The XC2S200-6FGG1124C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for commercial-temperature applications requiring dense logic integration and flexible I/O, this device delivers 200,000 system gates in a 1124-ball Fine-Pitch Ball Grid Array (FBGA) package at speed grade -6. Whether you are building embedded systems, high-volume industrial designs, or rapid-prototyping ASIC replacements, the XC2S200-6FGG1124C offers proven reliability backed by Xilinx engineering. For a broader selection of programmable logic devices, explore our Xilinx FPGA catalog.

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What Is the XC2S200-6FGG1124C?

The XC2S200-6FGG1124C is a member of Xilinx’s Spartan-II 2.5V FPGA family — one of the most trusted and widely deployed FPGA series in electronic design. The part number breaks down as follows:

This device is a superior, programmable alternative to mask-programmed ASICs, eliminating up-front tooling costs and enabling in-field design updates — something traditional ASICs cannot offer.

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XC2S200-6FGG1124C Key Specifications

Core Logic Resources

Electrical & Timing Parameters

Package Information

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XC2S200-6FGG1124C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 contains 1,176 CLBs arranged in a 28×42 matrix. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture enables highly efficient combinational and sequential logic design.

Block RAM

The device integrates 56K bits of dedicated Block RAM, organized in dual-port modules. This on-chip memory is ideal for implementing FIFOs, data buffers, lookup tables, and small embedded memories without consuming CLB resources.

Distributed RAM

With 75,264 bits of distributed RAM embedded across the CLB fabric, designers can implement highly efficient, single-cycle-access local storage for signal processing and state-machine applications.

Delay-Locked Loops (DLLs)

Four on-chip DLLs — one at each corner of the die — provide precise clock management. DLLs eliminate clock distribution skew, support clock multiplication/division, and ensure tight timing margins across the entire device.

Input/Output Blocks (IOBs)

Up to 284 user I/O pins are available, each with programmable drive strength, slew-rate control, and optional pull-up/pull-down resistors. The IOBs support a wide range of single-ended and differential I/O standards, making the XC2S200-6FGG1124C compatible with diverse system interfaces.

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Spartan-II Family Comparison Table

The table below compares the XC2S200 against other members of the Spartan-II family to help engineers select the right device for their design requirements.

The XC2S200 is the largest and most capable device in the Spartan-II family, making it the ideal choice when maximum gate count and I/O flexibility are required.

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Key Features of the XC2S200-6FGG1124C

#### High-Density Logic Fabric

With 5,292 logic cells and 200,000 equivalent system gates, the XC2S200-6FGG1124C supports complex digital designs including DSP pipelines, communication controllers, and multi-function embedded systems.

#### Speed Grade -6 – Fastest Available

The -6 speed grade is the fastest speed grade offered in the Spartan-II commercial temperature range, delivering clock frequencies up to 263 MHz and the lowest propagation delays in the family.

#### Pb-Free FGG1124 Package

The FGG (Pb-free Fine-Pitch BGA) package with 1124 pins ensures RoHS compliance for modern manufacturing environments, while the high pin count enables maximum I/O bandwidth for complex interface designs.

#### Four On-Chip DLLs for Precision Clocking

Integrated Delay-Locked Loops eliminate board-level clock distribution challenges, supporting clock edge alignment, frequency synthesis, and zero-skew distribution across the entire device.

#### Versatile I/O Standard Support

The IOBs support PCI, LVTTL, LVCMOS2, LVCMOS18, GTL, GTL+, HSTL (all three classes), and SSTL (2 and 3), offering broad compatibility with memory interfaces, bus standards, and custom signal levels.

#### JTAG Boundary Scan

Full IEEE 1149.1 JTAG boundary scan support enables in-system testing, board-level fault isolation, and programming via standard JTAG interfaces.

#### In-System Reconfigurability

Unlike mask-programmed ASICs, the XC2S200-6FGG1124C can be reprogrammed at any time, enabling iterative design, feature upgrades, and bug fixes without hardware replacement.

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Typical Applications for the XC2S200-6FGG1124C

The XC2S200-6FGG1124C is well-suited for a wide range of applications across multiple industries:

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XC2S200-6FGG1124C Part Number Decoder

Understanding how Xilinx part numbers are structured helps engineers quickly identify device characteristics directly from the ordering code.

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XC2S200-6FGG1124C vs. Competing Devices

#### How Does It Compare to Other Xilinx FPGAs?

The XC2S200-6FGG1124C excels in applications where the mature Spartan-II ecosystem, established design flows, and the large 1124-pin package are preferred or required for backward compatibility.

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Design Tools and Programming Support

#### Xilinx ISE Design Suite

The XC2S200-6FGG1124C is fully supported by the Xilinx ISE Design Suite, which provides synthesis, simulation, implementation, and bitstream generation tools. Designers can use VHDL, Verilog, or schematic entry methods.

#### Configuration Interfaces

The device supports multiple configuration modes:

#### Third-Party EDA Tool Support

The XC2S200-6FGG1124C is compatible with major third-party EDA tools including Synopsys Synplify, Mentor Graphics ModelSim, and Cadence Incisive, allowing integration into existing design environments.

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Frequently Asked Questions (FAQ)

#### What does the “C” at the end of XC2S200-6FGG1124C mean?

The “C” designates the Commercial temperature range, meaning the device is rated to operate reliably from 0°C to +85°C. Industrial-grade variants would use an “I” suffix and are rated for –40°C to +100°C.

#### Is the XC2S200-6FGG1124C RoHS compliant?

Yes. The “FGG” in the part number indicates a Pb-free (lead-free) package, making it compliant with RoHS environmental directives for use in modern green manufacturing processes.

#### What is the maximum clock frequency for the XC2S200-6FGG1124C?

At speed grade -6, this device supports system clock frequencies up to approximately 263 MHz, making it the fastest variant in the Spartan-II commercial product line.

#### Can the XC2S200-6FGG1124C replace an ASIC?

Absolutely. The Spartan-II family was explicitly designed as a programmable ASIC alternative, eliminating NRE (non-recurring engineering) costs, mask charges, and long development cycles associated with custom silicon.

#### What configuration memory does the XC2S200-6FGG1124C use?

The device uses SRAM-based configuration cells, meaning it requires an external configuration source (such as a serial PROM or processor) at power-up. Xilinx’s XCF family of Platform Flash PROMs is commonly paired with this device.

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Why Choose the XC2S200-6FGG1124C for Your Design?

The XC2S200-6FGG1124C combines the highest logic density in the Spartan-II family with the fastest commercial speed grade and a large, Pb-free BGA package — making it the go-to choice for engineers who need maximum capability from a proven, cost-optimized FPGA platform. Its 1,176 CLBs, 4 on-chip DLLs, 56K bits of block RAM, and 284 user I/Os provide the resources needed to tackle complex digital design challenges across telecom, industrial, embedded, and consumer markets.

Its mature design ecosystem, broad EDA tool support, and multiple configuration options make it straightforward to integrate into both new and legacy board designs. For engineers maintaining or expanding existing Spartan-II-based systems, the XC2S200-6FGG1124C remains a dependable, high-performance choice.

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Summary Specification Table