What Is the XC2S200-6FGG1123C?
The XC2S200-6FGG1123C is a high-performance, commercial-grade Field-Programmable Gate Array (FPGA) manufactured by Xilinx (now AMD Xilinx) as part of the renowned Spartan-II family. Designed to deliver cost-effective programmable logic, this device is a trusted solution for engineers working across telecommunications, industrial control, consumer electronics, automotive systems, and embedded design.
The part number breaks down as follows:
| Code Segment |
Meaning |
| XC2S200 |
Spartan-II family, 200,000 system gates |
| -6 |
Speed grade 6 (fastest available for Spartan-II, Commercial only) |
| FGG |
Fine-Pitch Ball Grid Array package, Pb-free (“G” = RoHS-compliant lead-free) |
| 1123 |
1,123 total ball count |
| C |
Commercial temperature range (0°C to +85°C) |
For engineers sourcing programmable logic devices, the XC2S200-6FGG1123C offers the best speed-grade performance in the Spartan-II lineup — making it the go-to choice for timing-critical designs. Explore more options in the complete Xilinx FPGA catalog.
XC2S200-6FGG1123C Key Specifications at a Glance
Core Logic Resources
| Parameter |
XC2S200 Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array (Rows × Columns) |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O Pins |
284 |
| Distributed RAM (bits) |
75,264 |
| Block RAM (bits) |
56K (7 × 8K blocks) |
Electrical & Process Specifications
| Parameter |
Value |
| Supply Voltage (VCC) |
2.5V |
| Process Technology |
0.18µm CMOS |
| Speed Grade |
-6 (Fastest) |
| Maximum System Clock |
263 MHz |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Package Type |
FGG (Fine-Pitch BGA, Pb-free) |
| Pin Count |
1,123 |
| RoHS Compliance |
Yes (Pb-free, “G” suffix) |
XC2S200-6FGG1123C: Detailed Feature Breakdown
H3: Configurable Logic Blocks (CLBs) – The Core of FPGA Flexibility
The XC2S200-6FGG1123C contains 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture enables:
- Complex combinatorial and sequential logic implementation
- Efficient carry-chain arithmetic for DSP-type functions
- Cascadeable function generators for wide logic operations
- Dedicated fast carry and borrow logic for adders and counters
The CLB-based fabric allows the XC2S200 to replace large banks of discrete SSI/MSI logic and implement glue logic, state machines, and data-path circuits in a single programmable chip.
H3: Block RAM – High-Density On-Chip Memory
The XC2S200-6FGG1123C provides 56K bits of block RAM organized into seven dual-port 8K-bit RAM blocks. Each block RAM can be configured as:
| Configuration |
Width × Depth |
| 8K × 1 |
8,192 locations, 1-bit wide |
| 4K × 2 |
4,096 locations, 2-bit wide |
| 2K × 4 |
2,048 locations, 4-bit wide |
| 1K × 8 |
1,024 locations, 8-bit wide |
| 512 × 16 |
512 locations, 16-bit wide |
These true dual-port block RAMs support simultaneous read/write operations from both ports, making them ideal for FIFOs, look-up tables, data buffers, and embedded processor memory.
H3: Input/Output Blocks (IOBs) – Versatile Signal Interfacing
With up to 284 user I/O pins on the XC2S200-6FGG1123C, the device supports a wide range of signaling standards. Each IOB provides:
- Programmable input delay for zero hold-time designs
- Optional output slew rate control (fast/slow)
- 3-state output control
- Selectable pull-up, pull-down, or keeper resistors
Supported I/O Standards
| I/O Standard |
Description |
| LVTTL |
Low Voltage TTL (3.3V) |
| LVCMOS33 |
3.3V CMOS |
| LVCMOS25 |
2.5V CMOS |
| LVCMOS18 |
1.8V CMOS |
| SSTL2 |
SDRAM/DDR interface standard |
| GTL+ |
Gunning Transceiver Logic |
| AGP |
Accelerated Graphics Port |
| PCI |
3.3V and 5V tolerant |
This broad I/O compatibility makes the XC2S200-6FGG1123C highly suitable for mixed-voltage board designs and multi-standard communication systems.
H3: Delay-Locked Loops (DLLs) – Precision Clock Management
The Spartan-II XC2S200 includes four Delay-Locked Loops (DLLs), one placed at each corner of the die. DLLs provide:
- Zero clock skew across the entire device
- Clock edge alignment for source-synchronous interfaces
- Frequency synthesis (clock multiplication and division)
- Phase shifting for timing margin optimization
For high-speed system designs, DLL-driven clocking ensures reliable operation at or near the 263 MHz maximum system frequency offered by the -6 speed grade.
XC2S200-6FGG1123C vs. Other Spartan-II Family Members
Understanding where the XC2S200-6FGG1123C fits within the Spartan-II family helps engineers select the right device for their design requirements.
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
75,264 bits |
56K |
The XC2S200 is the largest and most capable device in the Spartan-II family, providing the maximum available logic density, I/O count, and embedded memory for the most demanding low-cost FPGA applications.
Ordering Information & Part Number Decoder
When ordering the XC2S200-6FGG1123C, understanding the full Xilinx part number structure helps avoid purchasing errors.
Xilinx Spartan-II Part Number Format
XC2S [Density] - [Speed Grade] [Package] [Pin Count] [Temp Range]
| Field |
Options |
Description |
| Density |
15, 30, 50, 100, 150, 200 |
System gate count (in thousands) |
| Speed Grade |
-5, -6 |
-6 is fastest (Commercial only) |
| Package |
FG, FGG, PQ, PQG, TQ, TQG, VQ, VQG |
FGG = Fine-Pitch BGA, Pb-free |
| Pin Count |
256, 456, 1123, 208, etc. |
Total ball/pin count |
| Temperature |
C = Commercial, I = Industrial |
Operating temp range |
Note: The “-6” speed grade is exclusively available in the Commercial temperature range (C suffix). There is no industrial-grade -6 variant of the XC2S200.
