The XC2S200-6FGG1121C is a high-performance, cost-effective field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family. Manufactured on advanced 0.18-micron technology and operating at 2.5V, this device delivers 200,000 system gates and up to 263 MHz performance in a large 1121-pin Fine-Pitch Ball Grid Array (FGG BGA) package. Whether you are designing communication systems, industrial automation hardware, or embedded signal processing platforms, the XC2S200-6FGG1121C offers the logic density, speed, and I/O flexibility needed for demanding applications.

For a broader selection of programmable logic devices, explore our full range of Xilinx FPGA solutions.

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What Is the XC2S200-6FGG1121C?

The XC2S200-6FGG1121C belongs to the Xilinx Spartan-II FPGA family — a product line engineered as a superior, programmable alternative to mask-programmed ASICs. The Spartan-II series eliminates the high upfront tooling costs and long development cycles associated with traditional ASICs while offering unlimited in-system reprogrammability.

Breaking down the part number:

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XC2S200-6FGG1121C Key Specifications

Core Logic & Memory

Performance & Electrical

Package & I/O

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XC2S200-6FGG1121C Architecture Overview

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1121C is its array of 1,176 Configurable Logic Blocks (CLBs) arranged in a 28×42 grid. Each CLB contains four logic cells, and every logic cell includes:

• A 4-input Look-Up Table (LUT) for implementing any combinational logic function
• A dedicated D-type flip-flop for registered logic
• Fast carry and arithmetic logic for efficient adder and multiplier implementations
• Support for 16 bits of distributed SelectRAM per logic cell

Block RAM Architecture

The XC2S200-6FGG1121C provides 14 block RAM modules, each offering a true dual-port, synchronous 4,096-bit (4 Kbit) RAM. These on-chip memory resources are ideal for:

• FIFOs and data buffers
• Lookup tables and coefficient storage
• Small embedded memories for processor-based designs
• Dual-port communication between processing elements

Input/Output Blocks (IOBs)

The device features programmable I/O blocks supporting multiple industry-standard voltage levels, including LVTTL, LVCMOS, PCI, and GTL+ standards. Each IOB includes:

• Independently programmable input and output delays
• Optional input flip-flops and output flip-flops
• Slew rate control (fast/slow)
• Programmable pull-up and pull-down resistors

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops — one at each corner of the die — provide:

• Zero clock skew distribution across the device
• Frequency synthesis and clock multiplication
• Clock phase shifting for advanced system-level timing
• Board-level clock deskewing when used in loopback configurations

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Spartan-II Family Comparison Table

The table below shows how the XC2S200 compares with other devices in the Spartan-II family:

The XC2S200 is the highest-density device in the Spartan-II family, making the XC2S200-6FGG1121C the top-of-range choice for applications requiring maximum logic resources within the Spartan-II platform.

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Configuration Modes

The XC2S200-6FGG1121C supports four standard configuration modes:

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Key Features of the XC2S200-6FGG1121C

✅ Superior ASIC Replacement

The Spartan-II FPGA eliminates the non-recurring engineering (NRE) costs of mask-programmed ASICs. There is no minimum order quantity, no re-spin cost, and no obsolescence risk. Design changes can be deployed in-field without hardware replacement — an impossible feat with traditional ASICs.

✅ Speed Grade -6: Maximum Commercial Performance

The -6 speed grade is the fastest commercially available speed grade in the Spartan-II lineup. It delivers pin-to-pin propagation delays as fast as a few nanoseconds and a maximum toggle frequency of up to 263 MHz, enabling high-throughput data processing applications.

✅ Hierarchical SelectRAM Memory

The XC2S200-6FGG1121C implements Xilinx’s SelectRAM hierarchical memory architecture, combining two levels of on-chip memory:

• Distributed RAM: 75,264 bits derived from LUTs, providing very fast, single-cycle access
• Block RAM: 57,344 bits in dedicated synchronous dual-port modules for high-bandwidth memory operations

✅ Robust I/O Flexibility

With 284 user I/O pins in the 1121-pin package, engineers have ample connectivity for complex bus interfaces, multi-channel signal processing, and board-level integration. Programmable I/O standards ensure compatibility with a wide range of peripheral devices.

