The XC2S200-6FGG1137C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. Built on a 0.18µm CMOS process and operating at 2.5V, this device delivers 200,000 system gates, 5,292 logic cells, and up to 284 user I/O pins in a 1,137-ball Fine Pitch BGA (FBGA) package. Whether you’re designing for communications, industrial automation, or embedded systems, the XC2S200-6FGG1137C offers a proven, cost-effective programmable logic platform backed by Xilinx’s architecture. For a broader selection of programmable logic devices, explore our full range of Xilinx FPGA products.

What Is the XC2S200-6FGG1137C?

The XC2S200-6FGG1137C is the largest member of the Xilinx Spartan-II FPGA family in a high-density 1,137-pin FBGA package. The part number breaks down as follows:

This device is classified as a Not Recommended for New Designs (NRND) component, making it primarily suited for legacy system support, repair, and long-lifecycle industrial equipment.

XC2S200-6FGG1137C Key Specifications

Core Logic Resources

I/O and Package Details

Performance and Process

XC2S200-6FGG1137C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1137C is built around a 28×42 array of Configurable Logic Blocks. Each CLB contains four logic cells, and each logic cell includes a 4-input Look-Up Table (LUT), a flip-flop, and dedicated carry logic. This architecture enables efficient implementation of both combinational and registered logic, making it well-suited for complex digital designs.

Block RAM

The device integrates 14 block RAM modules totaling 56K bits of embedded memory. These dual-port synchronous RAM blocks support various width configurations and are ideal for high-speed FIFOs, data buffers, and lookup tables within FPGA-based signal processing pipelines.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1137C supports a wide range of programmable I/O standards, including:

• LVTTL and LVCMOS (3.3V, 2.5V, 1.8V)
• GTL and GTL+
• SSTL2 and SSTL3
• HSTL Classes I, III, and IV
• PCI (33 MHz, 3.3V)

Each IOB includes programmable slew rate control, optional pull-up/pull-down resistors, and input delay elements (DCI support varies by bank).

Delay-Locked Loops (DLLs)

Four on-chip DLLs provide zero-delay clock buffering and advanced clock manipulation including phase shifting, frequency division, and clock mirroring. The DLLs are positioned at each corner of the die and serve both global and regional clock networks.

Routing Architecture

A hierarchical routing matrix connects CLBs, block RAMs, and IOBs using local, long-line, and global routing resources. Four dedicated global clock nets minimize clock skew across the entire device.

Spartan-II Family Comparison Table

The XC2S200 is the largest device in the Spartan-II lineup. The table below compares all family members to help engineers select the right density for their application.

XC2S200-6FGG1137C vs. Other XC2S200 Package Options

The XC2S200 core is offered in multiple package options. The FGG1137 is the largest and highest pin-count package, offering the maximum user I/O.

Supported I/O Standards

Configuration Modes

The XC2S200-6FGG1137C supports multiple configuration options suitable for various system architectures:

Typical Applications of the XC2S200-6FGG1137C

Communications and Networking

The XC2S200-6FGG1137C is widely used in communications infrastructure for implementing protocol bridges, line cards, and signal processing engines. Its 284 I/O pins and high-speed DLLs support glue logic, SERDES interfaces, and packet processing at line rates.

Industrial Automation and Motor Control

In industrial environments, this FPGA handles real-time control loops, encoder interfaces, and multi-axis motor control. The reconfigurability of the Spartan-II architecture means designs can be updated in the field without hardware replacement, a critical advantage over mask-programmed ASICs.

 Medical and Diagnostic Equipment

Medical imaging systems, patient monitoring devices, and diagnostic analyzers benefit from the XC2S200-6FGG1137C’s combination of logic density, embedded memory, and deterministic timing. Its reliability and long availability window suit regulated environments.

 Legacy System Support and Repair

Given its NRND status, the XC2S200-6FGG1137C is a top choice for MRO (Maintenance, Repair & Overhaul) procurement in defense, aerospace, and industrial sectors where long-life boards require exact component matches.

 Test and Measurement

Instrumentation designers use this device for data acquisition front-ends, pattern generators, and protocol analyzers where high I/O count and fast clock management are essential.

Ordering Information and Part Number Decoder

When ordering the XC2S200-6FGG1137C, understanding the full part number ensures you receive the correct device variant:

XC  2S  200  -6  FGG  1137  C
│   │   │    │   │    │     └─ Temperature: C = Commercial (0°C to +85°C)
│   │   │    │   │    └─────── Pin Count: 1,137
│   │   │    │   └──────────── Package: FGG = Fine Pitch BGA, Pb-Free
│   │   │    └──────────────── Speed Grade: -6 (fastest commercial)
│   │   └───────────────────── Density: 200K gates
│   └───────────────────────── Family: Spartan-II (2S)
└───────────────────────────── Manufacturer: Xilinx (now AMD)

Absolute Maximum Ratings

Note: Operation beyond these values may permanently damage the device. Always consult the official Xilinx/AMD DS001 datasheet for complete electrical specifications before design-in.

Design Tools and Software Support

The XC2S200-6FGG1137C is supported by the following Xilinx/AMD tools:

Note: Vivado Design Suite does not support Spartan-II devices. ISE Design Suite 14.7 is the last supported toolchain for this family.

Frequently Asked Questions (FAQ)

What is the difference between XC2S200-6FGG1137C and XC2S200-6FGG456C?

Both devices use the same XC2S200 silicon die with identical logic resources, block RAM, and user I/O count (284 pins). The key difference is the package: the FGG1137 has 1,137 total BGA balls versus 456 in the FGG456. The larger package provides greater board-level routing flexibility and improved thermal dissipation, making it preferred for dense multi-layer PCB designs.

Is the XC2S200-6FGG1137C RoHS compliant?

Yes. The “G” in the package code (FGG) designates a Pb-free (lead-free) package, making it RoHS compliant. Standard (non-“G”) variants use tin-lead solder balls and are not RoHS compliant.

Can the XC2S200-6FGG1137C replace an XC2S200-6FGG456C?

At the silicon level, yes — both share the same die. However, the package footprint is different, so a PCB redesign is required. Verify the board layout, BGA pad dimensions, and via patterns before substitution.

 What configuration PROM is recommended for the XC2S200?

Xilinx XCF (Platform Flash) PROMs such as the XCF02S are commonly used for Master Serial configuration of the XC2S200. The XCF04S supports additional configuration data storage. Note that some XCF PROMs have also been discontinued; verify availability before designing new systems.

Is this device suitable for new designs?

Xilinx classifies the XC2S200 as Not Recommended for New Designs (NRND). For new projects, Xilinx/AMD recommends migrating to modern families such as Spartan-7, Artix-7, or Kintex-7. The XC2S200-6FGG1137C is best suited for sustaining production, board repairs, and legacy system maintenance.

Summary

The XC2S200-6FGG1137C is a well-proven Xilinx Spartan-II FPGA offering 200K system gates, 5,292 logic cells, 284 user I/O pins, and 56K bits of block RAM in a Pb-free 1,137-ball FBGA package. Operating at the -6 speed grade with a 2.5V core, it remains a reliable choice for legacy system support, MRO procurement, and industrial applications that demand a long-lifecycle programmable logic solution. Its rich I/O standard support, four on-chip DLLs, and flexible configuration modes make it a versatile device in communications, automation, and medical electronics environments.