The XC2S200-6FGG1125C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family, built on 0.18µm CMOS technology. Designed to deliver 200,000 system gates with 5,292 logic cells in a robust 1125-pin Fine-Pitch Ball Grid Array (FBGA) package, this device is an industry-proven solution for engineers who need reliable, cost-effective programmable logic in commercial-grade applications. Whether you are designing communication systems, industrial control hardware, or embedded computing platforms, the XC2S200-6FGG1125C offers the capacity and flexibility to meet demanding project requirements.

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What Is the XC2S200-6FGG1125C? Understanding the Part Number

Before diving into specifications, it helps to decode the part number so buyers can confirm exactly what they are purchasing.

The “G” in FGG distinguishes this as a Pb-Free (lead-free) package, complying with RoHS environmental directives — an important consideration for products sold in the EU and other regulated markets.

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XC2S200-6FGG1125C Key Specifications at a Glance

The table below summarizes the most important electrical and physical specifications of the XC2S200-6FGG1125C.

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XC2S200-6FGG1125C Core Architecture: Inside the Spartan-II FPGA

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1125C is organized around a 28×42 array of Configurable Logic Blocks, totaling 1,176 CLBs. Each CLB contains four logic cells, with each cell featuring:

• A 4-input Look-Up Table (LUT) for implementing arbitrary combinational logic
• A D-type flip-flop for sequential logic and pipeline registers
• Dedicated carry logic for high-speed arithmetic operations
• Multiplexers for flexible signal routing

This architecture results in 5,292 equivalent logic cells, giving designers ample fabric for moderate-complexity digital designs, FSMs, custom processors, and control-plane logic.

Embedded Block RAM

One of the most valuable resources in the XC2S200-6FGG1125C is its 57,344 bits of on-chip block RAM, organized as 14 independent 4,096-bit dual-port synchronous RAM blocks. Key characteristics include:

• Fully synchronous read/write operation on both ports
• Independent control signals for each port (clock, enable, write enable)
• Configurable data widths per port (1-bit to 16-bit wide)
• Suitable for FIFOs, buffers, lookup tables, and local memory

Delay-Locked Loops (DLLs)

The device integrates four Delay-Locked Loops (DLLs), one at each corner of the die. These DLLs enable:

• Zero-skew clock distribution across the chip
• Clock frequency synthesis (multiply and divide)
• Phase shifting for capturing high-speed source-synchronous data
• Board-level clock deskewing via off-chip loopback

Input/Output Blocks (IOBs)

With 284 user I/O pins in the 1125-ball package, the XC2S200-6FGG1125C offers extensive connectivity. Each IOB supports:

• Programmable drive strength (2 mA to 24 mA)
• Slew rate control (fast or slow)
• Individually configurable pull-up, pull-down, or keeper circuits
• Multiple I/O standards including LVTTL, LVCMOS33, LVCMOS25, PCI, GTL, HSTL, SSTL

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XC2S200-6FGG1125C I/O Standards Supported

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Configuration Modes for XC2S200-6FGG1125C

The XC2S200-6FGG1125C supports multiple configuration interfaces, giving designers flexibility in how the FPGA loads its bitstream at power-up.

After configuration is complete, all unused I/O pins remain in a high-impedance state by default, protecting downstream circuitry from spurious signals.

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Speed Grade -6: What It Means for Your Design

The -6 speed grade is the fastest commercially available grade in the Spartan-II family. It is exclusively offered in the commercial temperature range (0°C to +85°C). For timing-critical paths, the -6 grade provides:

• Maximum system clock frequency up to 263 MHz
• Shorter propagation delays through the CLB fabric
• Faster I/O setup and hold times
• Tighter skew across the DLL clock networks

This makes the XC2S200-6FGG1125C the optimal choice when your design must meet stringent timing constraints in a benign thermal environment.

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Typical Applications of the XC2S200-6FGG1125C

The XC2S200-6FGG1125C is widely deployed across multiple industries. Explore the full range of Xilinx FPGA solutions available to find the right part for every application tier.

