The XC2S200-6FGG1143C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a massive 1,143-ball Fine-Pitch Ball Grid Array (FBGA) package, this device is engineered for engineers and designers who need maximum I/O density, fast clock speeds, and flexible in-field reprogrammability — all at a competitive price point.

Whether you are designing communications equipment, industrial control systems, medical devices, or high-speed data processing platforms, the XC2S200-6FGG1143C delivers the logic capacity and I/O flexibility to meet demanding requirements. For a broader overview of the Xilinx product lineup, explore our full range of Xilinx FPGA solutions.

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What Is the XC2S200-6FGG1143C? A Xilinx Spartan-II FPGA Overview

The XC2S200-6FGG1143C is part of the Xilinx Spartan-II FPGA family — a 2.5V, low-cost FPGA series built on a 0.18µm process technology. The Spartan-II family was designed as a superior programmable alternative to mask-programmed ASICs, eliminating high NRE (non-recurring engineering) costs and allowing designers to update logic in the field without swapping out hardware.

Key Differentiators of the XC2S200-6FGG1143C

• Part Number Breakdown: XC2S200 (device) | -6 (speed grade) | FGG (Fine-pitch Ball Grid Array, Pb-free) | 1143 (pin count) | C (Commercial temperature range)
• Speed Grade -6: The fastest available speed grade for this device family, exclusively available in the Commercial temperature range (0°C to 85°C)
• FGG Package (Pb-free): The double “G” in “FGG” designates a RoHS-compliant, lead-free packaging option — ideal for modern, environmentally-conscious designs
• 1,143 Pins: Provides the highest I/O availability in the XC2S200 package lineup, making it suitable for designs requiring extensive external interfacing

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XC2S200-6FGG1143C Full Technical Specifications

Core Logic and Memory Specifications

Package and Physical Specifications

Electrical Characteristics

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XC2S200-6FGG1143C Architecture and Internal Features

## Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1143C contains 1,176 CLBs arranged in a 28×42 grid. Each CLB consists of two slices, and each slice contains:

• Two 4-input Look-Up Tables (LUTs) for combinational logic
• Two storage elements (flip-flops or latches)
• Dedicated carry logic for fast arithmetic
• Wide function multiplexers

This architecture allows engineers to implement complex state machines, arithmetic units, data paths, and control logic efficiently within a single device.

## Block RAM (BRAM) Architecture

The XC2S200 contains 56K bits of dedicated block RAM (57,344 bits), organized in two columns of block RAM that run along opposite sides of the die — positioned between the CLB array and the IOB columns. Each block RAM can be configured as:

• 16K × 1, 8K × 2, 4K × 4, 2K × 9, 1K × 18 (true dual-port)
• Read and write operations can occur independently and simultaneously

This makes the BRAM ideal for FIFOs, data buffers, lookup tables, and embedded memories in signal processing designs.

## Input/Output Blocks (IOBs) and MultiVolt I/O

The XC2S200-6FGG1143C supports a MultiVolt I/O interface, meaning different I/O banks can be configured to operate at different voltages simultaneously (1.5V to 3.3V). Supported I/O standards include:

• LVTTL (3.3V)
• LVCMOS (1.8V, 2.5V, 3.3V)
• SSTL2, SSTL3 (for SDRAM/DDRRAM interfacing)
• GTL, GTL+
• HSTL (for high-speed bus applications)
• PCI (3.3V, 33/66 MHz)
• AGP (1×, 2×)

## Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs), one at each corner of the die, provide:

• Clock deskew and alignment
• Frequency synthesis (multiply and divide)
• Phase shifting for high-speed source-synchronous interfaces
• Elimination of clock distribution delay

## Configuration Interface

The XC2S200-6FGG1143C supports multiple configuration modes:

• Master Serial (via Xilinx serial PROM)
• Slave Serial
• Master Parallel Up / Down
• Slave Parallel (SelectMAP)
• JTAG Boundary Scan (IEEE 1149.1)

Configuration data is stored in SRAM-based cells, meaning the device is reprogrammed each power-up cycle from an external storage source (flash PROM, microprocessor, etc.).

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XC2S200 Spartan-II Family Comparison Table

The table below compares the XC2S200 with other members of the Spartan-II FPGA family to help you select the right device for your application:

The XC2S200 is the largest device in the Spartan-II family, offering the maximum gate count, logic cell density, I/O count, and memory resources — making the XC2S200-6FGG1143C the premium choice within this family.

