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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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XC3S50-4PQ208C: Xilinx Spartan-3 FPGA – Full Specifications, Features & Applications

Product Details

The XC3S50-4PQ208C is a cost-optimized Field-Programmable Gate Array (FPGA) from the Xilinx Spartan-3 family, now under AMD. Designed for high-volume, cost-sensitive applications, this device delivers 50,000 system gates, 1,728 logic cells, and runs at up to 630 MHz — all in a compact 208-pin PQFP package. Whether you are building embedded control systems, consumer electronics, or digital signal processing platforms, the XC3S50-4PQ208C offers a powerful combination of programmable logic, on-chip memory, and flexible I/O in a production-ready commercial-grade package.

For engineers seeking a proven, readily available Xilinx FPGA for embedded and digital design, this device remains one of the most widely used entry-level programmable logic solutions on the market.


What Is the XC3S50-4PQ208C?

The XC3S50-4PQ208C belongs to the Spartan-3 FPGA family — a product line engineered specifically to serve high-volume, cost-sensitive consumer and industrial electronic applications. It uses 90nm CMOS process technology and operates on a 1.2V core supply voltage. The “-4” in the part number denotes its speed grade, while “PQ208” refers to the 208-pin Plastic Quad Flat Package (PQFP), and “C” specifies the commercial temperature range (0°C to +85°C).


XC3S50-4PQ208C Key Specifications

General Product Identification

Parameter Value
Manufacturer AMD / Xilinx
Part Number XC3S50-4PQ208C
Product Family Spartan-3
Product Category FPGA (Field-Programmable Gate Array)
RoHS Status Not Compliant (Standard Pb package)

Core Logic Specifications

Specification Value
System Gates 50,000
Logic Cells 1,728
CLB Slices 768
CLB Flip-Flops 1,536
4-Input LUTs 1,536
Distributed RAM 24 Kbits
Block RAM 72 Kbits (4 × 18Kbit blocks)
Dedicated Multipliers 4 × 18×18 multipliers
Digital Clock Managers (DCM) 2

Electrical & Performance Specifications

Specification Value
Core Supply Voltage 1.2V (1.14V – 1.26V)
I/O Supply Voltage 3.3V, 2.5V, 1.8V, 1.5V, 1.2V
Maximum Clock Speed 630 MHz
Speed Grade -4
Process Technology 90nm CMOS
Configuration Logic Static CMOS CCLs

Package & Thermal Specifications

Specification Value
Package Type PQFP (Plastic Quad Flat Pack)
Package Code PQ208
Pin Count 208
Terminal Form Gull Wing (SMD)
Temperature Grade Commercial (C)
Operating Temperature 0°C to +85°C
Mounting Type Surface Mount

I/O Specifications

Specification Value
User I/O Pins 124 (single-ended)
Differential I/O Pairs 56
I/O Standards Supported 26 signal standards
Digitally Controlled Impedance (DCI) Supported
Double Data Rate (DDR) Registers Supported
High-Performance Differential Standards 8 standards

XC3S50-4PQ208C Part Number Decoder

Understanding the part number helps engineers quickly identify the right variant for their design:

Code Segment Meaning
XC Xilinx (AMD) FPGA
3S Spartan-3 family
50 50,000 system gates
-4 Speed grade 4
PQ Plastic Quad Flat Package (PQFP)
208 208-pin count
C Commercial temperature (0°C–85°C)

Architecture Overview: Five Key Functional Elements

The Spartan-3 architecture — and by extension the XC3S50-4PQ208C — is built around five tightly integrated functional elements:

1. Configurable Logic Blocks (CLBs)

CLBs are the primary logic resource. Each CLB contains RAM-based Look-Up Tables (LUTs) that implement combinational logic, plus storage elements that can operate as flip-flops or latches. CLBs are organized in a regular array surrounded by a ring of I/O blocks.

2. Input/Output Blocks (IOBs)

IOBs control data flow between external pins and internal logic. Each IOB supports bidirectional data flow and three-state operation, and is compatible with 26 different signal standards — including eight high-performance differential standards such as LVDS and RSDS.

3. Block RAM

The XC3S50-4PQ208C features a single column of block RAM, totaling 72 Kbits. The block RAM uses a dual-port structure, enabling independent, simultaneous access from two separate data ports (Port A and Port B), making it ideal for FIFOs, lookup tables, and embedded memory applications.

4. Dedicated Multiplier Blocks

Four 18×18 hardware multiplier blocks are embedded in the device. Each multiplier is associated with a block RAM column and is optimized for digital signal processing tasks such as filtering, FFT computation, and arithmetic-intensive operations.

5. Digital Clock Managers (DCMs)

The XC3S50-4PQ208C includes two DCMs. These are used for clock skew elimination, frequency synthesis, and phase shifting, enabling clean, reliable clocking across the device at speeds up to 630 MHz.