H2: Applications of the XC2S200-6FGG1123C
The XC2S200-6FGG1123C is designed to serve as a cost-effective, reprogrammable alternative to custom ASICs. Its rich feature set and large I/O count make it well-suited for a broad range of applications:
H3: Industrial Control & Automation
- PLC interface logic and motor control
- Real-time sensor data acquisition and processing
- Machine vision pre-processing pipelines
H3: Telecommunications & Networking
- Line card control planes
- Protocol conversion and framing logic (SONET/SDH)
- High-speed serial data serialization/deserialization
H3: Consumer Electronics & Multimedia
- Display controller logic
- Image and video pre-processing
- Set-top box signal processing
H3: Embedded Systems & Prototyping
- Soft-core processor implementation (e.g., MicroBlaze-compatible cores)
- ASIC prototype validation before tape-out
- Rapid hardware iteration and field upgrades
H3: Automotive Electronics
- Body control module interface logic
- CAN bus bridging and protocol logic
- LIDAR and sensor pre-processing
H2: Why Choose the XC2S200-6FGG1123C Over a Custom ASIC?
One of the key value propositions of the XC2S200-6FGG1123C is its ability to serve as a superior, flexible alternative to mask-programmed ASICs. Here’s a direct comparison:
| Factor |
Custom ASIC |
XC2S200-6FGG1123C FPGA |
| NRE (Non-Recurring Engineering) Cost |
Very High ($500K–$5M+) |
None |
| Development Cycle |
12–24 months |
Days to weeks |
| Design Change |
Requires new mask |
Reprogram in-field |
| Risk |
High (one-time commit) |
Low (reversible) |
| Volume Suitability |
High volume only |
Any volume |
| Time-to-Market |
Slow |
Fast |
For low-to-medium volume production and rapid prototyping, the XC2S200-6FGG1123C provides a compelling economic and technical advantage over traditional ASIC development.
H2: Development Tools & Software Support
The XC2S200-6FGG1123C is supported by Xilinx’s ISE Design Suite, which provides a complete FPGA design flow from RTL entry to bitstream generation.
| Tool |
Function |
| Xilinx ISE |
Complete design implementation suite |
| XST (Xilinx Synthesis Technology) |
RTL synthesis engine |
| ModelSim-XE |
RTL and gate-level simulation |
| ChipScope Pro |
In-system logic debugging |
| iMPACT |
JTAG-based device programming |
Design entry supports industry-standard hardware description languages including VHDL, Verilog, and schematic capture.
Important: The XC2S200-6FGG1123C is part of the legacy Spartan-II family. For new designs, Xilinx recommends migrating to modern FPGA families such as Spartan-7 or Artix-7 for better performance, lower power, and active software support.
H2: Frequently Asked Questions (FAQ) – XC2S200-6FGG1123C
H3: What is the maximum operating frequency of the XC2S200-6FGG1123C?
The XC2S200-6FGG1123C operates at up to 263 MHz system clock frequency, making it the fastest speed grade available in the Spartan-II family.
H3: Is the XC2S200-6FGG1123C RoHS compliant?
Yes. The “G” in “FGG” indicates a Pb-free (lead-free) package, making this part compliant with RoHS environmental regulations.
H3: What temperature range does the XC2S200-6FGG1123C support?
The “C” suffix designates a Commercial temperature range: 0°C to +85°C. Industrial range (-40°C to +85°C) variants use the “I” suffix and are only available in speed grades up to -5.
H3: What configuration interface does the XC2S200-6FGG1123C use?
The Spartan-II family supports multiple configuration modes: Master Serial, Slave Serial, Master Parallel (SelectMAP), Slave Parallel (SelectMAP), and JTAG (Boundary Scan IEEE 1149.1).
H3: Can I use the XC2S200-6FGG1123C in a new design today?
While functional, the XC2S200-6FGG1123C is not recommended for new designs (NRND). Engineers starting fresh projects should consider the Spartan-7 or Artix-7 families for better performance and long-term software support.
H3: Where can I find the XC2S200-6FGG1123C datasheet?
The official Xilinx Spartan-II data sheet (DS001) is available through AMD Xilinx’s documentation portal. Authorized distributors also maintain copies of the datasheet for reference.
H2: Summary – XC2S200-6FGG1123C FPGA at a Glance
The XC2S200-6FGG1123C is the highest-density, fastest-speed-grade member of the Spartan-II FPGA family from Xilinx, offering:
- ✅ 200,000 system gates with 5,292 logic cells
- ✅ -6 speed grade for maximum system performance (up to 263 MHz)
- ✅ 1,123-ball FGG package with Pb-free, RoHS-compliant construction
- ✅ 284 user I/O pins with multi-standard voltage support
- ✅ 56K bits block RAM + 75,264 bits distributed RAM
- ✅ Four Delay-Locked Loops for zero-skew clock distribution
- ✅ Commercial temperature range (0°C to +85°C)
- ✅ Reprogrammable — ideal ASIC replacement for rapid prototyping and field upgrades
Whether you’re maintaining legacy equipment, validating a prototype, or sourcing inventory for an existing production line, the XC2S200-6FGG1123C remains a reliable, proven Xilinx Spartan-II FPGA that delivers consistent performance.
