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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC3S50-4VQ100I: Xilinx Spartan-3 FPGA – Complete Product Guide

Product Details

The XC3S50-4VQ100I is a field-programmable gate array (FPGA) from the Xilinx FPGA Spartan-3 family, manufactured by AMD (formerly Xilinx). Designed for high-volume, cost-sensitive industrial and consumer electronic applications, this device delivers reliable programmable logic performance in a compact 100-pin VTQFP package with an extended industrial temperature rating. Whether you are prototyping an embedded system, designing for industrial automation, or replacing a legacy ASIC, the XC3S50-4VQ100I offers a proven, cost-efficient solution.


What Is the XC3S50-4VQ100I?

The XC3S50-4VQ100I belongs to the eight-member Spartan-3 FPGA family from Xilinx (now AMD). The part number breaks down as follows:

Segment Meaning
XC3S50 Spartan-3 family, 50K system gates
-4 Speed grade 4 (standard performance)
VQ100 100-pin Very Thin Quad Flat Pack (VTQFP) package
I Industrial temperature range (–40°C to +100°C)

This industrial-grade variant is ideal for designs that must operate reliably across wide temperature ranges, such as factory automation equipment, embedded controllers, and outdoor instrumentation.


XC3S50-4VQ100I Key Specifications

Core Electrical and Logic Parameters

Parameter Value
FPGA Family Spartan-3
System Gates 50,000
Logic Cells 1,728
Process Technology 90 nm
Core Supply Voltage 1.2V
Maximum Clock Frequency 630 MHz
Package Type 100-Pin VTQFP (Very Thin Quad Flat Pack)
Temperature Range –40°C to +100°C (Industrial)
RoHS Status Standard (non-Pb-free; Pb-free variant uses “G” suffix)

Memory and Logic Resources

Resource XC3S50 Value
Configurable Logic Blocks (CLBs) 192
Flip-Flops 1,536
Block RAM 72 Kbits (4 × 18 Kbit blocks)
Dedicated Multipliers (18×18-bit) 4
Digital Clock Managers (DCMs) 2
Maximum User I/Os (VQ100 package) 63

I/O and Package Details

Parameter Value
Total Pin Count 100
Maximum User I/Os 63
I/O Standards Supported LVTTL, LVCMOS, SSTL, HSTL, and more
Package Body Size 14 mm × 14 mm
Pitch 0.5 mm
Configuration Interface JTAG, Master Serial, Slave Serial, Slave Parallel

XC3S50-4VQ100I Functional Architecture

Configurable Logic Blocks (CLBs)

The Spartan-3 CLB architecture provides flexible, efficient logic implementation. Each CLB contains four slices, and each slice includes two 4-input look-up tables (LUTs), two storage elements (registers or latches), carry logic, and arithmetic multiplexers. This structure supports a broad range of combinational and sequential logic designs.

Block RAM

The XC3S50 includes a single column of block RAM, totaling 72 Kbits of true dual-port synchronous memory. Each 18-Kbit block supports independent read and write port widths, making it suitable for FIFOs, lookup tables, and small on-chip data buffers.

Dedicated Multipliers

Four 18×18-bit dedicated hardware multipliers are embedded directly in the silicon alongside the block RAM column. These multipliers accelerate DSP, signal processing, and arithmetic-intensive functions without consuming CLB resources.

Digital Clock Managers (DCMs)

The XC3S50 includes two DCMs, derived from Xilinx’s Virtex-II platform technology. The DCMs provide clock frequency synthesis, phase shifting, and deskewing capabilities, enabling precise clock domain management in complex digital systems.

I/O Blocks (IOBs)

Each user I/O pin is controlled by a fully featured I/O block that supports both input and output paths, optional registered storage, and 3-state control. The IOBs are compatible with a wide range of single-ended and differential I/O standards. Note that DCI (Digitally Controlled Impedance) signal standards are not supported in Bank 5 when using the VQ100 package.


XC3S50-4VQ100I vs. Related Variants

Engineers selecting an FPGA for a new design often compare closely related part numbers. The table below clarifies the key differences within the XC3S50 subfamily.

Part Number Speed Grade Package Temperature Pb-Free
XC3S50-4VQ100C -4 100-pin VTQFP Commercial (0°C to 85°C) No
XC3S50-4VQ100I -4 100-pin VTQFP Industrial (–40°C to 100°C) No
XC3S50-4VQG100C -4 100-pin VTQFP Commercial (0°C to 85°C) Yes
XC3S50-4VQG100I -4 100-pin VTQFP Industrial (–40°C to 100°C) Yes
XC3S50-5VQ100I -5 100-pin VTQFP Industrial (–40°C to 100°C) No

Note: The “G” in the part number (e.g., VQG100) indicates a Pb-free (RoHS-compliant) package. If your design requires RoHS compliance, choose the XC3S50-4VQG100I instead.


