The XC3S1500-4FG456I is a high-performance, industrial-grade Field Programmable Gate Array (FPGA) from AMD Xilinx’s Spartan-3 family. Designed for cost-sensitive, high-volume applications, this device delivers powerful logic density, robust I/O capabilities, and reliable operation across extended temperature ranges. Whether you’re designing embedded systems, telecommunications equipment, or industrial control boards, the XC3S1500-4FG456I provides the flexibility and density you need.
What Is the XC3S1500-4FG456I?
The XC3S1500-4FG456I is part of the Spartan-3 FPGA series — one of AMD Xilinx’s most successful programmable logic families. The “1500” in the part number refers to 1.5 million system gates, making it one of the mid-to-high density options in the Spartan-3 lineup. The “4” denotes the speed grade (faster switching), “FG456” identifies the Fine-pitch Ball Grid Array (FBGA) 456-ball package, and “I” designates the industrial temperature grade.
This FPGA is ideal for engineers and procurement teams sourcing reliable Xilinx FPGA components for production or prototyping.
XC3S1500-4FG456I Key Specifications
General Device Parameters
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XC3S1500-4FG456I |
| Series |
Spartan-3 |
| Family |
Spartan® 3 |
| Technology |
SRAM-based FPGA |
| Configuration |
JTAG / Master Serial / Slave Serial |
Logic & Memory Resources
| Resource |
Specification |
| System Gates |
1,500,000 |
| Logic Cells |
33,096 |
| CLB Slices |
13,312 |
| CLB Flip-Flops |
26,624 |
| Maximum Distributed RAM |
208 Kb |
| Block RAM |
576 Kb |
| Block RAM Blocks |
32 |
| Dedicated Multipliers (18×18) |
32 |
I/O and Package Details
| Parameter |
Value |
| Package Type |
FBGA (Fine-pitch Ball Grid Array) |
| Package Code |
FG456 |
| Total Ball Count |
456 |
| Maximum User I/Os |
333 |
| I/O Standards Supported |
LVTTL, LVCMOS, SSTL, HSTL, LVDS, BLVDS, RSDS, PCI, GTL+ |
| Differential I/O Pairs |
Up to 166 |
Electrical & Thermal Characteristics
| Parameter |
Value |
| Core Supply Voltage (VCCINT) |
1.2V |
| I/O Supply Voltage (VCCO) |
1.2V – 3.3V |
| Operating Temperature Range |
–40°C to +100°C (Industrial Grade “I”) |
| Speed Grade |
–4 (Fastest in Spartan-3 family) |
Ordering & Compliance Information
| Parameter |
Value |
| DigiKey Part Number |
122-1486-ND |
| Status |
Active |
| RoHS Compliance |
Compliant |
| Moisture Sensitivity Level (MSL) |
3 / 168 Hours |
| Export Control (ECCN) |
3A001.a.7.b |
| HTSUS |
8542.39.00.01 |
XC3S1500-4FG456I Features and Benefits
High Logic Density for Complex Designs
With 1.5 million system gates and over 33,000 logic cells, the XC3S1500-4FG456I handles complex digital logic designs without requiring more expensive high-end FPGAs. This density is suitable for implementing soft-core processors, digital signal processing pipelines, and advanced control algorithms.
Industrial-Grade Temperature Rating
The “I” suffix certifies operation from –40°C to +100°C, making this FPGA suitable for:
- Industrial automation and motor control
- Automotive test equipment
- Military and defense prototyping (with additional qualification)
- Outdoor or harsh-environment electronics
High-Speed Performance with Speed Grade –4
The –4 speed grade is the fastest available in the Spartan-3 family, ensuring minimal propagation delays and higher system clock frequencies. This is critical for real-time data processing, high-speed communication interfaces, and latency-sensitive applications.
Flexible I/O Standards
Supporting over 20 I/O standards including LVDS, SSTL, HSTL, and PCI, the XC3S1500-4FG456I interfaces seamlessly with DDR memory, FPGAs, DSPs, microcontrollers, and a wide range of peripherals.
Embedded Dedicated Multipliers
With 32 dedicated 18×18 multipliers, this FPGA supports hardware-accelerated DSP functions such as FIR filters, FFTs, and arithmetic-intensive algorithms — without consuming general-purpose logic resources.
