The XC3S1000-5FG320C is a high-performance, cost-optimized field-programmable gate array (FPGA) from AMD Xilinx’s Spartan-3 family. Designed for high-volume, cost-sensitive applications, this device delivers 1,000,000 system gates, flexible I/O capabilities, and industry-leading programmability — all in a compact 320-ball Fine-Pitch BGA (FBGA) package. Whether you are designing embedded systems, digital signal processing pipelines, or communications hardware, the XC3S1000-5FG320C offers the logic density and speed performance engineers demand.
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What Is the XC3S1000-5FG320C?
The XC3S1000-5FG320C belongs to the Spartan-3 generation of Xilinx FPGAs — a family specifically engineered to lower the cost per logic cell while maintaining robust performance. The “5” in the part number designates the speed grade, with -5 being the fastest available grade in this family, making this device ideal for timing-critical designs. The “FG320” denotes the 320-ball Fine-Pitch BGA package, and the trailing “C” indicates the commercial temperature range (0°C to +85°C).
XC3S1000-5FG320C Key Specifications
| Parameter |
Value |
| Manufacturer |
AMD Xilinx |
| Series |
Spartan-3 |
| Part Number |
XC3S1000-5FG320C |
| Logic Cells |
17,280 |
| System Gates |
1,000,000 |
| CLB Slices |
7,680 |
| Flip-Flops |
15,360 |
| Distributed RAM |
120 Kb |
| Block RAM |
432 Kb |
| Multipliers (18×18) |
24 |
| DCM (Digital Clock Manager) |
4 |
| Maximum User I/O |
391 |
| Package |
FG320 (Fine-Pitch BGA, 320 balls) |
| Package Pitch |
1.00 mm |
| Speed Grade |
-5 (Fastest) |
| Operating Voltage (VCC INT) |
1.2V |
| I/O Voltage |
1.2V – 3.3V |
| Temperature Range |
0°C to +85°C (Commercial) |
| Technology Node |
90 nm |
| RoHS Compliant |
Yes |
XC3S1000-5FG320C Functional Overview
Logic Architecture
The XC3S1000-5FG320C is built around Xilinx’s Configurable Logic Block (CLB) architecture. Each CLB contains four slices, and each slice includes two 4-input Look-Up Tables (LUTs), two storage elements (flip-flops or latches), and dedicated carry logic. This gives designers enormous flexibility in implementing combinational and sequential logic across 17,280 total logic cells.
The device provides 120 Kb of distributed RAM (implemented within the LUTs) and 432 Kb of dedicated Block RAM organized as 18 Kb blocks. This combination makes the XC3S1000-5FG320C well-suited for buffering, FIFO design, and on-chip storage.
Digital Clock Management (DCM)
Four on-chip Digital Clock Managers (DCMs) provide powerful clock manipulation features, including:
- Clock frequency synthesis and multiplication
- Phase shifting and deskewing
- Clock mirroring and division
- Duty cycle correction
These DCMs eliminate the need for external clock conditioning circuitry, simplifying PCB design and reducing system cost.
Dedicated Multipliers
With 24 dedicated 18×18-bit hardware multipliers, the XC3S1000-5FG320C accelerates DSP and arithmetic-intensive operations. These multipliers can be cascaded or used in parallel to build multiply-accumulate (MAC) structures for signal processing, motor control, and image processing pipelines.
I/O Architecture and Standards
The XC3S1000-5FG320C supports a wide range of single-ended and differential I/O standards, providing maximum flexibility for interfacing with external devices.
| I/O Standard Type |
Supported Standards |
| Single-Ended |
LVCMOS33, LVCMOS25, LVCMOS18, LVCMOS15, LVCMOS12, LVTTL, PCI, SSTL |
| Differential |
LVDS, LVPECL, BLVDS, DIFF_SSTL, RSDS |
| Voltage Ranges |
1.2V, 1.5V, 1.8V, 2.5V, 3.3V |
Each I/O bank can be independently powered, allowing mixed-voltage designs on a single device.
Package Information: FG320 Fine-Pitch BGA
The XC3S1000-5FG320C is housed in a 320-ball Fine-Pitch BGA (FBGA) package with a 1.00 mm ball pitch and a 19mm × 19mm body size. This compact, surface-mount package is appropriate for space-constrained PCB designs and supports automated reflow soldering processes.
| Package Parameter |
Detail |
| Package Type |
Fine-Pitch BGA (FBGA) |
| Ball Count |
320 |
| Ball Pitch |
1.00 mm |
| Body Size |
19 mm × 19 mm |
| Mounting Type |
Surface Mount |
| Height (max) |
2.47 mm |
Speed Grade -5: What It Means for Your Design
The -5 speed grade is the fastest available for the Spartan-3 1000K family. A higher speed grade (lower absolute number for Xilinx) translates to tighter timing parameters, including:
- Faster combinatorial logic propagation delays through LUTs and interconnects
- Higher maximum clock frequencies for synchronous designs
- Shorter setup and hold times, enabling operation with faster external interfaces
- Better performance margins in tight timing closure scenarios
Designers targeting demanding clock frequencies — for example, processors, high-speed serial bridges, or memory controllers — should prioritize the -5 grade over the slower -4 variant.