#### Communications & Networking

• High-speed serial data processing
• Protocol bridging (UART, SPI, I2C, Ethernet)
• Network packet filtering and classification

#### Industrial Automation & Control

• Motor drive and PID control logic
• Real-time sensor fusion and data acquisition
• Machine vision pre-processing

#### Embedded & Consumer Electronics

• Custom co-processor acceleration
• Display controller and video pipeline logic
• Audio signal processing

#### Defense & Aerospace (COTS)

• Signal intelligence (SIGINT) front-ends
• Data link protocol implementation
• Radar and EW signal processing (non-radiation-hardened)

#### Medical Devices

• Diagnostic imaging pipeline logic
• Waveform generation for ultrasound
• Patient monitor interface controllers

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XC2S200-6FGG1125C vs. Other XC2S200 Package Options

Designers sometimes need to choose between packages based on board space, I/O count, or thermal requirements. The table below compares the XC2S200 in available package variants.

The XC2S200-6FGG1125C provides the highest user I/O count (284 pins) of all XC2S200 package options, making it the preferred choice when maximum pin-out density and RoHS compliance are both required.

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Development Tools & Software Support

The XC2S200-6FGG1125C is supported by Xilinx’s legacy ISE Design Suite, which includes:

• ISE Project Navigator – RTL entry, synthesis, and implementation
• XST (Xilinx Synthesis Technology) – HDL synthesis engine
• ISIM – Functional and timing simulation
• iMPACT – JTAG configuration and bitstream programming
• ChipScope Pro – On-chip logic analysis

Note: The Spartan-II family is a mature product line. Xilinx ISE (not Vivado) is the correct toolchain for this device. ISE 14.7 is the final version and remains available from AMD/Xilinx.

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Ordering & Procurement Information

Lifecycle Notice: The XC2S200-6FGG1125C is classified as Not Recommended for New Designs (NRND). For new projects, AMD/Xilinx recommends transitioning to the Spartan-6 (XC6SLx) or Spartan-7 families. However, the XC2S200-6FGG1125C remains widely available through authorized distributors for legacy system maintenance, repair, and small production runs.

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Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1125C?

The XC2S200-6FGG1125C is a Xilinx Spartan-II FPGA with 200,000 system gates, 5,292 logic cells, 57,344 bits of block RAM, and 284 user I/O pins in a 1125-pin Pb-Free FBGA package, operating at the commercial -6 speed grade.

What does “FGG” mean in the part number?

“FGG” stands for Fine-pitch Ball Grid Array (FBGA) with a Pb-Free (lead-free) finish. The second “G” indicates compliance with RoHS Directive requirements.

What is the maximum operating frequency of the XC2S200-6FGG1125C?

The -6 speed grade supports operation up to 263 MHz on internal clock paths, depending on design complexity and routing.

Is the XC2S200-6FGG1125C still in production?

It is classified as NRND (Not Recommended for New Designs). However, it is still available from distributors for legacy maintenance and existing production lines.

What programming tool is used for the XC2S200-6FGG1125C?

The Xilinx ISE Design Suite (version 14.7) is the correct tool for designing, simulating, and programming Spartan-II devices. Vivado does not support the Spartan-II family.

What is the core voltage of the XC2S200-6FGG1125C?

The device operates on a 2.5V core supply (specified range: 2.375V to 2.625V), with I/O banks supporting up to 3.3V interfaces.

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Summary

The XC2S200-6FGG1125C remains a capable and battle-tested Spartan-II FPGA that delivers 200K gates, 5,292 logic cells, dual-port block RAM, four DLLs, and 284 I/Os in the industry’s largest pin-count package variant for this device. Its -6 speed grade, Pb-Free packaging, and commercial temperature rating make it suited for high-throughput, cost-sensitive applications that demand proven programmable logic. While new designs should consider migrating to modern Xilinx families, the XC2S200-6FGG1125C continues to serve legacy and maintenance applications effectively and reliably.