The XC2S200-6FGG1138C is a high-density, 2.5V field-programmable gate array from Xilinx’s Spartan-II family, packaged in a 1138-ball Fine-Pitch BGA (FGG1138) with a commercial-grade -6 speed rating. Designed as a cost-effective alternative to mask-programmed ASICs, it combines 200,000 system gates with 5,292 logic cells and a flexible, reprogrammable architecture — making it a proven choice for engineers working across telecommunications, industrial automation, and embedded systems.

If you are sourcing or comparing Xilinx programmable logic devices, explore the full range at Xilinx FPGA for pricing, alternatives, and availability.

What Is the XC2S200-6FGG1138C? – Part Number Decoded

Understanding the part number helps engineers quickly identify key attributes before reviewing a full datasheet.

The “G” in FGG indicates a Pb-free (RoHS-compliant lead-free solder) package, distinguishing it from the standard FG version.

XC2S200-6FGG1138C Key Specifications at a Glance

Spartan-II XC2S200 Logic Architecture

## CLB Array and Logic Resources

The XC2S200 features a 28 × 42 Configurable Logic Block (CLB) array totaling 1,176 CLBs. Each CLB contains four logic cells, with each logic cell built around a 4-input Look-Up Table (LUT) and a D flip-flop. This architecture enables both combinatorial and sequential logic to be implemented efficiently within the same programmable fabric.

## Block RAM and Distributed RAM

Memory resources are a standout feature of the XC2S200:

Block RAM columns are positioned on either side of the CLB array, between the CLBs and the IOB columns, providing fast, dedicated on-chip storage for FIFOs, lookup tables, and data buffering — without consuming CLB logic resources.

## Delay-Locked Loops (DLLs)

Four Delay-Locked Loops are integrated into the XC2S200, one at each corner of the die. DLLs enable precise clock management: they eliminate clock distribution delay, multiply or divide clock frequencies, and shift clock phase. This makes the XC2S200 suitable for synchronous, high-speed digital designs that demand stable, low-jitter clocking.

## Input/Output Blocks (IOBs)

The XC2S200-6FGG1138C provides up to 284 maximum user I/Os, supported by flexible Input/Output Blocks (IOBs). Key IOB capabilities include:

• Programmable drive strength and slew rate
• Support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL, HSTL, SSTL)
• Optional pull-up, pull-down, and keeper circuits
• Registered inputs and outputs for setup/hold time optimization

Configuration Modes for the Spartan-II XC2S200

The XC2S200 supports four standard configuration modes, selectable via the M0, M1, M2 mode pins:

During power-on and throughout the configuration phase, all I/O drivers are held in a high-impedance state, protecting external circuits until the FPGA is fully programmed.

XC2S200 Spartan-II Family Comparison

To better understand where the XC2S200-6FGG1138C sits within the Spartan-II lineup, the table below compares all family members:

The XC2S200 is the largest and highest-density device in the Spartan-II family, offering the most logic, I/O, and RAM resources available in this product line.

Speed Grade -6: What It Means for Your Design

The -6 speed grade is the fastest speed grade available in the Spartan-II family and is exclusively offered in the commercial temperature range (0°C to +85°C). It is not available in industrial or automotive temperature variants.

Choosing the -6 speed grade is ideal for applications where maximum operating frequency and minimum propagation delay are critical, such as high-throughput data processing, fast bus interfaces, and real-time signal processing.

FGG1138 Package Details: Fine-Pitch Ball Grid Array

### Package Overview

The FGG1138 is a 1,138-ball Fine-Pitch Ball Grid Array package. The “G” suffix designates it as a Pb-free (lead-free) package, making it compliant with RoHS environmental directives. This is an important differentiator from the non-Pb-free FG1138 variant.

### PCB Design Considerations for BGA Packages

Designing with a 1138-ball BGA requires careful PCB layout attention:

• Use controlled-impedance routing for high-speed signal integrity
• Apply via-in-pad or dog-bone fan-out strategies for BGA escape routing
• Implement proper decoupling capacitor placement close to the power and ground balls
• Follow Xilinx PCB design guidelines for the FGG1138 footprint to ensure reliable solder joint formation

Typical Applications of the XC2S200-6FGG1138C

The XC2S200-6FGG1138C is well-suited for a broad range of industries and applications where high I/O count and 200K gates of programmable logic are required:

XC2S200-6FGG1138C vs. Similar Xilinx FPGA Devices

Engineers evaluating the XC2S200-6FGG1138C often compare it with related Xilinx parts. The table below provides a quick side-by-side reference:

The FGG1138 package offers the highest pin count option in the XC2S200 lineup, providing the maximum available user I/O of 284 pins — ideal for designs requiring a large number of external interfaces.

Ordering Information and Part Marking

Xilinx part numbers follow a structured format to encode all key attributes. Using the XC2S200-6FGG1138C as an example:

XC2S200  -  6  -  FGG  -  1138  -  C
  |          |     |       |       |
  Device   Speed  Pkg   Pin Ct.  Temp
  Type    Grade  (Pb-Free)

• XC2S200 – Spartan-II, 200K gates
• -6 – Speed grade -6 (fastest)
• FGG – Fine-Pitch BGA, Pb-free (lead-free)
• 1138 – 1,138 solder balls
• C – Commercial temperature (0°C to +85°C)

Development Tools and Design Support

Xilinx Spartan-II devices including the XC2S200-6FGG1138C are supported by Xilinx ISE Design Suite (the legacy toolchain used for this device family). Key software resources include:

Note: The Spartan-II family predates the Vivado Design Suite. ISE is the appropriate toolchain for this device.

Frequently Asked Questions (FAQ)

#### What is the difference between XC2S200-6FGG1138C and XC2S200-6FG1138C?

The only difference is the package designation. FGG1138 is the Pb-free (lead-free) version, while FG1138 uses standard tin-lead solder balls. Both share identical silicon die and electrical specifications. For RoHS compliance, always select the FGG variant.

#### Is the XC2S200-6FGG1138C still in production?

The Spartan-II family has reached end-of-life status per Xilinx product discontinuation notices. However, inventory is typically available through authorized distributors and specialty component sourcing companies for legacy and maintenance applications.

#### Can the XC2S200 be used in industrial temperature applications?

The -6 speed grade is exclusively commercial (0°C to +85°C). For industrial temperature range (-40°C to +100°C), use the -5 speed grade variants such as the XC2S200-5FGG1138I.

#### What configuration PROM is compatible with the XC2S200?

Xilinx XCF-series Platform Flash PROMs are compatible for serial master configuration. Common choices include the XCF08P and XCF16P for Spartan-II devices.

#### How many flip-flops does the XC2S200 contain?

Each logic cell contains one flip-flop. With 5,292 logic cells, the XC2S200 provides up to 5,292 flip-flops for sequential logic implementation.

Summary: Why Choose the XC2S200-6FGG1138C?

The XC2S200-6FGG1138C delivers the maximum logic density, I/O count, and operating speed available within the Spartan-II product family. Its 1138-ball Pb-free BGA package supports designs with a large number of external interfaces, while the -6 commercial speed grade ensures the fastest timing margins for demanding applications. For engineers maintaining legacy designs or deploying proven FPGA technology in cost-sensitive production environments, the XC2S200-6FGG1138C remains a reliable and well-documented choice.