Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3S200-4PQG208C: Xilinx Spartan-3 FPGA – Complete Product Guide

Product Details

The XC3S200-4PQG208C is a field-programmable gate array (FPGA) from the Xilinx Spartan-3 family, manufactured by AMD (formerly Xilinx). Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates in a compact 208-pin PQFP package. Whether you are prototyping digital logic, building embedded systems, or implementing DSP pipelines, the XC3S200-4PQG208C provides the programmable logic density, I/O flexibility, and power efficiency that engineers demand.

For a broader selection of programmable logic solutions, explore our full range of Xilinx FPGA products available at PCBSync.


What Is the XC3S200-4PQG208C?

The XC3S200-4PQG208C belongs to AMD Xilinx’s Spartan-3 series — one of the most widely deployed low-cost FPGA families in the industry. The part number breaks down as follows:

Part Number Segment Meaning
XC3S Xilinx Spartan-3 family
200 200,000 equivalent system gates
-4 Speed grade (–4 is the slowest / most power-efficient)
PQ PQFP (Plastic Quad Flat Pack) package
G208 208-pin package
C Commercial temperature range (0°C to +85°C)

Key Features of the XC3S200-4PQG208C

  • 200,000 system gates with 4,320 logic cells
  • 208-pin PQFP surface-mount package
  • 173 user I/O pins for maximum design flexibility
  • 12 multipliers (18×18-bit) for DSP and signal processing
  • 216 Kbits of block RAM for on-chip data buffering
  • 4 digital clock managers (DCMs) for clock synthesis, phase shifting, and frequency division
  • Commercial temperature range: 0°C to +85°C
  • 1.2 V core voltage with 3.3 V I/O support
  • Compatible with Xilinx ISE Design Suite and third-party EDA tools
  • Supports multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL

XC3S200-4PQG208C Technical Specifications

General Parameters

Parameter Value
Manufacturer AMD / Xilinx
Series Spartan-3
Part Number XC3S200-4PQG208C
Logic Cells 4,320
System Gates 200,000
CLB Slices 1,920
Flip-Flops 3,840
Distributed RAM 30 Kbits
Block RAM 216 Kbits
Dedicated Multipliers 12 × (18×18-bit)
DCMs (Digital Clock Managers) 4
Maximum User I/O 173
Speed Grade -4
Core Supply Voltage (Vccint) 1.2 V
I/O Supply Voltage (Vccio) 1.2 V – 3.3 V

Package & Mechanical Specifications

Parameter Value
Package Type PQFP (Plastic Quad Flat Pack)
Package Code PQG208
Pin Count 208
Mounting Type Surface Mount
Operating Temperature (Commercial) 0°C to +85°C
RoHS Compliant Yes

I/O and Electrical Characteristics

Parameter Value
Total User I/O Pins 173
I/O Standards Supported LVTTL, LVCMOS (1.2V–3.3V), SSTL2/3, HSTL, GTL, PCI
Maximum I/O Current (per pin) 24 mA
Configuration Interface Master/Slave Serial, SelectMAP (Parallel), JTAG (IEEE 1149.1)
Internal Pull-Up / Pull-Down Yes

XC3S200-4PQG208C Logic Architecture

Configurable Logic Blocks (CLBs)

The Spartan-3 CLB architecture consists of slices, each containing two 4-input look-up tables (LUTs), flip-flops, and dedicated carry logic. The XC3S200 provides 1,920 slices (3,840 flip-flops) arranged in a regularly structured array, enabling efficient mapping of combinational and sequential logic.

Block RAM

With 216 Kbits of dual-port block RAM, the XC3S200-4PQG208C supports a wide variety of memory-intensive applications such as FIFOs, shift registers, and lookup tables. Each block RAM can be configured independently in different widths and depths.

Digital Clock Managers (DCMs)

The four on-chip DCMs allow designers to:

  • Eliminate clock distribution skew
  • Synthesize new clock frequencies from an input reference
  • Shift clock phase by precise increments
  • Divide or multiply clock frequencies

XC3S200-4PQG208C vs Other Spartan-3 Devices

Understanding where the XC3S200 fits within the Spartan-3 family helps engineers select the right device for their application.

Device System Gates Logic Cells Block RAM Multipliers Max User I/O
XC3S50 50,000 1,728 72 Kbits 4 124
XC3S200 200,000 4,320 216 Kbits 12 173
XC3S400 400,000 8,064 288 Kbits 16 264
XC3S1000 1,000,000 17,280 432 Kbits 24 391
XC3S1500 1,500,000 29,952 576 Kbits 32 487

The XC3S200-4PQG208C sits at a practical middle ground — offering substantially more resources than the XC3S50 while remaining cost-effective compared to larger devices.


Supported I/O Standards

The XC3S200-4PQG208C supports a comprehensive set of single-ended and differential I/O standards, making it compatible with a wide variety of external interfaces and bus architectures.

