The XC2S200-6FGG1142C is a high-density, 2.5V Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Combining 200,000 system gates, 5,292 logic cells, and a large 1142-ball Fine Pitch BGA (FBGA) package, this device delivers robust programmable logic performance at a competitive price point. Whether you are prototyping a communications interface, developing embedded control systems, or replacing a mask-programmed ASIC, the XC2S200-6FGG1142C offers the flexibility, density, and speed to meet your design requirements.

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What Is the XC2S200-6FGG1142C? Part Number Breakdown

Understanding the part number helps engineers quickly identify the exact variant they need:

Note: The “-6” speed grade is exclusively available in the Commercial temperature range, making the XC2S200-6FGG1142C ideal for benign operating environments such as rack-mount equipment, desktop systems, and lab instrumentation.

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XC2S200-6FGG1142C Key Specifications at a Glance

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XC2S200-6FGG1142C Architecture & Internal Features

## Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1142C is built around a 28×42 array of Configurable Logic Blocks, totaling 1,176 CLBs. Each CLB contains look-up tables (LUTs), flip-flops, and carry logic, providing the building blocks for arithmetic functions, state machines, and complex combinational logic. This makes the device suitable for medium-to-large digital designs without resorting to gate-array ASICs.

## Input/Output Blocks (IOBs) & I/O Standards

With up to 284 user-accessible I/O pins (not including the four dedicated global clock inputs), the XC2S200-6FGG1142C supports a wide variety of I/O standards:

This broad I/O compatibility makes the XC2S200-6FGG1142C an excellent interface bridge in mixed-voltage systems.

## Delay-Locked Loops (DLLs)

The device includes four Delay-Locked Loops (DLLs), one at each corner of the die. These DLLs enable precise clock management — including clock multiplication, division, phase shifting, and duty-cycle correction — which is critical for high-speed synchronous designs.

## Block RAM & Distributed RAM

Memory resources on the XC2S200-6FGG1142C are generous for a Spartan-II device:

• 75,264 bits of Distributed RAM — embedded within the CLB fabric for fast, single-cycle access
• 56K bits of dedicated Block RAM — organized in two columns on opposite sides of the die, ideal for FIFOs, lookup tables, and data buffering

## Configuration & Boundary Scan

The XC2S200-6FGG1142C supports multiple configuration modes (Master Serial, Slave Serial, SelectMAP, JTAG) and full IEEE 1149.1 Boundary Scan (JTAG) compliance, simplifying board-level testing and in-circuit debugging.

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XC2S200-6FGG1142C Package Information: FGG1142

The FGG1142 package is a Fine Pitch Ball Grid Array with 1,142 solder balls in a Pb-Free (RoHS) configuration. The extra “G” in “FGG” designates the lead-free variant. Compared to smaller packages like the FG456 or PQ208, the FGG1142 provides:

• Higher pin-count access to all available I/Os
• Better thermal distribution across a larger PCB footprint
• Suitability for high-density, high-interconnect PCB designs

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Spartan-II XC2S200 vs. Other Family Members

To help engineers choose the right device density for their project, here is a comparison of the full Spartan-II family:

The XC2S200 is the largest and most capable device in the Spartan-II family, making it the right choice when your design demands maximum logic density, I/O count, or on-chip memory within this product line.

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Typical Applications for the XC2S200-6FGG1142C

The XC2S200-6FGG1142C is widely deployed across industries where programmable logic must balance cost, performance, and flexibility:

• Communications equipment — Protocol bridging, line cards, and interface controllers
• Industrial control systems — Motor control, sensor fusion, and PLC logic replacement
• Consumer electronics — Set-top box control logic and video processing pipelines
• Embedded computing — Co-processor offload and custom peripheral interfaces
• Test & measurement instruments — Signal capture, pattern generation, and bus analysis
• Networking hardware — Packet classification and switching fabric control

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Why Choose the XC2S200-6FGG1142C Over a Mask-Programmed ASIC?

Engineers often face the classic ASIC vs. FPGA decision. The Xilinx Spartan-II XC2S200-6FGG1142C offers compelling advantages:

The XC2S200-6FGG1142C’s reprogrammability means design upgrades can be deployed in the field without hardware replacement — a critical advantage in rapidly evolving product environments.

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Design Tools & Software Support

The XC2S200-6FGG1142C is supported by Xilinx ISE Design Suite, the established toolchain for Spartan-II devices. Key tools include:

• ISE Project Navigator — RTL synthesis, place-and-route, and bitstream generation
• CORE Generator — IP core insertion for common functions (FIFOs, multipliers, memory controllers)
• ChipScope Pro — In-system logic analysis and debug via JTAG
• iMPACT — Device configuration and programming

For new designs entering production today, engineers should evaluate migration paths to modern Xilinx/AMD FPGA families (such as Artix-7 or Spartan-7) which offer improved performance, lower power, and long-term availability. However, the XC2S200-6FGG1142C remains in demand for legacy system maintenance and long-life industrial equipment.

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Ordering Information & Availability

The XC2S200-6FGG1142C is available through authorized electronic component distributors. When sourcing this part, verify the following:

• Authenticity — Purchase only from authorized or reputable distributors to avoid counterfeit components
• Date Code — Check lot date codes for freshness, especially for aging inventory
• RoHS Compliance — The “G” in FGG confirms Pb-free packaging, meeting RoHS directives
• Lead Time — As a legacy part, lead times may vary; safety stock purchases are advisable for production builds

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Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean on the XC2S200-6FGG1142C?

Speed grade “-6” is the fastest available for the Spartan-II commercial temperature range. It indicates the device’s worst-case propagation delay performance, with a maximum operating frequency of 263 MHz.

Is the XC2S200-6FGG1142C RoHS compliant?

Yes. The “G” suffix in the package code (FGG1142) confirms this is a Pb-free, RoHS-compliant variant.

 What temperature range does the XC2S200-6FGG1142C support?

The “C” suffix denotes the Commercial temperature range: 0°C to +85°C. Industrial range (-40°C to +85°C) variants use an “I” suffix but are not available at speed grade -6.

Can I use the XC2S200-6FGG1142C for a new design today?

While fully functional, Xilinx classifies the Spartan-II family as Not Recommended for New Designs (NRND). For new designs, AMD/Xilinx recommends migrating to the Spartan-7 or Artix-7 family. The XC2S200-6FGG1142C is best suited for legacy system maintenance and repair.

What programming/configuration tools does this FPGA support?

The XC2S200-6FGG1142C supports Master Serial, Slave Serial, SelectMAP (Slave Parallel), and JTAG (IEEE 1149.1) configuration modes.

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Summary

The XC2S200-6FGG1142C is the flagship device of the Xilinx Spartan-II family — offering 200,000 system gates, 5,292 logic cells, 284 user I/Os, and a maximum frequency of 263 MHz in a 1142-ball, Pb-free BGA package. Its comprehensive I/O standard support, four onboard DLLs, and generous memory resources make it a capable and flexible solution for legacy industrial, communications, and embedded systems applications. For engineers sourcing, maintaining, or upgrading systems built on Spartan-II silicon, the XC2S200-6FGG1142C remains the highest-density option in its family.

For a broader look at Xilinx programmable logic devices and to explore modern FPGA options, visit our Xilinx FPGA resource page.