Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3S1500-4FGG456I: Xilinx Spartan-3 FPGA – Complete Product Guide

Product Details

The XC3S1500-4FGG456I is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx (now AMD), part of the industry-proven Spartan-3 family. Featuring 1.5 million system gates, a 456-pin FBGA package, and industrial-grade temperature tolerance, this device is engineered for demanding embedded design, industrial automation, communications infrastructure, and consumer electronics applications. Whether you are prototyping a complex digital system or deploying a production-ready solution, the XC3S1500-4FGG456I delivers the performance, flexibility, and reliability that engineers demand.

For a full range of programmable logic devices, explore our collection of Xilinx FPGA products.


XC3S1500-4FGG456I Key Specifications at a Glance

Parameter Value
Manufacturer Xilinx (AMD)
Part Number XC3S1500-4FGG456I
Family Spartan-3
System Gates 1,500,000
Logic Cells 29,952
CLBs (Configurable Logic Blocks) 3,328
Maximum Frequency 630 MHz
Technology Node 90 nm
Supply Voltage 1.2 V (1.14 V – 1.26 V)
I/O Count 333
Package Type 456-Pin FBGA (Fine-Pitch Ball Grid Array)
Operating Temperature –40°C to +100°C (TJ)
Mount Type Surface Mount (SMD)
Speed Grade –4
Total RAM Bits 589,824

What Is the XC3S1500-4FGG456I?

The XC3S1500-4FGG456I is a member of the Xilinx Spartan-3 FPGA family, a series spanning densities from 50,000 to 5,000,000 system gates. Built on a proven 90 nm process technology, this device brings significant advancements over earlier Spartan-IIE devices — including expanded logic resources, higher internal RAM capacity, more I/O pins, and improved clock management.

The Spartan-3 architecture draws heavily from Xilinx’s premium Virtex-II platform, delivering an impressive performance-per-dollar ratio that was unprecedented at launch and remains highly competitive today. This makes the XC3S1500-4FGG456I especially attractive for high-volume, cost-sensitive deployments.

How FPGAs Differ from ASICs

Unlike application-specific integrated circuits (ASICs), the XC3S1500-4FGG456I avoids the high non-recurring engineering (NRE) costs and long development cycles associated with custom silicon. It also supports in-field design updates without any hardware replacement — a critical advantage in iterative development environments and systems requiring post-deployment reconfiguration.


XC3S1500-4FGG456I Architecture & Logic Resources

Configurable Logic Blocks (CLBs)

The XC3S1500-4FGG456I contains 3,328 CLBs, each composed of four slices. Each slice includes two 4-input look-up tables (LUTs), two flip-flops, and carry logic. This architecture supports a wide variety of functions, from simple combinational logic to complex registered pipelines.

Resource Count
CLBs 3,328
Slices 13,312
Logic Cells 29,952
4-Input LUTs 26,624
Flip-Flops 26,624

Block RAM (BRAM)

The FPGA includes embedded Block RAM totaling 589,824 bits of on-chip memory. This allows designers to implement FIFOs, dual-port memories, lookup tables, and frame buffers without consuming CLB resources.

Dedicated Multipliers

The Spartan-3 family includes dedicated 18×18-bit multipliers optimized for DSP workloads such as filtering, signal processing, and arithmetic-intensive computations.


XC3S1500-4FGG456I Pinout & Package Details

456-Pin FBGA Package

The XC3S1500-4FGG456I is housed in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package, designed for high-density PCB integration. The compact footprint and fine-pitch ball arrangement make it ideal for space-constrained board designs.

Package Attribute Detail
Package Type FBGA (Fine-Pitch BGA)
Pin Count 456
User I/O Pins 333
Mounting Type Surface Mount
I/O Banks Multiple (for flexible voltage referencing)

I/O Capabilities

With 333 user I/O pins organized across multiple I/O banks, the XC3S1500-4FGG456I supports a wide range of interface standards, including LVTTL, LVCMOS, SSTL, HSTL, and differential signaling (LVDS, RSDS).


Performance Characteristics

Speed Grade –4

The “–4” speed grade in the part number denotes the device’s performance tier. The XC3S1500-4FGG456I achieves:

  • Maximum clock frequency: up to 630 MHz (internal)
  • Pin-to-pin logic delays: as low as 4.4 ns
  • Fast and deterministic timing suitable for real-time embedded control

Clock Management

The device features Digital Clock Managers (DCMs) that provide:

  • Clock multiplication and division
  • Phase shifting
  • Deskewing
  • Spread-spectrum clocking support

These capabilities ensure robust timing closure across complex multi-clock-domain designs.


XC3S1500-4FGG456I Industrial Temperature Grade

The suffix “I” in XC3S1500-4FGG456I indicates the Industrial temperature grade, with a junction temperature range of –40°C to +100°C. This makes it suitable for deployment in harsh environments where commercial-grade (0°C to 85°C) devices would be insufficient.