I/O Standard Category Voltage Level
LVTTL Single-Ended 3.3 V
LVCMOS33 Single-Ended 3.3 V
LVCMOS25 Single-Ended 2.5 V
LVCMOS18 Single-Ended 1.8 V
LVCMOS15 Single-Ended 1.5 V
LVCMOS12 Single-Ended 1.2 V
PCI (33/66 MHz) Single-Ended 3.3 V
SSTL2 Class I/II Single-Ended 2.5 V
SSTL3 Class I/II Single-Ended 3.3 V
HSTL Class I–IV Single-Ended 1.5 V
GTL / GTL+ Single-Ended Ref-based

Configuration Methods

The XC3S200-4PQG208C supports multiple configuration interfaces for flexible board design:

Configuration Mode Description
Master Serial FPGA loads bitstream from serial Flash memory
Slave Serial External controller streams bitstream into FPGA
Master SelectMAP Parallel 8-bit configuration bus from Flash
Slave SelectMAP Parallel 8-bit bus driven by external processor
JTAG (IEEE 1149.1) Standard JTAG boundary scan and in-system programming

JTAG configuration is the most common method during development and prototyping, supported by Xilinx iMPACT and compatible third-party JTAG tools.


Typical Applications

The XC3S200-4PQG208C is well suited for a broad range of embedded and digital design applications:

  • Industrial control systems – Motor controllers, PLCs, and sensor interfaces
  • Communications interfaces – UART, SPI, I2C, CAN bus bridges
  • Image and video processing – Low-latency pixel pipelines, frame buffers
  • Digital signal processing (DSP) – FIR/IIR filters, FFTs using on-chip multipliers
  • Embedded processor systems – MicroBlaze or PicoBlaze soft-core CPU implementations
  • Prototyping and emulation – ASIC prototyping, logic verification
  • Consumer electronics – Set-top boxes, LCD controllers, remote I/O expanders
  • Test and measurement equipment – Pattern generators, logic analyzers

Design Tools and Development Support

Xilinx ISE Design Suite

The XC3S200-4PQG208C is supported by the Xilinx ISE Design Suite (available as a free WebPACK edition for Spartan-3 devices). ISE provides:

  • HDL synthesis (VHDL and Verilog)
  • Implementation, place-and-route
  • Timing analysis and simulation
  • Bitstream generation and programming

Note: Xilinx Vivado does not support Spartan-3 devices. Use ISE 14.7 for all XC3S-series development.

IP Cores Available

IP Core Description
MicroBlaze 32-bit soft-core RISC processor
PicoBlaze Lightweight 8-bit embedded controller
Tri-Mode Ethernet MAC 10/100/1000 Mbps Ethernet
DDR/DDR2 Memory Controller SDRAM interface IP
PCI Lite PCI bus interface core

Ordering Information

Parameter Detail
Manufacturer Part Number XC3S200-4PQG208C
Manufacturer AMD / Xilinx
DigiKey Part Number 122-1448-ND
Package 208-PQFP
RoHS Status RoHS Compliant
Temperature Grade Commercial (0°C to +85°C)
Lead-Free Yes

Available Speed Grades for XC3S200 PQG208

Part Number Speed Grade Package Temperature
XC3S200-4PQG208C -4 (Slow) 208-PQFP Commercial
XC3S200-5PQG208C -5 (Medium) 208-PQFP Commercial
XC3S200-4PQG208I -4 (Slow) 208-PQFP Industrial

Frequently Asked Questions (FAQ)

Q: What is the difference between the -4 and -5 speed grades? The -5 speed grade offers faster timing (shorter propagation delays) than the -4 grade. The -4 grade is the more conservative option, typically consuming slightly less dynamic power and offering better timing margins in less demanding designs.

Q: Is the XC3S200-4PQG208C lead-free / RoHS compliant? Yes. The “G” in the package designation (PQG208) indicates the device uses a lead-free, RoHS-compliant package.

Q: Can I use Vivado to program this device? No. Xilinx Vivado does not support the Spartan-3 family. You must use Xilinx ISE Design Suite 14.7, which is available as a free download from the AMD/Xilinx website.

Q: What configuration PROM is compatible with the XC3S200? Xilinx XCF02S or XCF04S Platform Flash PROMs are commonly used for Master Serial configuration of the XC3S200. Third-party SPI Flash devices (e.g., Winbond W25Q series) are also widely supported via SPI Slave configuration mode.

Q: What is the maximum clock frequency for the XC3S200-4? The maximum system clock frequency depends heavily on the design implementation. For register-to-register paths, a well-optimized design can achieve system frequencies in the range of 100–200 MHz using the -4 speed grade with the Spartan-3 DCMs.


Summary

The XC3S200-4PQG208C is a proven, cost-effective FPGA solution from the Xilinx Spartan-3 family. With 200,000 system gates, 173 user I/O pins, 12 dedicated multipliers, 216 Kbits of block RAM, and four digital clock managers — all in a 208-pin PQFP package — this device provides an excellent balance of logic capacity, I/O density, and affordability for a wide range of embedded and digital design applications.

Its mature ecosystem, free ISE WebPACK toolchain support, and compatibility with industry-standard I/O levels make the XC3S200-4PQG208C a reliable choice for both new designs and legacy system maintenance.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.