The XC2S200-6FGG1130C is a high-density, 2.5V Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family — engineered to deliver powerful programmable logic performance in cost-sensitive, high-volume applications. Whether you’re designing embedded systems, digital signal processing pipelines, or communications hardware, this device offers the ideal balance of logic density, I/O flexibility, and speed.

If you’re sourcing Xilinx Spartan-II FPGAs, explore the full lineup at Xilinx FPGA to find the right part for your design.

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What Is the XC2S200-6FGG1130C?

The XC2S200-6FGG1130C is the largest member of the Spartan-II FPGA family, combining 200,000 system gates with 5,292 logic cells in a compact, lead-free Fine-Pitch Ball Grid Array (FBGA) package. The part number breaks down as follows:

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XC2S200-6FGG1130C Key Specifications

Core Logic Architecture

Device Configuration & Electrical Characteristics

Clock & DLL Resources

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XC2S200-6FGG1130C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 is built around a matrix of 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB contains four logic cells, and each logic cell includes a 4-input Look-Up Table (LUT), a flip-flop, and carry/control logic. This architecture provides:

• Efficient implementation of combinational and sequential logic
• Support for distributed RAM using the LUTs
• Fast carry chains for arithmetic-intensive designs

Input/Output Blocks (IOBs)

With up to 284 user-configurable I/O pins, the XC2S200-6FGG1130C supports a wide range of I/O standards. Each IOB includes input and output registers, programmable pull-up/pull-down resistors, and support for multiple logic voltage standards including LVTTL, LVCMOS, GTL, GTL+, HSTL, and SSTL.

Block RAM

Two columns of dedicated Block RAM run along opposite sides of the die, providing 56K bits of true dual-port synchronous RAM. Block RAM is ideal for FIFOs, data buffers, lookup tables, and on-chip memory in DSP or communications applications.

Delay-Locked Loops (DLLs)

Four on-chip DLLs — located at each corner of the die — allow designers to eliminate clock-distribution skew, multiply or divide clock frequencies, and shift clock phase. This is critical for high-speed synchronous designs and data capture interfaces.

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Configuration Modes

The XC2S200-6FGG1130C supports multiple configuration modes, giving designers flexibility in how the FPGA is programmed at startup:

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Spartan-II Family Comparison: Where Does XC2S200 Fit?

The XC2S200 sits at the top of the Spartan-II density range. Here’s how it compares to other members of the family:

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Why Choose the -6 Speed Grade?

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the commercial temperature range. It is ideal for timing-critical designs where setup and hold margins are tight. Key benefits of the -6 grade include:

• Faster propagation delays across CLBs and routing
• Higher maximum system clock frequencies
• Better performance in high-throughput data paths
• Compatibility with demanding FPGA-to-CPU or FPGA-to-memory interfaces

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FGG1130 Package Details

The FGG (Fine-Pitch Ball Grid Array, Pb-Free) package with 1,130 pins is designed for PCB designs requiring dense I/O routing and minimal board footprint. Key package characteristics:

The Pb-free designation (“G” in FGG) ensures RoHS compliance, making this part suitable for export to markets with strict environmental regulations including the EU and Japan.

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Typical Applications of the XC2S200-6FGG1130C

The XC2S200-6FGG1130C is widely used across industries that demand programmable, high-density logic with fast performance:

#### Industrial & Embedded Control

• Motor drive control and PLC implementations
• Real-time sensor fusion and data acquisition
• Custom embedded processor cores

#### Communications & Networking

• Protocol bridging (UART, SPI, I²C, PCI)
• Data framing, multiplexing, and switching
• High-speed serial interface controllers

#### Digital Signal Processing (DSP)

• FIR and IIR filter implementations
• FFT engines for audio and image processing
• Waveform generation and modulation

#### Test & Measurement

• Logic analyzer front-ends
• Arbitrary waveform pattern generation
• JTAG boundary-scan test systems

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XC2S200-6FGG1130C vs. XC2S200-5FGG1130C: Speed Grade Comparison

Many engineers compare the -6 and -5 speed grades. Here’s a quick side-by-side:

Choose the -6 grade when clock performance is the top priority. Choose the -5 grade when you need industrial temperature support (-40°C to +85°C).

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Ordering & Availability

The XC2S200-6FGG1130C is a legacy Xilinx Spartan-II device. When purchasing, verify the following to ensure authenticity:

• Authorized distributors: Digikey, Mouser, Arrow, Avnet
• Lot code and date code should be clearly marked on the package
• Lead-free packaging is confirmed by the “G” in the FGG package designation
• Beware of counterfeit parts — always buy from authorized or reputable sources

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Summary: Is the XC2S200-6FGG1130C Right for Your Design?

The XC2S200-6FGG1130C is an excellent choice if you need:

• High logic density — 200K gates and 5,292 logic cells
• Fast speed — the -6 grade delivers the best timing performance in the Spartan-II lineup
• Abundant I/O — up to 284 user I/Os with multi-standard support
• On-chip memory — 75K bits distributed RAM + 56K bits block RAM
• RoHS-compliant packaging — lead-free FGG package for global market compliance

For designers working with legacy Xilinx programmable logic or those evaluating Spartan-II FPGAs for new applications, the XC2S200-6FGG1130C remains a capable and widely understood device with a rich ecosystem of development tools and IP cores.