XC3S1500-4FG456I vs. Other Spartan-3 Devices
| Device |
System Gates |
Logic Cells |
Block RAM |
Multipliers |
Max I/Os |
Package Options |
| XC3S200 |
200K |
4,320 |
72 Kb |
12 |
141 |
TQ144, FT256, PQ208 |
| XC3S400 |
400K |
8,064 |
288 Kb |
16 |
264 |
TQ144, FT256, PQ208, FG456 |
| XC3S1500 |
1.5M |
33,096 |
576 Kb |
32 |
333 |
FG456, FG676 |
| XC3S4000 |
4M |
62,208 |
1,728 Kb |
96 |
489 |
FG676, FG900 |
The XC3S1500 sits in the sweet spot for mid-range applications — offering significantly more logic than entry-level Spartan-3 devices while remaining cost-effective compared to larger gate-count FPGAs.
Typical Applications for XC3S1500-4FG456I
#### Embedded Processing Systems
Implement soft-core processors (e.g., MicroBlaze) with custom peripheral interfaces and memory controllers.
#### Industrial Control and Automation
Execute complex control loops, sensor fusion, and communication stacks with deterministic timing on the factory floor.
#### Telecommunications and Networking
Handle protocol processing, data framing, clock recovery, and line interface functions in telecom line cards and switches.
#### Video and Image Processing
Buffer and process video streams, implement scan conversion, de-interlacing, or custom image enhancement algorithms.
#### Test and Measurement Equipment
Build flexible signal capture, pattern generation, and protocol analysis functions into benchtop and rack-mounted instruments.
#### High-Speed Data Acquisition
Interface with high-speed ADCs and DACs using LVDS I/O for noise-immune, differential signal transmission.
Development Tools and Design Resources
| Tool / Resource |
Description |
| Xilinx ISE Design Suite |
Primary development tool for Spartan-3 synthesis, implementation, and programming |
| ModelSim / ISIM |
RTL and post-implementation simulation |
| ChipScope Pro |
On-chip logic analyzer for in-system debugging |
| CORE Generator |
IP core library including memory controllers, FIFOs, DSP blocks |
| Reference Designs |
Available for common interfaces: DDR SDRAM, SPI, I2C, UART, Ethernet MAC |
| JTAG Programming |
Supported via Xilinx Platform Cable USB or compatible JTAG programmers |
Note: Xilinx ISE is the supported toolchain for Spartan-3 devices. Vivado does not support Spartan-3.
Package and PCB Design Considerations
FG456 FBGA Package Details
| Parameter |
Value |
| Package Body Size |
23 mm × 23 mm |
| Ball Pitch |
1.0 mm |
| Ball Array |
22 × 22 (456 populated) |
| Package Height |
2.6 mm (max) |
| PCB Land Pattern |
SMD (Solder Mask Defined) recommended |
PCB Design Tips for FG456 BGA
- Use via-in-pad or dogleg routing for inner-row ball escape routing.
- Follow Xilinx’s PCB design guidelines for decoupling capacitor placement on VCCINT and VCCO rails.
- Place bulk capacitors (10µF–100µF) near the power rails.
- Ensure adequate ground plane continuity under the BGA package.
- Consider X-ray inspection during prototyping to verify solder joint quality.
Frequently Asked Questions (FAQ)
What does the “I” suffix mean in XC3S1500-4FG456I?
The “I” designates the Industrial temperature grade, meaning the device is rated to operate from –40°C to +100°C. The alternative “C” suffix (commercial grade) is rated only from 0°C to 85°C.
What is the speed grade –4 in the XC3S1500?
Speed grade –4 indicates the fastest timing performance available for this device. A lower number (e.g., –5) would be slower. The –4 grade ensures shorter propagation delays and supports higher maximum clock frequencies.
Can the XC3S1500-4FG456I be programmed in-system?
Yes. The device supports in-system programming (ISP) via its JTAG interface (IEEE 1149.1 compliant). It can also be configured using SPI Flash, Parallel Flash, or a host processor.
Is the XC3S1500-4FG456I RoHS compliant?
Yes. The XC3S1500-4FG456I is fully RoHS compliant, meaning it contains no restricted hazardous substances such as lead, mercury, or cadmium.
What software do I need to program the XC3S1500-4FG456I?
Use Xilinx ISE Design Suite (version 14.7 is the final version supporting Spartan-3). This free-to-download toolchain handles HDL synthesis, place and route, bitstream generation, and device programming via iMPACT.
Summary
The XC3S1500-4FG456I is a proven, industrial-grade FPGA offering an excellent balance of logic density, I/O flexibility, and cost efficiency. Its 1.5 million system gates, 576 Kb block RAM, 32 dedicated multipliers, and 333 user I/Os in a compact 456-ball FBGA package make it a versatile choice for demanding embedded and industrial designs. The industrial temperature rating (–40°C to +100°C) and speed grade –4 ensure reliable operation in harsh environments and high-performance applications alike.
For design support, datasheets, and IBIS models, consult the AMD Xilinx product documentation portal or your authorized distributor.