Spartan-3 Family Comparison: XC3S50 in Context

The XC3S50-4VQ100I is the entry-level member of the eight-device Spartan-3 family. The table below shows how it compares to larger family members.

Device System Gates Logic Cells Block RAM (Kbits) Multipliers Max I/Os
XC3S50 50K 1,728 72 4 124
XC3S200 200K 4,320 216 12 173
XC3S400 400K 8,064 288 16 264
XC3S1000 1,000K 17,280 432 24 391
XC3S2000 2,000K 33,280 720 40 565
XC3S5000 5,000K 74,880 1,872 104 784

Configuration and Programming

The XC3S50-4VQ100I uses static CMOS configuration latches (CCLs) to store its design. Configuration is non-volatile in the sense that an external configuration memory (such as a serial SPI or Platform Flash device) holds the bitstream and reloads it on power-up. Supported configuration modes include:

  • Master Serial – The FPGA drives the configuration clock and reads from an external serial PROM.
  • Slave Serial – An external controller provides the configuration clock and data stream.
  • Slave Parallel – Faster parallel loading controlled by an external processor or CPLD.
  • JTAG (Boundary Scan) – Compliant with IEEE 1149.1 for in-circuit configuration and testing.

The Xilinx ISE Design Suite (and legacy support in Vivado) is used to synthesize, implement, and generate configuration bitstreams for Spartan-3 devices.


Typical Applications for the XC3S50-4VQ100I

Thanks to its industrial temperature rating, compact footprint, and cost-effective gate density, the XC3S50-4VQ100I is well suited for a wide variety of embedded and industrial applications:

Application Area Use Case Example
Industrial Automation Motor control interfaces, sensor data acquisition
Embedded Systems Custom peripheral controllers, glue logic replacement
Communications Protocol bridging (UART, SPI, I²C, parallel bus)
Consumer Electronics Display control, set-top box logic
Test & Measurement Data capture, signal conditioning front-ends
Automotive (non-safety) In-vehicle infotainment support logic
ASIC Prototyping Logic verification before tape-out

Why Choose the XC3S50-4VQ100I Over a Mask-Programmed ASIC?

The Spartan-3 family was specifically designed as a cost-competitive alternative to ASICs for high-volume designs. Key advantages of the XC3S50-4VQ100I over traditional ASICs include:

  • Zero NRE costs – No non-recurring engineering fees for mask fabrication.
  • Fast time-to-market – Design iterations take hours, not months.
  • Field upgradability – Firmware can be updated in the field via JTAG or a new configuration PROM.
  • Lower risk – Logic bugs can be corrected without scrapping hardware.
  • Small footprint – The 100-pin VTQFP package suits space-constrained PCB layouts.

Ordering and Availability

The XC3S50-4VQ100I is an active part in the AMD (Xilinx) product portfolio and is available through major authorized distributors including Digi-Key, Avnet, and Arrow Electronics. When ordering, confirm whether your supply chain or regulatory requirements mandate the Pb-free (RoHS-compliant) variant — if so, specify the XC3S50-4VQG100I.

Ordering Detail Value
Manufacturer AMD (formerly Xilinx)
Manufacturer Part Number XC3S50-4VQ100I
Package 100-Pin VTQFP
Product Status Active
RoHS Non-compliant (standard Sn/Pb)
Pb-Free Alternative XC3S50-4VQG100I

Frequently Asked Questions (FAQ)

Q: What is the difference between XC3S50-4VQ100I and XC3S50-4VQG100I?
The “G” in the part number denotes Pb-free (lead-free) packaging. Both parts are electrically identical; the only difference is the solder finish on the package leads.

Q: Is the XC3S50-4VQ100I suitable for automotive applications?
The industrial temperature range (–40°C to +100°C) covers many automotive environments. However, for safety-critical automotive designs, consider the dedicated Spartan-3 XA automotive-grade family.

Q: What design tools support the XC3S50-4VQ100I?
The Xilinx ISE Design Suite is the primary supported toolchain. Xilinx Vivado provides limited legacy support. Third-party synthesis tools such as Synplify Pro are also compatible.

Q: Can the XC3S50-4VQ100I be reprogrammed in-system?
Yes. Via the JTAG interface, the device can be reconfigured at any time without removing it from the PCB. Configuration can also be updated by replacing or reprogramming the external configuration PROM.

Q: How many I/O pins are available on the 100-pin package?
The VQ100 package provides up to 63 user-configurable I/O pins on the XC3S50 device.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.