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XC2S200-6FGG1143C Package Variants Comparison

Understanding the differences between available XC2S200 packages helps you choose the right variant for your PCB layout and I/O requirements:

Note: The XC2S200-6FGG1143C features the largest pin-count package available for this device, maximizing available I/O routing options and PCB design flexibility. The “GG” suffix confirms this is the RoHS-compliant lead-free version.

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Applications: Where Is the XC2S200-6FGG1143C Used?

The XC2S200-6FGG1143C is a versatile, high-density FPGA suited for a wide range of application domains:

Communications and Networking

• Protocol implementation (Ethernet, UART, SPI, I2C, CAN)
• Network switches, routers, and packet processors
• Line cards and interface bridging

 Industrial Automation and Control

• Motor control and drive systems
• PLC (Programmable Logic Controller) replacement
• Machine vision and sensor data acquisition
• Process control and real-time monitoring

 Medical Electronics

• Imaging equipment (X-ray, MRI, ultrasound signal processing)
• Patient monitoring systems
• Diagnostic instruments requiring high reliability

Military and Aerospace

• Ruggedized signal processing platforms
• Radar and sonar data acquisition systems
• Embedded computing in defense electronics

Consumer and Embedded Systems

• Set-top boxes and digital TV decoders
• Video processing and display controllers
• Embedded CPU co-processing

 High-Performance Computing

• Accelerator cards for AI/ML inference
• Data center preprocessing workloads
• Custom instruction-set processors

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Advantages of the XC2S200-6FGG1143C Over Traditional ASICs

The Spartan-II FPGA series — and the XC2S200-6FGG1143C specifically — was designed as a direct, cost-effective alternative to mask-programmed ASICs, particularly for high-volume applications where flexibility and fast development cycles are priorities.

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Design Tools and Software Support for XC2S200-6FGG1143C

Xilinx (now AMD) provides the following design and programming tools compatible with the XC2S200-6FGG1143C:

• ISE Design Suite — Legacy toolchain fully supporting the Spartan-II family. Includes synthesis, implementation, simulation, and JTAG programming
• iMPACT — Configuration and boundary-scan tool for programming via JTAG
• ChipScope Pro — On-chip logic analyzer for real-time debugging
• ModelSim / ISIM — HDL simulation environments for behavioral and post-place-and-route verification

HDL design entry is supported in both VHDL and Verilog. Schematic entry is also available through ISE.

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Ordering Information and Part Number Decoder

The XC2S200-6FGG1143C follows the standard Xilinx part numbering convention:

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Frequently Asked Questions (FAQ) About the XC2S200-6FGG1143C

What is the maximum clock frequency of the XC2S200-6FGG1143C?

The XC2S200-6FGG1143C is rated at up to 263 MHz maximum operating frequency, with pin-to-pin data path delays as low as 5ns depending on the specific logic path and implementation.

 Is the XC2S200-6FGG1143C RoHS compliant?

Yes. The double “G” in the package designator (FGG) indicates this is the Pb-free, RoHS-compliant variant of the XC2S200 in the 1143-ball FBGA package.

What temperature range does the XC2S200-6FGG1143C support?

The “C” suffix designates the Commercial temperature range: 0°C to +85°C. Industrial-range variants (–40°C to +85°C) carry an “I” suffix. Note that the -6 speed grade is exclusively available in the Commercial temperature range.

What configuration modes are supported?

The device supports Master Serial, Slave Serial, SelectMAP (Slave Parallel), Master Parallel Up/Down, and JTAG (IEEE 1149.1) boundary scan configuration modes.

Is the XC2S200-6FGG1143C still in production?

The Spartan-II family has been classified as mature/end-of-life by AMD Xilinx. Inventory may still be available through authorized distributors and component brokers. For new designs, AMD recommends migrating to the Spartan-6, Spartan-7, or Artix-7 families.

 What is the difference between XC2S200-6FGG1143C and XC2S200-6FGG456C?

The primary difference is the package pin count: the FGG1143 package has 1,143 pins versus 456 pins in the FGG456, providing significantly more PCB routing flexibility and I/O access while housing the same core XC2S200 silicon.

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Summary: Why Choose the XC2S200-6FGG1143C?

The XC2S200-6FGG1143C offers the perfect combination of logic density, I/O flexibility, speed, and RoHS compliance for legacy and new designs requiring the Spartan-II feature set. With 200,000 system gates, 5,292 logic cells, 56K bits of block RAM, and the highest pin count in the XC2S200 package lineup — all in a lead-free BGA package — this FPGA is a robust choice for engineers designing high-density, high-reliability digital systems.

Its support for MultiVolt I/O, on-chip DLLs, flexible configuration modes, and broad I/O standard compatibility makes it an adaptable platform across communications, industrial, medical, and defense applications.