The XC2S200-6FGG1117C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and operates at 2.5V core voltage — all packed into a 1,117-pin Fine-Pitch Ball Grid Array (FGG/FBGA) package. Whether you are building communication systems, industrial controllers, or embedded processing platforms, the XC2S200-6FGG1117C offers the flexibility and performance you need.

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What Is the XC2S200-6FGG1117C? — Xilinx Spartan-II FPGA Overview

The XC2S200-6FGG1117C belongs to the Xilinx Spartan-II FPGA family, a product line engineered as a cost-effective, reprogrammable alternative to mask-programmed ASICs. Unlike fixed-function ASICs, this FPGA allows designers to update logic in the field without any hardware replacement — dramatically reducing time-to-market and development risk.

The part number decodes as follows:

For engineers sourcing Xilinx FPGA devices, understanding the part number is the first step to confirming the right fit for your design.

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XC2S200-6FGG1117C Key Specifications

Core Technical Specifications

Package Information

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XC2S200-6FGG1117C Architecture and Features

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1117C is its array of 1,176 CLBs, organized in a 28-row by 42-column matrix. Each CLB contains:

• Four Look-Up Tables (LUTs) for implementing combinatorial logic
• Four flip-flops for sequential logic
• Fast carry and arithmetic logic
• Wide-function multiplexers for deep logic merging

This architecture allows designers to implement complex state machines, data paths, and control logic efficiently within a single device.

Block RAM — High-Speed Embedded Memory

The XC2S200-6FGG1117C includes 14 dual-port block RAM modules, each 4,096 bits in size, for a total of 57,344 bits of synchronous on-chip memory. Key block RAM features include:

• Fully synchronous dual-port operation with independent control signals
• Configurable data widths on each port independently
• Ideal for FIFOs, lookup tables, and data buffering
• Synchronized to the device clock for maximum performance

Delay-Locked Loops (DLLs) for Clock Management

Four on-chip Delay-Locked Loops (DLLs) — one at each corner of the die — provide advanced clock management capabilities:

Input/Output Blocks (IOBs)

The XC2S200-6FGG1117C supports up to 284 user I/O pins with flexible programmable I/O standards:

Each IOB includes programmable slew rate control, optional pull-up and pull-down resistors, and an on-chip input delay element for setup time optimization.

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XC2S200-6FGG1117C Speed Grade — What Does “-6” Mean?

The -6 speed grade is the fastest commercial speed grade available in the Spartan-II family. It is exclusively offered in the commercial temperature range (0°C to +85°C). A higher speed grade number indicates faster timing characteristics, including:

• Shorter propagation delays through LUTs and routing
• Faster setup and hold times on flip-flops
• Higher maximum operating frequency (up to 263 MHz on internal logic)

For designs with tight timing margins or high-throughput data paths, the -6 speed grade is the preferred choice over the slower -4 and -5 grades.

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XC2S200-6FGG1117C Configuration Modes

The XC2S200-6FGG1117C supports multiple configuration modes to fit various system architectures:

During power-on and throughout the configuration process, all I/O drivers remain in a high-impedance state, ensuring safe initialization in live systems.

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Applications of the XC2S200-6FGG1117C FPGA

#### Communications and Networking

The XC2S200-6FGG1117C is widely used in telecommunications equipment for implementing custom MAC layers, network interface logic, and protocol bridges. Its multi-standard I/O support makes it compatible with a broad range of bus and interface standards.

#### Industrial Automation and Control

In industrial environments, this FPGA enables real-time motor control, PLC logic replacement, sensor fusion, and custom machine interfaces. The device’s reprogrammability allows field upgrades as machine requirements evolve.

#### Embedded Processing and DSP

With its block RAM and CLB-based multiplier resources, the XC2S200-6FGG1117C can implement custom soft processors, digital filters, and signal processing pipelines — ideal for embedded vision, audio processing, and instrumentation.

#### Medical and Scientific Instrumentation

The FPGA’s deterministic timing behavior and flexible I/O standards make it suitable for medical imaging systems, diagnostic equipment, and data acquisition platforms where precision timing is critical.

#### Defense and Aerospace Prototyping

For prototype development and low-volume production in defense applications, the XC2S200-6FGG1117C provides a programmable platform that supports rapid logic iteration without the NRE costs of custom silicon.

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XC2S200-6FGG1117C vs. Similar Spartan-II Variants

The XC2S200-6FGG1117C stands out with its large 1,117-pin package, providing the maximum number of available user I/Os (284) within the XC2S200 device — making it ideal for designs with high I/O count requirements.

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Design Tools and Development Support

Xilinx (now AMD) provides full design tool support for the XC2S200-6FGG1117C:

Note: The Spartan-II family is supported through ISE Design Suite (not Vivado). Designers should use ISE 14.7 for complete device support.

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Ordering Information and Part Number Breakdown

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Frequently Asked Questions (FAQ)

Q: Is the XC2S200-6FGG1117C still in production? The Spartan-II family is classified as mature/end-of-life by AMD Xilinx. New designs should evaluate newer families, but the XC2S200-6FGG1117C remains widely available through authorized distributors and component brokers for existing design support.

Q: What is the difference between FGG and FG packages? The “FGG” designation refers to a Fine-Pitch Ball Grid Array package with a double-G suffix, typically indicating a specific ball pitch or package revision. Both FGG and FG packages use BGA mounting, but the FGG1117 offers significantly more pins (1,117) versus smaller FG packages.

Q: Can I use the XC2S200-6FGG1117C with Vivado? No. The Spartan-II family is not supported in Vivado. Designers must use Xilinx ISE 14.7 for synthesis, implementation, and bitstream generation.

Q: What is the configuration bitstream size for the XC2S200? The XC2S200 requires approximately 1,335,840 bits for full configuration in SelectMAP or serial configuration modes.

Q: What replaces the XC2S200-6FGG1117C for new designs? AMD Xilinx recommends migration to the Spartan-6 or Artix-7 FPGA families for new designs, which offer improved performance, lower power consumption, and modern tool support.

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Summary

The XC2S200-6FGG1117C is a proven, high-I/O-count Xilinx Spartan-II FPGA delivering 200,000 system gates, 57,344 bits of block RAM, four DLLs, and up to 284 user I/Os in a 1,117-pin FGG BGA package. Its -6 commercial speed grade ensures the best performance within the Spartan-II family, making it the top choice for engineers maintaining legacy designs or prototyping applications with demanding I/O requirements.

For sourcing and technical support on the XC2S200-6FGG1117C and the full range of Spartan-II devices, contact your preferred authorized distributor or visit specialized component platforms.