Meta Description: The XC2S200-6FGG1135C is a Xilinx Spartan-II FPGA with 200,000 system gates, Speed Grade -6, Pb-free FGG BGA package, and commercial temperature range. Read full specs, features, and ordering info.

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The XC2S200-6FGG1135C is a high-performance Field-Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, up to 200 MHz system performance, and a Pb-free Fine-Pitch Ball Grid Array (FGG) package — making it a powerful alternative to mask-programmed ASICs. Whether you are developing communications equipment, embedded systems, or consumer electronics, the XC2S200-6FGG1135C offers an exceptional balance of logic density, speed, and flexibility.

For a broader overview of available options, explore our full range of Xilinx FPGA products.

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What Is the XC2S200-6FGG1135C?

The XC2S200-6FGG1135C belongs to the Xilinx Spartan-II 2.5V FPGA family — a proven, cost-optimized FPGA platform built on Xilinx’s 0.18µm process technology. The part number encodes all critical ordering information:

The -6 speed grade is the fastest available for the Spartan-II family and is exclusively offered in the Commercial temperature range — making the XC2S200-6FGG1135C the optimal choice for high-speed commercial designs with demanding timing requirements.

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XC2S200-6FGG1135C Key Specifications

The table below summarizes the essential electrical and logic specifications of the XC2S200-6FGG1135C.

Core Logic & Memory Specifications

Electrical & Package Specifications

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XC2S200-6FGG1135C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1135C is built around a 28 × 42 array of Configurable Logic Blocks (CLBs). Each CLB contains four logic cells, and each logic cell includes a 4-input Look-Up Table (LUT), a carry chain, and a flip-flop. This architecture allows designers to implement complex combinatorial and sequential logic with high efficiency.

Input/Output Blocks (IOBs)

The device supports up to 284 user-programmable I/O pins, each implemented with flexible Input/Output Blocks (IOBs). These IOBs support a wide variety of single-ended and differential I/O standards, enabling seamless board-level integration.

Block RAM

The XC2S200-6FGG1135C includes 56K bits of dedicated block RAM, arranged in two columns on either side of the CLB array. Block RAM enables high-speed, synchronous data buffering for FIFOs, lookup tables, and co-processing tasks.

Distributed RAM

In addition to block RAM, the FPGA provides 75,264 bits of distributed RAM embedded within the CLB LUTs. This distributed memory is ideal for small, fast storage structures that require single-cycle access.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide robust clock management. DLLs eliminate clock-distribution delays, support clock multiplication and division, and allow phase shifting, enabling precise timing control across the entire device.

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Spartan-II Family Comparison Table

To understand where the XC2S200-6FGG1135C sits within the broader Spartan-II lineup, the table below compares all family members.

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic density, the most I/O, and the largest memory resources in the series.

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Key Features of the XC2S200-6FGG1135C

The XC2S200-6FGG1135C stands out due to a rich set of built-in features that support fast, reliable digital design:

• Speed Grade -6 — the fastest available speed grade in the Spartan-II family, exclusively available in commercial temperature range
• Pb-Free (FGG) Package — compliant with RoHS and modern environmental standards
• Four Delay-Locked Loops for precise, jitter-free clock management
• Boundary Scan (JTAG) Support for in-system testing and programming
• SelectRAM+ Memory — seamless integration of distributed and block RAM
• Versatile Routing Architecture — hierarchical interconnect for efficient place-and-route
• 0.18µm Process Technology for low power consumption and high density
• 2.5V Core Voltage for compatibility with modern low-power system designs
• Multiple I/O Standards — supports LVTTL, LVCMOS, PCI, GTL, HSTL, SSTL, and more
• ASIC-replacement ready — avoids NRE costs and reduces time-to-market vs. custom silicon

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XC2S200-6FGG1135C Part Number Ordering Guide

How to Read the Xilinx Spartan-II Part Number

Understanding Xilinx part numbers helps engineers quickly identify the exact device needed. Below is a breakdown using the XC2S200-6FGG1135C as an example.

