The XC2S200-6FGG1134C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s proven Spartan-II family. This programmable logic device delivers 200,000 system gates, 5,292 logic cells, and a 1,134-ball Pb-free Fine-Pitch BGA package — making it one of the most capable devices in the Spartan-II lineup. Whether you are designing embedded systems, digital signal processing circuits, or high-volume industrial applications, the XC2S200-6FGG1134C offers a compelling balance of logic density, I/O flexibility, and cost efficiency.

What Is the XC2S200-6FGG1134C?

The XC2S200-6FGG1134C is a member of the Xilinx Spartan-II 2.5V FPGA family. The part number breaks down as follows:

This device is designed as a cost-effective, production-ready alternative to mask-programmed ASICs. Unlike ASICs, the XC2S200-6FGG1134C allows in-field reprogramming, eliminating the need for hardware replacement when design changes are required.

XC2S200-6FGG1134C Key Specifications

Core Logic Resources

Electrical & Timing Characteristics

Package Information

Note: The FGG1134 package provides the highest pin count option available for the XC2S200 device, offering maximum I/O routing flexibility for complex board designs.

XC2S200-6FGG1134C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1134C is built around a matrix of 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB contains four logic cells, and every logic cell includes a 4-input Look-Up Table (LUT), a storage element (flip-flop), and dedicated carry logic. This architecture supports both combinational and sequential logic implementations with high efficiency.

Block RAM

The device integrates two columns of dedicated block RAM, positioned on opposite sides of the die between the CLB columns and the IOB columns. The total block RAM capacity is 56K bits, organized into multiple independent 4K-bit blocks. This dedicated memory is ideal for FIFOs, lookup tables, and local data buffering in embedded applications.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1134C features up to 284 user-configurable I/O pins (not including the four dedicated global clock inputs). Each IOB supports:

• Programmable input delay (for setup time optimization)
• Selectable output slew rate control
• Optional pull-up, pull-down, or keeper circuits
• 3-state output control
• Compatibility with multiple I/O standards (LVTTL, LVCMOS2, PCI, SSTL, GTL, and more)

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) are placed at the four corners of the die. These DLLs provide:

• Zero-delay clock buffering
• Frequency synthesis (multiply and divide)
• Phase shifting for clock domain alignment
• Internal clock de-skewing

Supported I/O Standards

The XC2S200-6FGG1134C supports a wide range of industry-standard I/O interfaces, enabling seamless integration with modern digital systems.

Spartan-II Family Comparison: Where XC2S200 Fits

The table below compares the XC2S200 with its siblings in the Spartan-II FPGA family, helping you understand where this device sits in the lineup.

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the maximum logic resources, I/O count, and memory available in this product line.

Why Choose the XC2S200-6FGG1134C for Your Design?

#### Speed Grade -6: Maximum Performance

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the commercial temperature range. This makes the XC2S200-6FGG1134C the top choice for timing-critical applications where maximum operating frequency is essential.

#### 1,134-Pin FGG Package: High I/O Density

The FGG1134 package offers the highest ball count available for the XC2S200 device. This is especially valuable for designs that require dense interconnects, multiple bus interfaces, or high-speed parallel data paths on a single chip.

#### ASIC Alternative: Lower Cost, Faster Time-to-Market

The XC2S200-6FGG1134C is a superior alternative to mask-programmed ASICs. Key advantages include:

• No NRE (Non-Recurring Engineering) costs — unlike ASICs, no mask set is required
• In-field reprogrammability — update your design without hardware replacement
• Shorter development cycles — prototype and iterate faster
• Lower production risk — reduce the danger of costly ASIC respins

#### Cost-Effective High-Volume Solution

Spartan-II FPGAs are specifically designed for high-volume production environments. The XC2S200-6FGG1134C delivers a rich feature set at a competitive price point, making it well-suited for consumer electronics, industrial controls, and networking equipment.

