The XC2S200-6FGG1113C is a high-performance field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device combines powerful logic density with flexible programmability. Whether you’re an embedded systems engineer, PCB designer, or procurement specialist, this guide covers everything you need to know about the XC2S200-6FGG1113C — from technical specifications to application use cases.

For a broader look at the full product lineup, visit Xilinx FPGA for more options and availability.

What Is the XC2S200-6FGG1113C? – Xilinx Spartan-II FPGA Overview

The XC2S200-6FGG1113C is part of the Xilinx Spartan-II 2.5V FPGA family, the flagship member of the series offering the largest logic capacity in the family. It is manufactured using an advanced 0.18μm process and operates on a 2.5V core supply, making it a practical choice for designers who need ASIC-like performance at FPGA flexibility.

Decoding the Part Number: XC2S200-6FGG1113C

Understanding the part number helps confirm you’re ordering the right component:

XC2S200-6FGG1113C Key Specifications at a Glance

Core Logic & Memory Specifications

Electrical & Timing Specifications

Package Information

XC2S200-6FGG1113C Architecture Deep Dive

Configurable Logic Blocks (CLBs)

The XC2S200 features 1,176 Configurable Logic Blocks, each containing four function generators (look-up tables), storage elements (flip-flops), and carry/arithmetic logic. This flexible CLB architecture allows designers to implement a wide range of digital logic functions efficiently.

Input/Output Blocks (IOBs)

With 284 maximum user I/O pins, the XC2S200-6FGG1113C offers extensive connectivity. Each IOB supports:

• Programmable input delay for setup time control
• Slew rate control (Fast/Slow)
• Optional pull-up or pull-down resistors
• 3-state output capability
• Multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, CTT, AGP)

Block RAM

The device includes 56K bits of block RAM organized into two columns on the die. Block RAM supports:

• True dual-port operation
• Synchronous read and write
• Configurable data widths (1, 2, 4, 8, or 16 bits)
• Built-in error correction capability

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops — one at each corner of the die — provide:

• Clock deskewing across the entire device
• Clock frequency synthesis and division
• Phase shifting for timing margin optimization
• Zero propagation delay for clock distribution

XC2S200-6FGG1113C vs. Other Spartan-II Family Members

The table below shows where the XC2S200 sits within the Spartan-II family, confirming it as the most logic-dense device in the series:

The XC2S200 delivers the largest logic capacity, the highest I/O count, and the most block RAM of any device in the Spartan-II family — making it the preferred choice when design complexity demands headroom.

Speed Grade -6: What It Means for Performance

The -6 speed grade is the fastest speed grade available in the Spartan-II family and is exclusively offered in the Commercial temperature range. This designation indicates:

• Lower propagation delays across logic paths
• Higher maximum operating frequency (fMAX) for synchronous designs
• Better setup-and-hold timing margins
• Ideal for high-speed data processing, bus interfaces, and signal processing pipelines

⚠️ Note: The -6 speed grade is not available in Industrial temperature range versions of the XC2S200. If your application demands an extended temperature range, consider the -5 speed grade parts.

Supported I/O Standards – XC2S200-6FGG1113C Compatibility Table

Configuration Modes for XC2S200-6FGG1113C

Spartan-II FPGAs, including the XC2S200, support multiple configuration modes to accommodate diverse system designs:

Typical Applications for XC2S200-6FGG1113C

The XC2S200-6FGG1113C is a versatile component used across many industries:

#### Communications & Networking

• Protocol conversion (UART, SPI, I2C, Ethernet)
• Line card logic and bus bridging
• Packet processing and switching fabric control

#### Industrial Automation

• Motor control and PWM generation
• Industrial Ethernet and field bus interfaces
• PLC (Programmable Logic Controller) acceleration

#### Consumer Electronics

• Set-top box and display control logic
• Audio/video signal processing
• Remote sensing and imaging pipelines

#### Test & Measurement Equipment

• Pattern generation and capture
• High-speed data acquisition logic
• Instrument front-end control

#### Embedded Computing

• Processor co-processing and glue logic
• Custom peripheral interfaces
• Hardware accelerators for DSP algorithms

Why Choose the XC2S200-6FGG1113C Over a Mask-Programmed ASIC?

The XC2S200-6FGG1113C is specifically positioned as a superior alternative to mask-programmed ASICs for high-volume applications — delivering the flexibility of an FPGA with performance that approaches custom silicon.

XC2S200-6FGG1113C Ordering & Availability Information

Ordering Code Breakdown

XC2S200 - 6 - FGG - 1113 - C
  |       |    |      |    |
  |       |    |      |    └── Temperature: C = Commercial (0°C to +85°C)
  |       |    |      └─────── Pin Count: 1113
  |       |    └────────────── Package: FGG = Fine-Pitch BGA, Pb-Free
  |       └─────────────────── Speed Grade: -6 (fastest)
  └─────────────────────────── Device: Spartan-II, 200K gates

Package Compliance

• RoHS Compliant: Yes
• Pb-Free: Yes (indicated by “G” in “FGG” package designator)
• Halogen-Free: Consult current datasheet for confirmation
• REACH Compliant: Yes

Frequently Asked Questions About XC2S200-6FGG1113C

What is the XC2S200-6FGG1113C used for?

The XC2S200-6FGG1113C is used in communications, industrial control, embedded computing, and test equipment applications requiring up to 200,000 system gates of programmable logic in a high-pin-count, lead-free BGA package.

What is the operating temperature of the XC2S200-6FGG1113C?

The “C” suffix indicates the Commercial temperature range: 0°C to +85°C. This part is not rated for Industrial (-40°C to +85°C) or Military temperature ranges.

Is the XC2S200-6FGG1113C RoHS compliant?

Yes. The “G” in the FGG package designation confirms the part uses Pb-free (lead-free) solder balls, making it RoHS compliant.

What programming software supports the XC2S200-6FGG1113C?

The XC2S200 is supported by Xilinx ISE Design Suite (the legacy toolchain for Spartan-II). Note that Vivado does not support Spartan-II devices; ISE 14.7 is the recommended tool.

What is the maximum I/O count for the XC2S200-6FGG1113C?

The XC2S200 supports up to 284 user I/O pins (not counting the 4 global clock/user input pins).

Summary: XC2S200-6FGG1113C at a Glance