The XC2S200-6FGG1116C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this 200,000-gate FPGA delivers a compelling combination of programmable logic density, on-chip memory, and flexible I/O — all in a compact Fine-Pitch Ball Grid Array (FBGA) package. Whether you’re designing embedded systems, communications hardware, or digital signal processing boards, the XC2S200-6FGG1116C is a proven and widely adopted solution.

For engineers sourcing programmable logic devices, the Xilinx FPGA lineup — and the Spartan-II family in particular — remains a reliable choice for balancing performance and cost in production designs.

What Is the XC2S200-6FGG1116C?

The XC2S200-6FGG1116C is part of Xilinx’s Spartan-II 2.5V FPGA family. It is built on a 0.18-micron process technology and operates on a 2.5V core supply. The part number breaks down as follows:

This device targets cost-sensitive, high-volume applications where reprogrammability, fast time-to-market, and solid logic density are all critical requirements.

XC2S200-6FGG1116C Key Specifications

Core Logic Resources

Package & Electrical Specifications

XC2S200-6FGG1116C Features and Architecture

Configurable Logic Blocks (CLBs)

The XC2S200 contains 1,176 Configurable Logic Blocks, each consisting of two slices. Every slice includes two 4-input Look-Up Tables (LUTs) and two flip-flops, providing fine-grained control over both combinatorial and registered logic. This architecture supports efficient implementation of state machines, arithmetic functions, and custom digital logic.

Block RAM and Distributed RAM

On-chip memory is one of the XC2S200’s most valuable assets for embedded designers:

• 75,264 bits of distributed RAM are distributed across the CLB fabric, making small, fast memory arrays easy to implement.
• 56Kbits of dedicated Block RAM is organized in two columns on the die, suitable for larger FIFO buffers, lookup tables, and frame buffers.

Delay-Locked Loops (DLLs)

The device includes four Delay-Locked Loops (DLLs), one at each corner of the die. DLLs allow designers to eliminate clock distribution delays, multiply or divide clock frequencies, and shift clock phases — critical for high-speed synchronous designs.

Input/Output Blocks (IOBs) and I/O Standards

The XC2S200-6FGG1116C supports multiple I/O standards through its programmable IOBs:

This wide I/O standard support enables the XC2S200 to interface with SDRAM, PCI buses, DDR memory, and a wide range of other peripherals.

JTAG Boundary Scan

The XC2S200-6FGG1116C is fully compliant with IEEE 1149.1 JTAG boundary scan, enabling in-circuit testing and simplified board-level debugging without physical probing.

Spartan-II Family Comparison Table

The XC2S200 is the largest device in the Spartan-II family, offering the most resources for complex designs:

Ordering Information and Part Number Decoder

Understanding the Xilinx part number format is essential for engineers selecting the correct variant. The XC2S200-6FGG1116C uses the following convention:

XC2S200 - 6 - FGG - 1116 - C
  |        |    |      |    |
  |        |    |      |    Temperature: C = Commercial (0°C to +85°C)
  |        |    |      Pin count: 1116
  |        |    Package type: FGG (Fine Pitch BGA, Pb-free)
  |        Speed grade: -6 (fastest for Spartan-II)
  Device: Spartan-II 200K gates

Note: The “G” in “FGG” indicates the Pb-free (RoHS-compliant) package variant. The standard (non-Pb-free) version uses “FG” without the extra “G.”

Applications of the XC2S200-6FGG1116C

The XC2S200-6FGG1116C is well-suited for a wide range of embedded and industrial applications:

#### Communications and Networking

Glue logic for line cards, protocol bridging between UART, SPI, I²C, and Ethernet interfaces, and custom framing logic.

#### Digital Signal Processing (DSP)

FIR/IIR filter implementation, FFT preprocessing, and custom signal conditioning pipelines for audio, RF, or sensor data.

#### Consumer Electronics and Industrial Automation

High-speed I/O expansion, custom state-machine controllers, motor control logic, and sensor interface aggregation.

#### Embedded System Prototyping

Rapid prototyping of ASIC replacement logic, custom CPU peripherals, and co-processing blocks before tape-out.

#### PCI Interface Cards

With native PCI I/O standard support, the XC2S200 is frequently used in PCI add-in card designs.

Design Tools and Programming Support

The XC2S200-6FGG1116C is supported by Xilinx ISE Design Suite (the appropriate tool for legacy Spartan-II devices). Key design flow elements include:

Why Choose the XC2S200-6FGG1116C?

#### Cost-Effective Programmable Logic

The Spartan-II family was specifically engineered to undercut ASIC prototyping costs by eliminating NRE fees, long fabrication cycles, and mask risks. The XC2S200 delivers over 200K equivalent gates at a significantly lower total development cost than equivalent mask-programmed solutions.

#### Field Upgradability

Unlike ASICs, the XC2S200 can be reconfigured in the field via JTAG or a configuration PROM. Design revisions, bug fixes, and feature additions are deployable without hardware replacement — a major lifecycle advantage.

#### Mature, Proven Silicon

As part of a long-established product family, the XC2S200 benefits from decades of production history, stable supply chains, and comprehensive documentation including silicon errata, application notes, and reference designs.

#### Speed Grade -6 Advantage

The -6 speed grade is the fastest available in the Spartan-II commercial range, delivering the lowest propagation delays and supporting the highest internal clock frequencies — critical for timing-constrained datapaths.

XC2S200-6FGG1116C vs. Alternative Xilinx Spartan Devices

Frequently Asked Questions (FAQ)

Q: Is the XC2S200-6FGG1116C RoHS compliant? A: The “FGG” package designation (with the extra “G”) indicates a Pb-free, RoHS-compliant package. The standard “FG” variant is not Pb-free.

Q: What configuration interface does the XC2S200 support? A: The device supports JTAG (IEEE 1149.1), Master Serial, Slave Serial, and SelectMAP (parallel) configuration modes, providing maximum flexibility for production programming.

Q: What is the maximum operating frequency of the XC2S200-6? A: Maximum achievable frequency depends on the implemented design, but the -6 speed grade supports internal logic speeds up to approximately 200+ MHz for simple datapaths. DLLs support clock management across the full operating range.

Q: Can the XC2S200-6FGG1116C be used in industrial temperature applications? A: The “C” suffix denotes a Commercial temperature range (0°C to +85°C). Industrial temperature range (-40°C to +85°C) variants use an “I” suffix and are available in selected package options.

Q: What software do I use to program the XC2S200? A: Xilinx ISE Design Suite (including the free ISE WebPACK edition) supports full Spartan-II design implementation. Note that Vivado does not support the Spartan-II family.

Summary

The XC2S200-6FGG1116C is Xilinx’s largest Spartan-II FPGA, offering 200,000 system gates, 5,292 logic cells, 1,176 CLBs, 284 user I/Os, and 56Kbits of block RAM in a Pb-free 1116-pin Fine-Pitch BGA package. With its -6 speed grade delivering the fastest timing performance in the commercial range, and support for a broad array of I/O standards including PCI, HSTL, and SSTL, this device remains a capable solution for legacy system support, high-volume production, and cost-constrained programmable logic applications.

Engineers looking to source, evaluate, or replace Spartan-II FPGA components will find the XC2S200-6FGG1116C to be a well-documented, mature, and readily available device backed by Xilinx’s extensive ecosystem.