Supported I/O Standards

The XC3S50-4PQ208C supports a broad range of I/O signaling standards, making it compatible with most modern interface protocols:

Standard Category Examples
Single-Ended Standards LVTTL, LVCMOS 3.3V/2.5V/1.8V/1.5V/1.2V
High-Speed Differential LVDS, RSDS, mini-LVDS, PPDS
Memory Interface Standards SSTL2 (Class I/II), SSTL18 (Class I/II)
High-Speed Logic HSTL (Class I/III/IV)
Terminated Standards GTL, GTL+

Configuration Modes

The XC3S50-4PQ208C supports five configuration modes, providing flexible system integration options:

Configuration Mode Description
Master Serial FPGA drives SCK; reads from serial PROM
Slave Serial External controller drives SCK
Master Parallel FPGA reads from parallel NOR Flash or PROM
Slave Parallel External processor writes configuration data
JTAG (Boundary Scan) In-system configuration and debugging via JTAG

Configuration data is stored in reprogrammable static CMOS Configuration Latches (CCLs), which collectively control all functional elements and routing resources.


Typical Application Areas

The XC3S50-4PQ208C is well-suited for the following application domains:

Application Domain Use Cases
Consumer Electronics Set-top boxes, digital cameras, home appliances
Industrial Control Motor drives, PLCs, sensor interfaces
Communications Equipment Protocol bridging, UART/SPI/I2C controllers
Embedded Systems Co-processors, custom logic accelerators
Signal Processing FIR/IIR filters, FFT, data acquisition systems
Prototyping & Development ASIC prototyping, educational boards, eval kits

XC3S50-4PQ208C vs. Other Spartan-3 Variants

The Spartan-3 family spans eight density levels. Here is how the XC3S50 compares to other family members:

Device System Gates Logic Cells Block RAM (Kbits) Multipliers DCMs
XC3S50 50,000 1,728 72 4 2
XC3S200 200,000 4,320 216 12 4
XC3S400 400,000 8,064 288 16 4
XC3S1000 1,000,000 17,280 432 24 4
XC3S2000 2,000,000 33,280 720 40 4

The XC3S50-4PQ208C is the entry-level device in this family, making it ideal for applications that require modest logic density at the lowest possible cost and power.


XC3S50 Available Packages

The XC3S50 device is available in multiple package options to support different board space constraints:

Package Pins User I/O (Single-Ended) Differential Pairs
CP132 132 63 29
TQ144 144 97 46
PQ208 208 124 56
FT256 256 173 76

The PQ208 package used in the XC3S50-4PQ208C provides the highest I/O count available for this device, with 124 user-selectable single-ended I/O pins and 56 differential pairs.


Design Tools & Programming

The XC3S50-4PQ208C is supported by Xilinx/AMD design toolchains:

  • Xilinx ISE Design Suite — legacy support tool for Spartan-3 devices, supporting VHDL, Verilog, and schematic entry
  • Vivado Design Suite — newer generation tool; some Spartan-3 support available for certain flows
  • iMPACT — Xilinx configuration and programming tool for JTAG and configuration PROM workflows
  • ChipScope Pro — in-system logic analysis and debugging

HDL languages supported include VHDL, Verilog, and SystemVerilog for higher-level synthesis flows.


Ordering Information

Field Detail
Full Part Number XC3S50-4PQ208C
Manufacturer AMD / Xilinx
Pb-Free Equivalent XC3S50-4PQG208C
DigiKey Part # 6131752
Package 208-Pin PQFP (Gull Wing SMD)
Temperature Grade Commercial (0°C to +85°C)
Compliance Standard (Non-Pb-Free)

Note: If your design requires RoHS-compliant components, consider the XC3S50-4PQG208C, which is the Pb-free version of this device (indicated by the “G” in the package code).


Frequently Asked Questions (FAQ)

Q: What is the XC3S50-4PQ208C used for? The XC3S50-4PQ208C is used in embedded systems, consumer electronics, industrial control, communications, and digital signal processing applications that require a low-cost, programmable logic solution with moderate gate density.

Q: What is the difference between XC3S50-4PQ208C and XC3S50-4PQG208C? The only difference is the package material. The “G” variant (XC3S50-4PQG208C) uses a Pb-free (lead-free) package for RoHS compliance. Electrically and functionally, both devices are identical.

Q: What speed grade is the XC3S50-4PQ208C? This device carries a speed grade of -4, which corresponds to a maximum system clock frequency of 630 MHz.

Q: Is the XC3S50-4PQ208C still recommended for new designs? As of the last official Xilinx datasheet revision (June 2013), the Spartan-3 family is confirmed as recommended for new designs. However, for new projects with longer design horizons, engineers may also consider newer families such as Spartan-6 or Artix-7 for improved performance, lower power, and longer-term supply chain support.

Q: What configuration modes does the XC3S50-4PQ208C support? It supports Master Serial, Slave Serial, Master Parallel, Slave Parallel, and JTAG (Boundary Scan) configuration modes.

Q: How many I/O pins does the XC3S50-4PQ208C have? In the PQ208 package, this device provides 124 single-ended user I/O pins and 56 differential I/O pairs.


Summary

The XC3S50-4PQ208C is a reliable, cost-effective FPGA from the Xilinx Spartan-3 family that combines programmable logic, on-chip block RAM, hardware multipliers, and flexible I/O into a 208-pin PQFP package. With 50,000 system gates, 630 MHz performance, 90nm process technology, and support for 26 I/O standards, it is well-positioned for a wide variety of embedded, consumer, and industrial applications where cost and time-to-market are critical factors.

Its mature ecosystem of design tools, broad support for standard interfaces, and dual DCM architecture make it a dependable choice for both new designs and legacy system maintenance.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.