Typical Applications for XC2S200-6FGG1134C

The XC2S200-6FGG1134C is used across a wide range of industries and applications, including:

Configuration and Programming

Configuration Modes

The XC2S200-6FGG1134C supports multiple configuration modes for flexible deployment:

• Master Serial — using Xilinx Platform Flash PROMs (XCF01S, XCF02S, etc.)
• Slave Serial — driven by an external microcontroller or host
• SelectMAP (Slave Parallel) — high-speed 8-bit parallel configuration
• JTAG (Boundary Scan) — IEEE 1149.1-compliant in-system programming and debug

Supported Development Tools

Xilinx’s legacy ISE Design Suite is the primary toolchain for Spartan-II development. Engineers working with this device typically use:

Ordering Information & Part Number Decoder

When ordering the XC2S200-6FGG1134C, every segment of the part number carries specific meaning:

XC  2S  200  -6  FGG  1134  C
│   │    │    │   │     │    └─ Temperature: C = Commercial (0°C to +85°C)
│   │    │    │   │     └────── Pin Count: 1134 balls
│   │    │    │   └──────────── Package: FGG = Fine-Pitch BGA, Pb-Free
│   │    │    └──────────────── Speed Grade: -6 (fastest)
│   │    └───────────────────── Gate Count: 200K system gates
│   └────────────────────────── Family: 2S = Spartan-II
└────────────────────────────── Manufacturer: XC = Xilinx

The “G” in “FGG” indicates the Pb-Free (RoHS-compliant) package variant, in contrast to the standard “FG” designation used for leaded packages.

XC2S200-6FGG1134C vs. Competing FPGA Devices

While newer families offer lower core voltages and deeper block RAM, the XC2S200-6FGG1134C remains a proven and widely available legacy device ideal for design maintenance, repair, and replacement applications.

Absolute Maximum Ratings

⚠️ Warning: Exceeding absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and do not imply functional operation at these conditions.

Recommended Operating Conditions

Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean on the XC2S200-6FGG1134C?

The -6 speed grade is the fastest available in the Spartan-II family. A lower speed grade number indicates faster timing performance. This speed grade is only available in the commercial temperature range (0°C to +85°C) and is not offered for industrial variants.

Is the XC2S200-6FGG1134C still in production?

The Xilinx Spartan-II family is classified as an end-of-life (EOL) product line. However, authorized distributors and specialty component suppliers continue to maintain stock for customers who require replacement units for legacy designs. Always source from reputable, authorized suppliers to ensure authenticity.

What is the difference between FGG1134 and FG456 packages?

Both are Fine-Pitch BGA packages for the XC2S200. The FGG1134 provides 1,134 total balls (Pb-Free, larger body) while the FGG456 provides 456 balls (Pb-Free, smaller body). The FGG1134 package is suitable for designs requiring maximum I/O access and is common in applications with dense routing requirements.

Can the XC2S200-6FGG1134C be used for industrial temperature applications?

No. The “C” suffix indicates the commercial temperature range only (0°C to +85°C). For industrial temperature applications requiring –40°C to +100°C, the corresponding “I” suffix variant should be selected.

What configuration PROM should I use with the XC2S200-6FGG1134C?

Xilinx recommends using Platform Flash PROMs from the XCF series (e.g., XCF01S, XCF02S, XCF04S) for serial master configuration. These PROMs are specifically designed to interface with Spartan-II FPGAs and support in-system programming via JTAG.

Where to Buy the XC2S200-6FGG1134C

The XC2S200-6FGG1134C is available from authorized electronic component distributors and specialty FPGA suppliers worldwide. When purchasing, always verify:

1. Authenticity — Purchase from authorized or reputable distributors to avoid counterfeit parts
2. Date Code — Check for recent or appropriate date codes for your application
3. RoHS Compliance — The “G” in FGG confirms Pb-free compliance
4. Packaging — Ensure components are shipped in ESD-safe packaging (tape & reel or tray)

For a broader selection of Xilinx programmable logic devices, visit our Xilinx FPGA product catalog.

Summary

The XC2S200-6FGG1134C is Xilinx’s largest Spartan-II FPGA, packaged in a 1,134-ball Pb-free Fine-Pitch BGA with the fastest available -6 commercial speed grade. With 200,000 system gates, 5,292 logic cells, 284 user I/Os, 75K bits of distributed RAM, and 56K bits of block RAM, it delivers exceptional logic density and flexibility for high-volume embedded and digital design applications.

Its reprogrammable architecture, ASIC-alternative economics, and broad I/O standard support make it a reliable choice for both new designs and long-term legacy system maintenance. As a proven 0.18 µm CMOS device operating at a 2.5V core supply, the XC2S200-6FGG1134C continues to serve engineers who need a dependable, feature-rich FPGA solution.