Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC3S1000-5FG320C: Xilinx Spartan-3 FPGA – Complete Product Guide

Product Details

The XC3S1000-5FG320C is a high-performance, cost-optimized field-programmable gate array (FPGA) from AMD Xilinx’s Spartan-3 family. Designed for high-volume, cost-sensitive applications, this device delivers 1,000,000 system gates, flexible I/O capabilities, and industry-leading programmability — all in a compact 320-ball Fine-Pitch BGA (FBGA) package. Whether you are designing embedded systems, digital signal processing pipelines, or communications hardware, the XC3S1000-5FG320C offers the logic density and speed performance engineers demand.

For a broad selection of compatible solutions, visit Xilinx FPGA.


What Is the XC3S1000-5FG320C?

The XC3S1000-5FG320C belongs to the Spartan-3 generation of Xilinx FPGAs — a family specifically engineered to lower the cost per logic cell while maintaining robust performance. The “5” in the part number designates the speed grade, with -5 being the fastest available grade in this family, making this device ideal for timing-critical designs. The “FG320” denotes the 320-ball Fine-Pitch BGA package, and the trailing “C” indicates the commercial temperature range (0°C to +85°C).


XC3S1000-5FG320C Key Specifications

Parameter Value
Manufacturer AMD Xilinx
Series Spartan-3
Part Number XC3S1000-5FG320C
Logic Cells 17,280
System Gates 1,000,000
CLB Slices 7,680
Flip-Flops 15,360
Distributed RAM 120 Kb
Block RAM 432 Kb
Multipliers (18×18) 24
DCM (Digital Clock Manager) 4
Maximum User I/O 391
Package FG320 (Fine-Pitch BGA, 320 balls)
Package Pitch 1.00 mm
Speed Grade -5 (Fastest)
Operating Voltage (VCC INT) 1.2V
I/O Voltage 1.2V – 3.3V
Temperature Range 0°C to +85°C (Commercial)
Technology Node 90 nm
RoHS Compliant Yes

XC3S1000-5FG320C Functional Overview

Logic Architecture

The XC3S1000-5FG320C is built around Xilinx’s Configurable Logic Block (CLB) architecture. Each CLB contains four slices, and each slice includes two 4-input Look-Up Tables (LUTs), two storage elements (flip-flops or latches), and dedicated carry logic. This gives designers enormous flexibility in implementing combinational and sequential logic across 17,280 total logic cells.

The device provides 120 Kb of distributed RAM (implemented within the LUTs) and 432 Kb of dedicated Block RAM organized as 18 Kb blocks. This combination makes the XC3S1000-5FG320C well-suited for buffering, FIFO design, and on-chip storage.

Digital Clock Management (DCM)

Four on-chip Digital Clock Managers (DCMs) provide powerful clock manipulation features, including:

  • Clock frequency synthesis and multiplication
  • Phase shifting and deskewing
  • Clock mirroring and division
  • Duty cycle correction

These DCMs eliminate the need for external clock conditioning circuitry, simplifying PCB design and reducing system cost.

Dedicated Multipliers

With 24 dedicated 18×18-bit hardware multipliers, the XC3S1000-5FG320C accelerates DSP and arithmetic-intensive operations. These multipliers can be cascaded or used in parallel to build multiply-accumulate (MAC) structures for signal processing, motor control, and image processing pipelines.

I/O Architecture and Standards

The XC3S1000-5FG320C supports a wide range of single-ended and differential I/O standards, providing maximum flexibility for interfacing with external devices.

I/O Standard Type Supported Standards
Single-Ended LVCMOS33, LVCMOS25, LVCMOS18, LVCMOS15, LVCMOS12, LVTTL, PCI, SSTL
Differential LVDS, LVPECL, BLVDS, DIFF_SSTL, RSDS
Voltage Ranges 1.2V, 1.5V, 1.8V, 2.5V, 3.3V

Each I/O bank can be independently powered, allowing mixed-voltage designs on a single device.


Package Information: FG320 Fine-Pitch BGA

The XC3S1000-5FG320C is housed in a 320-ball Fine-Pitch BGA (FBGA) package with a 1.00 mm ball pitch and a 19mm × 19mm body size. This compact, surface-mount package is appropriate for space-constrained PCB designs and supports automated reflow soldering processes.

Package Parameter Detail
Package Type Fine-Pitch BGA (FBGA)
Ball Count 320
Ball Pitch 1.00 mm
Body Size 19 mm × 19 mm
Mounting Type Surface Mount
Height (max) 2.47 mm

Speed Grade -5: What It Means for Your Design

The -5 speed grade is the fastest available for the Spartan-3 1000K family. A higher speed grade (lower absolute number for Xilinx) translates to tighter timing parameters, including:

  • Faster combinatorial logic propagation delays through LUTs and interconnects
  • Higher maximum clock frequencies for synchronous designs
  • Shorter setup and hold times, enabling operation with faster external interfaces
  • Better performance margins in tight timing closure scenarios

Designers targeting demanding clock frequencies — for example, processors, high-speed serial bridges, or memory controllers — should prioritize the -5 grade over the slower -4 variant.


