the highest I/O pin count. It is ideal for applications requiring dense multi-bus connectivity, such as network switching, video processing, and memory controllers.

Spartan-II Available Package Options for XC2S200

Spartan-II Family Comparison: Where Does the XC2S200 Stand?

The table below shows the full Spartan-II device family, illustrating how the XC2S200 compares to its siblings in terms of logic resources:

The XC2S200 sits at the top of the Spartan-II family with the most logic cells, the largest CLB array, the most distributed RAM, and the highest block RAM capacity of any device in the series.

XC2S200-6FGG1146C vs. Other XC2S200 Variants

Multiple ordering variants of the XC2S200 exist. Here is how the XC2S200-6FGG1146C compares to common alternatives:

The XC2S200-6FGG1146C is the highest I/O density variant of the XC2S200 at the -6 speed grade and is the natural choice when a design demands the maximum number of user I/O connections in a Pb-free BGA form factor.

Configuration and Programming: How to Program the XC2S200-6FGG1146C

 Supported Configuration Modes

The XC2S200 supports four configuration modes, selectable via the M0, M1, M2 mode pins:

Configuration Bitstream Size

The XC2S200 requires approximately 1,176,741 configuration bits to fully program the device. Configuration can be performed via:

• Xilinx XCF-series PROMs (Platform Flash or XC18V-series serial PROMs)
• External microcontroller or CPLD in slave serial/parallel modes
• JTAG chain for in-system programming and debug

Typical Applications for the XC2S200-6FGG1146C

The XC2S200-6FGG1146C’s combination of 200K gates, high I/O count, and -6 speed grade make it well-suited for the following application domains:

The large FGG1146 package is particularly advantageous in backplane interface applications where dozens of independent buses must be routed directly to the FPGA without external level-shifters.

Design Tools and Software Support

The XC2S200-6FGG1146C is supported by the following Xilinx / AMD EDA tools:

Important: The Spartan-II family is supported in ISE Design Suite up to version 14.7. It is not supported in the newer Vivado Design Suite. Designers using current AMD toolchains should note this legacy software requirement.

Ordering and Procurement Guide

 How to Read the Ordering Code

XC2S200   -6   FGG   1146   C
   |        |    |     |     |
Device  Speed Package Pins  Temp

Availability and Sourcing

The XC2S200-6FGG1146C is a legacy component in the Spartan-II series. When sourcing this part, buyers should:

• Verify manufacturer authenticity — purchase from authorized distributors or reputable franchised channels
• Check date codes — confirm components are within acceptable storage life
• Request test reports for industrial or mission-critical use cases
• Confirm RoHS compliance — the “G” suffix confirms Pb-free packaging

Frequently Asked Questions (FAQ)

What is the maximum operating frequency of the XC2S200-6FGG1146C?

The -6 speed grade delivers a maximum system frequency of 263 MHz, making it the fastest configuration of the XC2S200 device.

 Is the XC2S200-6FGG1146C RoHS compliant?

Yes. The “G” in “FGG” indicates a Pb-free, RoHS-compliant package using lead-free solder balls.

What temperature range does this device support?

The XC2S200-6FGG1146C is rated for the commercial temperature range: 0°C to +85°C. Note that the -6 speed grade is exclusively available in the commercial temperature range; industrial (-40°C to +85°C) variants use lower speed grades.

Can the XC2S200-6FGG1146C be programmed with Vivado?

No. The Spartan-II family is only supported by the Xilinx ISE Design Suite (up to version 14.7). Vivado does not support Spartan-II devices.

What is the difference between FG1146 and FGG1146 packages?

The “FGG” package suffix indicates Pb-free (lead-free) solder balls, while “FG” uses standard tin-lead solder. Both have the same physical footprint and pin count.

What configuration PROMs are compatible?

Xilinx XCF-series Platform Flash PROMs and XC18V-series serial configuration PROMs are fully compatible with the XC2S200-6FGG1146C in master serial mode.

Summary: Why Choose the XC2S200-6FGG1146C?

The XC2S200-6FGG1146C is the flagship device of the Spartan-II family — combining the largest logic capacity, maximum I/O count, fastest speed grade, and Pb-free packaging in a single part number. It is the ideal solution for legacy system maintenance, high-density interface designs, and cost-sensitive programmable logic applications where a proven 0.18µm CMOS FPGA platform is required.