Grade Suffix Temperature Range
Commercial C 0°C to 85°C (TJ)
Industrial I –40°C to +100°C (TJ)

Applications of the XC3S1500-4FGG456I

Industrial Automation & Control

The wide operating temperature range and robust I/O structure make this FPGA ideal for motor drives, PLCs, robotics controllers, and factory automation systems requiring real-time processing with deterministic latency.

Embedded Communications & Networking

With 333 configurable I/O pins and fast serial capability, the XC3S1500-4FGG456I is well-suited for broadband access equipment, network switches, protocol bridges, and wireless basestation front-ends.

Consumer Electronics

Spartan-3 FPGAs were specifically architected for high-volume, cost-sensitive consumer applications, including digital TV, set-top boxes, home networking gateways, and portable consumer devices.

Automotive Systems

The industrial temperature rating qualifies the XC3S1500-4FGG456I for automotive control modules and sensor interface designs where reliability across temperature extremes is paramount.

Aerospace & Defense (COTS)

For commercial-off-the-shelf (COTS) defense applications requiring reconfigurable logic and extended temperature operation, this device fulfills the core requirements of many avionics and communications payloads.


XC3S1500-4FGG456I vs Similar Spartan-3 Devices

Part Number Gates I/O Package Temp Grade
XC3S1500-4FGG456I 1,500,000 333 456 FBGA Industrial
XC3S1500-4FGG456C 1,500,000 333 456 FBGA Commercial
XC3S1500-4FG676I 1,500,000 487 676 FBGA Industrial
XC3S1500-4FG320I 1,500,000 221 320 FBGA Industrial
XC3S1000-4FGG456I 1,000,000 333 456 FBGA Industrial
XC3S2000-4FGG456 2,000,000 333 456 FBGA Commercial

The XC3S1500-4FGG456I occupies the sweet spot in the Spartan-3 lineup — delivering 1.5M gates in the mid-density 456-pin package with full industrial-grade tolerance.


Design Tools & Programming

The XC3S1500-4FGG456I is fully supported by Xilinx’s ISE Design Suite, which provides:

  • Schematic and HDL (VHDL/Verilog) entry
  • Synthesis, implementation, and place-and-route
  • Timing analysis and simulation
  • Bitstream generation and JTAG programming

Configuration can be performed via:

  • JTAG boundary scan (for in-circuit programming)
  • Serial Flash (SPI) memory
  • Parallel NOR Flash memory
  • Platform Flash PROM (Xilinx XCF series)

Power Supply Requirements

Supply Rail Voltage Purpose
VCCINT 1.2 V (1.14–1.26 V) Core logic power
VCCO 1.2 V – 3.3 V I/O bank power
VCCAUX 2.5 V Auxiliary circuitry
GND 0 V Ground reference

Proper decoupling capacitors placed close to each supply pin are essential for stable operation and EMI compliance.


Ordering Information

Attribute Detail
Full Part Number XC3S1500-4FGG456I
DigiKey Part Number XC3S1500-4FGG456I-ND
Manufacturer AMD / Xilinx
RoHS Compliance Yes
Packaging Tray / Tape & Reel
Lead-Free Yes

Frequently Asked Questions (FAQ)

What does the “4” speed grade mean in XC3S1500-4FGG456I?

The “–4” speed grade indicates a mid-range performance tier within the Spartan-3 family. Lower speed grade numbers (e.g., –5) indicate faster parts, while –4 balances performance and cost for the majority of applications.

What is the difference between XC3S1500-4FGG456I and XC3S1500-4FGG456C?

The only difference is the temperature grade: the “I” suffix indicates industrial operation (–40°C to +100°C), while the “C” suffix indicates commercial operation (0°C to 85°C).

Is the XC3S1500-4FGG456I still in production?

As part of AMD’s Xilinx Spartan-3 legacy portfolio, the XC3S1500-4FGG456I is widely available through authorized distributors for production continuity programs. Always verify current stock with your preferred distributor.

What software do I need to design with the XC3S1500-4FGG456I?

Xilinx ISE Design Suite (version 14.7 is the final release) fully supports the Spartan-3 family. ISE 14.7 is available as a free download from the AMD Xilinx website.

Can the XC3S1500-4FGG456I be used in safety-critical applications?

Yes, subject to appropriate qualification and design margins. The industrial temperature grade and robust architecture make it suitable for many safety-relevant embedded systems, though designers must follow applicable functional safety standards (e.g., IEC 61508, ISO 26262) for their application domain.


Summary

The XC3S1500-4FGG456I is a proven, flexible, and cost-effective FPGA solution for engineers who need 1.5 million gates of reconfigurable logic in a 456-pin FBGA package with industrial temperature coverage. Its rich I/O count, embedded Block RAM, dedicated multipliers, and robust clock management capabilities make it one of the most versatile mid-density FPGAs in the Xilinx Spartan-3 lineup.

From industrial automation and embedded communications to consumer electronics and automotive control, the XC3S1500-4FGG456I continues to serve as a reliable foundation for complex programmable logic designs worldwide.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.