XC3S1000-5FG320C Electrical Characteristics
| Parameter |
Min |
Typical |
Max |
Unit |
| VCCINT (Core Voltage) |
1.14 |
1.20 |
1.26 |
V |
| VCCAUX (Auxiliary Voltage) |
2.375 |
2.50 |
2.625 |
V |
| VCCO (I/O Supply) |
1.14 |
— |
3.465 |
V |
| Operating Temperature |
0 |
— |
+85 |
°C |
| Junction Temperature (Tj max) |
— |
— |
125 |
°C |
| Static ICC (Standby) |
— |
~13 |
— |
mA |
Supported Design Tools and Programming
Xilinx ISE Design Suite
The XC3S1000-5FG320C is fully supported by the Xilinx ISE Design Suite, particularly ISE 14.7 — the last version with Spartan-3 family support. ISE provides:
- HDL synthesis (VHDL and Verilog)
- Place-and-route tools optimized for Spartan-3 architecture
- Timing analysis and constraint management (UCF files)
- FPGA Editor for manual placement review
- iMPACT programming tool for JTAG and configuration
Configuration Modes
| Mode |
Description |
| Master Serial |
External serial Flash (e.g., SPI PROM) drives configuration |
| Slave Serial |
External host serially loads configuration data |
| Master Parallel (SelectMAP) |
Byte-wide parallel configuration from external memory |
| Slave Parallel (SelectMAP) |
Processor-controlled parallel configuration |
| JTAG |
In-system programming via IEEE 1149.1 boundary scan |
| Master SPI |
SPI Flash directly attached |
The device retains its configuration in an external non-volatile memory (PROM) since Spartan-3 devices are SRAM-based and require reconfiguration on every power-up.
Typical Applications for the XC3S1000-5FG320C
The XC3S1000-5FG320C is a versatile device suited for a broad range of embedded and signal processing applications.
| Application Domain |
Use Case Examples |
| Industrial Automation |
Motor controllers, PLC I/O expansion, real-time control |
| Communications |
Protocol bridging, packet processing, MAC layer logic |
| Consumer Electronics |
Video processing, display controllers, set-top boxes |
| Medical Devices |
Signal acquisition front-ends, data formatting |
| Test & Measurement |
Logic analyzers, pattern generators, data capture |
| Automotive (non-safety critical) |
Infotainment processing, sensor interfaces |
| Embedded Processing |
Soft-core CPU (MicroBlaze, PicoBlaze) integration |
| DSP / Image Processing |
FIR/IIR filters, FFT engines, image scaling |
XC3S1000-5FG320C vs. Other Spartan-3 Variants
The table below compares the XC3S1000 to neighboring devices in the Spartan-3 family to help designers select the right density.
| Device |
System Gates |
Logic Cells |
Block RAM |
Multipliers |
Max User I/O |
| XC3S200 |
200K |
4,320 |
216 Kb |
12 |
173 |
| XC3S400 |
400K |
8,064 |
288 Kb |
16 |
264 |
| XC3S1000 |
1,000K |
17,280 |
432 Kb |
24 |
391 |
| XC3S1500 |
1,500K |
29,952 |
576 Kb |
32 |
487 |
| XC3S2000 |
2,000K |
46,080 |
720 Kb |
40 |
565 |
The XC3S1000 occupies the mid-range of the Spartan-3 family — offering significantly more logic density than the XC3S400 while remaining more cost-effective than the XC3S1500 and above.
Ordering Information
| Attribute |
Detail |
| Full Part Number |
XC3S1000-5FG320C |
| Manufacturer |
AMD Xilinx |
| Package |
FG320 (FBGA, 320-ball) |
| Speed Grade |
-5 |
| Temperature Grade |
C (Commercial, 0°C to +85°C) |
| RoHS Status |
RoHS Compliant |
| Product Status |
Active |
| Suggested Replacement |
Artix-7 (XC7A family) for new designs |
Note: For industrial temperature range requirements (-40°C to +100°C), consider the XC3S1000-5FG320I variant.
Frequently Asked Questions (FAQ)
What does the “-5” speed grade mean on the XC3S1000-5FG320C?
The “-5” denotes Xilinx’s fastest speed grade for the Spartan-3 1000K device. It provides the lowest propagation delays and supports the highest clock frequencies within this device variant.
Is the XC3S1000-5FG320C RoHS compliant?
Yes, the XC3S1000-5FG320C is RoHS compliant and uses lead-free solder ball material in the FBGA package.
What software is used to program the XC3S1000-5FG320C?
Xilinx ISE Design Suite (version 14.7 recommended) is the primary design tool. Configuration is performed using the iMPACT programmer via JTAG, or via a Xilinx Platform Flash PROM for standalone operation.
Can I replace the XC3S1000-5FG320C with a newer Xilinx FPGA?
For new designs, AMD Xilinx recommends migrating to the Artix-7 family (e.g., XC7A35T or XC7A50T), which offers lower power, higher performance, and modern tool support through Vivado Design Suite. The Spartan-3 family remains fully supported for existing production designs.
What is the difference between XC3S1000-5FG320C and XC3S1000-5FG320I?
The only difference is the operating temperature range. The “C” suffix designates the commercial grade (0°C to +85°C), while the “I” suffix designates the industrial grade (-40°C to +100°C).
Summary
The XC3S1000-5FG320C is a proven, cost-effective FPGA that delivers 1 million system gates, 17,280 logic cells, 432 Kb of block RAM, 24 dedicated hardware multipliers, and four digital clock managers — all housed in a compact 320-ball Fine-Pitch BGA package. Its -5 speed grade ensures maximum timing performance, making it a reliable choice for embedded processing, DSP, communications, and industrial control applications. Backed by Xilinx ISE tooling and broad I/O standard support, this device continues to be a trusted component in both legacy and new designs across a wide range of industries.