XC3S1000-5FG320C Electrical Characteristics

Parameter Min Typical Max Unit
VCCINT (Core Voltage) 1.14 1.20 1.26 V
VCCAUX (Auxiliary Voltage) 2.375 2.50 2.625 V
VCCO (I/O Supply) 1.14 3.465 V
Operating Temperature 0 +85 °C
Junction Temperature (Tj max) 125 °C
Static ICC (Standby) ~13 mA

Supported Design Tools and Programming

Xilinx ISE Design Suite

The XC3S1000-5FG320C is fully supported by the Xilinx ISE Design Suite, particularly ISE 14.7 — the last version with Spartan-3 family support. ISE provides:

  • HDL synthesis (VHDL and Verilog)
  • Place-and-route tools optimized for Spartan-3 architecture
  • Timing analysis and constraint management (UCF files)
  • FPGA Editor for manual placement review
  • iMPACT programming tool for JTAG and configuration

Configuration Modes

Mode Description
Master Serial External serial Flash (e.g., SPI PROM) drives configuration
Slave Serial External host serially loads configuration data
Master Parallel (SelectMAP) Byte-wide parallel configuration from external memory
Slave Parallel (SelectMAP) Processor-controlled parallel configuration
JTAG In-system programming via IEEE 1149.1 boundary scan
Master SPI SPI Flash directly attached

The device retains its configuration in an external non-volatile memory (PROM) since Spartan-3 devices are SRAM-based and require reconfiguration on every power-up.


Typical Applications for the XC3S1000-5FG320C

The XC3S1000-5FG320C is a versatile device suited for a broad range of embedded and signal processing applications.

Application Domain Use Case Examples
Industrial Automation Motor controllers, PLC I/O expansion, real-time control
Communications Protocol bridging, packet processing, MAC layer logic
Consumer Electronics Video processing, display controllers, set-top boxes
Medical Devices Signal acquisition front-ends, data formatting
Test & Measurement Logic analyzers, pattern generators, data capture
Automotive (non-safety critical) Infotainment processing, sensor interfaces
Embedded Processing Soft-core CPU (MicroBlaze, PicoBlaze) integration
DSP / Image Processing FIR/IIR filters, FFT engines, image scaling

XC3S1000-5FG320C vs. Other Spartan-3 Variants

The table below compares the XC3S1000 to neighboring devices in the Spartan-3 family to help designers select the right density.

Device System Gates Logic Cells Block RAM Multipliers Max User I/O
XC3S200 200K 4,320 216 Kb 12 173
XC3S400 400K 8,064 288 Kb 16 264
XC3S1000 1,000K 17,280 432 Kb 24 391
XC3S1500 1,500K 29,952 576 Kb 32 487
XC3S2000 2,000K 46,080 720 Kb 40 565

The XC3S1000 occupies the mid-range of the Spartan-3 family — offering significantly more logic density than the XC3S400 while remaining more cost-effective than the XC3S1500 and above.


Ordering Information

Attribute Detail
Full Part Number XC3S1000-5FG320C
Manufacturer AMD Xilinx
Package FG320 (FBGA, 320-ball)
Speed Grade -5
Temperature Grade C (Commercial, 0°C to +85°C)
RoHS Status RoHS Compliant
Product Status Active
Suggested Replacement Artix-7 (XC7A family) for new designs

Note: For industrial temperature range requirements (-40°C to +100°C), consider the XC3S1000-5FG320I variant.


Frequently Asked Questions (FAQ)

What does the “-5” speed grade mean on the XC3S1000-5FG320C?

The “-5” denotes Xilinx’s fastest speed grade for the Spartan-3 1000K device. It provides the lowest propagation delays and supports the highest clock frequencies within this device variant.

Is the XC3S1000-5FG320C RoHS compliant?

Yes, the XC3S1000-5FG320C is RoHS compliant and uses lead-free solder ball material in the FBGA package.

What software is used to program the XC3S1000-5FG320C?

Xilinx ISE Design Suite (version 14.7 recommended) is the primary design tool. Configuration is performed using the iMPACT programmer via JTAG, or via a Xilinx Platform Flash PROM for standalone operation.

Can I replace the XC3S1000-5FG320C with a newer Xilinx FPGA?

For new designs, AMD Xilinx recommends migrating to the Artix-7 family (e.g., XC7A35T or XC7A50T), which offers lower power, higher performance, and modern tool support through Vivado Design Suite. The Spartan-3 family remains fully supported for existing production designs.

What is the difference between XC3S1000-5FG320C and XC3S1000-5FG320I?

The only difference is the operating temperature range. The “C” suffix designates the commercial grade (0°C to +85°C), while the “I” suffix designates the industrial grade (-40°C to +100°C).


Summary

The XC3S1000-5FG320C is a proven, cost-effective FPGA that delivers 1 million system gates, 17,280 logic cells, 432 Kb of block RAM, 24 dedicated hardware multipliers, and four digital clock managers — all housed in a compact 320-ball Fine-Pitch BGA package. Its -5 speed grade ensures maximum timing performance, making it a reliable choice for embedded processing, DSP, communications, and industrial control applications. Backed by Xilinx ISE tooling and broad I/O standard support, this device continues to be a trusted component in both legacy and new designs across a wide range of industries.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.