Temperature and Speed Grade Availability

Note: The -6 speed grade is exclusively available in the Commercial temperature range. If your application requires Industrial temperature operation, the -5 speed grade is the highest available option.

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Applications of the XC2S200-6FGG1135C

The XC2S200-6FGG1135C is designed for high-volume, cost-sensitive applications that demand programmability and performance. Common use cases include:

#### Communications & Networking

• Line-card processing
• Protocol bridging and conversion
• Packet inspection and filtering

#### Consumer Electronics

• Digital video processing
• Display controllers
• Audio signal processing

#### Industrial & Embedded Systems

• Motor control interfaces
• Sensor data acquisition
• Real-time control systems

#### Test & Measurement Equipment

• High-speed data capture
• Pattern generation
• Logic analysis front-ends

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Why Choose the XC2S200-6FGG1135C Over Mask-Programmed ASICs?

The Spartan-II XC2S200-6FGG1135C is a compelling ASIC alternative for several reasons:

1. No NRE costs — eliminates the expensive non-recurring engineering fees associated with custom ASIC tape-outs
2. Fast time-to-market — designs can be prototyped, validated, and deployed without waiting months for ASIC fabrication
3. Field reprogrammability — firmware and logic updates can be deployed in-system without any hardware replacement
4. Lower risk — design changes and bug fixes are possible post-deployment, unlike fixed ASICs
5. Cost-effective at volume — the Spartan-II family is specifically optimized for low per-unit cost in high-volume production runs

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Programming and Design Tools

The XC2S200-6FGG1135C is supported by Xilinx’s comprehensive design toolchain. Designers typically use:

• Xilinx ISE Design Suite — the primary synthesis, implementation, and bitstream generation tool for Spartan-II devices
• VHDL / Verilog / SystemVerilog — industry-standard HDLs for RTL design
• JTAG-based configuration — using Xilinx Platform Cable USB or similar JTAG programmers
• SelectMAP or Serial configuration — for production programming via external configuration PROMs

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XC2S200-6FGG1135C vs. Related Variants

Engineers frequently compare the XC2S200-6FGG1135C against other variants in the same family. The table below highlights key differences.

The XC2S200-6FGG1135C offers the highest I/O access density among BGA package options, making it the preferred choice when maximum board-level connectivity is required.

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Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1135C used for?

The XC2S200-6FGG1135C is used in communications, embedded control, consumer electronics, and test equipment applications that require programmable digital logic with high gate density and fast timing performance.

What does the “-6” speed grade mean in XC2S200-6FGG1135C?

The -6 speed grade is the fastest speed grade in the Spartan-II family. It supports higher clock frequencies and tighter propagation delay budgets. This speed grade is available only in the commercial temperature range (0°C to +85°C).

Is the XC2S200-6FGG1135C RoHS compliant?

Yes. The FGG suffix in the part number indicates that the package uses Pb-free (lead-free) solder balls, making it compliant with RoHS environmental regulations.

What is the core supply voltage for the XC2S200-6FGG1135C?

The XC2S200-6FGG1135C operates with a 2.5V core supply voltage (VCCINT), with I/O banks supporting 3.3V or 2.5V depending on the I/O standard used.

Can the XC2S200-6FGG1135C replace an ASIC?

Yes. The Spartan-II family was specifically designed as a cost-effective ASIC replacement. It eliminates NRE costs, supports fast prototyping, and can be reprogrammed in the field — advantages that fixed ASICs simply cannot match.

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Summary

The XC2S200-6FGG1135C is the top-tier member of the Xilinx Spartan-II FPGA family, combining 200,000 system gates, 5,292 logic cells, 284 user I/Os, 56K bits of block RAM, and four Delay-Locked Loops in a Pb-free FGG BGA package. With the fastest available -6 speed grade, this device is engineered for demanding commercial applications where performance, flexibility, and cost efficiency are all critical requirements.

Whether you are prototyping a new design, replacing an ASIC, or scaling up for volume production, the XC2S200-6FGG1135C delivers the programmability and performance your project demands.