The XC3S5000-4FGG676C is a high-density, cost-optimized Field-Programmable Gate Array (FPGA) from Xilinx (now AMD), part of the industry-proven Spartan-3 family. Designed for high-volume consumer and industrial electronics, this device delivers 5 million system gates, 74,880 logic cells, and up to 784 user I/Os — all in a compact 676-pin Fine-Pitch Ball Grid Array (FBGA) package. Whether you are building broadband access equipment, digital television systems, or embedded control platforms, the XC3S5000-4FGG676C offers exceptional performance-per-dollar on a mature 90nm process node.

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What Is the XC3S5000-4FGG676C?

The XC3S5000-4FGG676C is a member of the Xilinx FPGA Spartan-3 product line — a family specifically engineered to serve the needs of cost-sensitive, high-volume applications. The part number decodes as follows:

This device is also sometimes referenced without the extra “G” in the package code as XC3S5000-4FG676C, which refers to the same physical device with a legacy non-Pb-free marking convention. The FGG suffix confirms RoHS-compliant, Pb-free construction.

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XC3S5000-4FGG676C Key Specifications

Core Logic Resources

Memory Resources

I/O and Connectivity

Package and Electrical

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XC3S5000-4FGG676C Speed Grade and Performance

The -4 speed grade is the standard commercial offering for the XC3S5000 in the FGG676 package. Xilinx also offered a -5 speed grade for higher clock frequency requirements. Below is a comparison:

For most embedded control, communications, and video processing designs, the -4 grade provides ample headroom while offering the best price-to-performance ratio.

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Supported I/O Standards

The XC3S5000-4FGG676C supports a broad range of single-ended and differential I/O standards, making it compatible with virtually all modern digital interfaces:

Single-Ended I/O Standards

Differential I/O Standards

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Block RAM Architecture

The XC3S5000-4FGG676C contains 104 block RAM tiles, each consisting of an 18 Kbit dual-port synchronous SRAM. Key architectural features include:

• True dual-port access: Port A and Port B operate independently with separate clocks, addresses, and data paths
• Configurable data widths from 1 to 18 bits per port
• Built-in optional output registers for improved pipeline performance
• Each block RAM tile is paired with a dedicated 18×18-bit multiplier, enabling efficient DSP datapath construction

Total on-chip block RAM: 1,872 Kbits (~234 KB), suitable for storing FIFOs, frame buffers, lookup tables, and instruction memory for embedded soft processor cores.

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Digital Clock Manager (DCM)

The device integrates 4 Digital Clock Managers, providing robust on-chip clock control:

• Frequency synthesis: multiply or divide input clock frequencies
• Phase shifting: precise control over clock phase (0°, 90°, 180°, 270°, and fine-grained)
• Deskew: eliminates clock distribution delay within the FPGA fabric
• Status outputs: LOCKED signal confirms DCM lock for safe system initialization
• Supported input frequency range: approximately 24 MHz to 326 MHz

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Configuration Modes

The XC3S5000-4FGG676C supports five industry-standard configuration modes, enabling flexible board-level integration:

Configuration data is held in robust reprogrammable static CMOS configuration latches (CCLs). The device stores its configuration externally between power cycles, typically in a Xilinx Platform Flash PROM (such as the XCF16P).

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Typical Applications for the XC3S5000-4FGG676C

Thanks to its combination of logic density, on-chip memory, dedicated multipliers, and flexible I/O, the XC3S5000-4FGG676C is well-suited for a wide range of applications:

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XC3S5000-4FGG676C vs. Other Spartan-3 Devices

The table below shows where the XC3S5000 sits within the full Spartan-3 family lineup:

The XC3S5000 is the largest and most capable device in the standard Spartan-3 family, making it the right choice when logic density or memory capacity is the primary design driver.

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Ordering Information and Part Number Variants

The XC3S5000 is available in multiple package and temperature variants. The table below covers the most common FGG676 options:

Note: The “I” suffix denotes the Industrial temperature grade, suitable for designs exposed to extreme environmental conditions. Always verify your application’s temperature requirements before selecting a part.

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Development Tools and Software Support

The XC3S5000-4FGG676C is fully supported by Xilinx (AMD) legacy design tools:

• Xilinx ISE Design Suite – The primary design environment for all Spartan-3 devices. Includes synthesis, implementation, simulation, and bitstream generation.
• XST (Xilinx Synthesis Technology) – Integrated RTL synthesis engine within ISE
• ChipScope Pro – In-system logic analyzer for real-time debugging via JTAG
• EDK (Embedded Development Kit) – For MicroBlaze soft processor designs
• ISIM / ModelSim – Simulation environments for behavioral and timing verification
• iMPACT – Programming and configuration tool for device programming via JTAG or PROM

Note: The Spartan-3 family is not supported in Vivado. ISE 14.7 is the final and recommended design tool version for this device.

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Recommended Companion Devices

For a complete system design around the XC3S5000-4FGG676C, consider pairing it with the following:

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Frequently Asked Questions

What is the difference between XC3S5000-4FG676C and XC3S5000-4FGG676C?

The double “G” in FGG indicates a Pb-free (RoHS-compliant) package. The XC3S5000-4FGG676C uses lead-free solder balls, making it suitable for modern manufacturing environments compliant with EU RoHS directives. Functionally and electrically, both parts are identical.

Is the XC3S5000-4FGG676C recommended for new designs?

Yes. As of the June 2013 datasheet revision (DS099 v3.1), Xilinx confirmed this product is recommended for new designs. While it is a mature-node device (90nm), it remains in production and is widely available through authorized distributors.

How many I/Os are available in the FGG676 package?

The 676-pin FGG package provides 344 maximum user I/Os for the XC3S5000. While the device supports up to 784 I/Os in larger packages, the FGG676 is a practical middle ground balancing pin count and PCB routing complexity.

What configuration PROM should I use with the XC3S5000-4FGG676C?

Xilinx recommends the XCF16P Platform Flash PROM (16 Mbit capacity), which provides sufficient storage for the XC3S5000 bitstream (~13.3 Mbits).

Can this device run a soft processor?

Yes. The XC3S5000-4FGG676C has ample resources to implement Xilinx MicroBlaze or PicoBlaze soft processor cores, along with peripherals, using the Xilinx EDK toolchain within ISE.

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Summary

The XC3S5000-4FGG676C delivers the highest logic density in the standard Spartan-3 family with 5 million system gates, 74,880 logic cells, 104 dedicated 18×18 multipliers, and 1,872 Kbits of block RAM — all in a compact Pb-free 676-pin FBGA package. Its support for a wide array of I/O standards, four onboard DCMs, and five configuration modes makes it a versatile and production-proven choice for cost-sensitive consumer electronics, industrial control, communications, and embedded computing applications.

For engineers requiring a mature, well-supported, and readily available FPGA with strong logic density, the XC3S5000-4FGG676C remains a compelling option backed by decades of proven deployment in the field.