✅ Four Delay-Locked Loops (DLLs)

The integrated DLLs eliminate board-level clock distribution challenges, reduce clock uncertainty, and enable frequency synthesis without external oscillators or PLLs.

✅ Full IEEE 1149.1 Boundary Scan (JTAG)

Complete JTAG support allows in-circuit testing, boundary scan chain integration, and in-system programming through standard test infrastructure.

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Applications of the XC2S200-6FGG1121C

📡 Communications & Networking

The device’s high I/O count and fast logic make it well-suited for:

• Line card logic in routers and switches
• High-speed serial protocol bridges
• Network packet processing and filtering
• Wireless baseband processing

🏭 Industrial Automation & Control

Engineers rely on the XC2S200-6FGG1121C for:

• Motor drive control systems
• PLC (Programmable Logic Controller) expansion
• Real-time sensor data acquisition
• Safety logic and interlock systems

🏥 Medical & Diagnostic Equipment

The device is used in:

• Ultrasound and MRI signal processing front-ends
• Patient monitoring systems
• Point-of-care diagnostic data acquisition
• Portable medical device control logic

🔒 Security & Defense

Common security applications include:

• Cryptographic acceleration engines
• Secure access control systems
• Biometric identification hardware
• Electronic warfare signal processing

🖥️ Consumer & Embedded Systems

• High-definition video processing pipelines
• Embedded processor co-processing
• Display interface logic
• Smart home and IoT gateway hardware

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Ordering Information & Part Number Decoder

Note: As a mature product, the XC2S200-6FGG1121C is designated Not Recommended for New Designs (NRND) by AMD Xilinx. It remains available through authorized distributors for legacy system maintenance and repair. New designs should evaluate the Spartan-6 or Artix-7 families for equivalent or greater functionality.

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Design Tools & Support

The XC2S200-6FGG1121C is fully supported by Xilinx legacy design tools:

Xilinx Vivado Design Suite does not support Spartan-II devices. Use ISE 14.7 for all XC2S200-series development.

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Frequently Asked Questions (FAQ)

Q: What is the XC2S200-6FGG1121C used for? It is a Xilinx Spartan-II FPGA used in communications, industrial control, medical devices, and embedded systems requiring 200,000 system gates and high I/O density.

Q: What is the speed grade -6 in the XC2S200-6FGG1121C? Speed grade -6 is the highest (fastest) commercially available speed grade for the XC2S200 family, supporting frequencies up to 263 MHz.

Q: Is the XC2S200-6FGG1121C still in production? It is designated as Not Recommended for New Design (NRND) by AMD Xilinx. Stock is still available through authorized distributors for legacy system support.

Q: What package does the XC2S200-6FGG1121C use? It uses a 1121-pin Fine-Pitch Ball Grid Array (FGG BGA) package, providing 284 user I/O pins in a large-pitch BGA footprint.

Q: What voltage does the XC2S200-6FGG1121C operate at? The core voltage is 2.5V. I/O banks support both 2.5V and 3.3V standards depending on configuration.

Q: What design software supports the XC2S200-6FGG1121C? Xilinx ISE Design Suite 14.7 is the recommended tool. Vivado does not support the Spartan-II family.

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Summary

The XC2S200-6FGG1121C is a robust, mature Xilinx Spartan-II FPGA offering the highest logic density in its family — 200,000 system gates, 5,292 logic cells, 57,344 bits of block RAM, and 284 user I/O pins in the large 1121-pin FGG BGA package. With speed grade -6 delivering up to 263 MHz performance, four integrated DLLs, and comprehensive JTAG support, it remains a reliable choice for maintaining and extending legacy embedded, industrial, and communications hardware platforms.