The XC2S200-6FGG1112C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, logic-intensive applications, this device delivers 200,000 system gates, 5,292 logic cells, and a robust 1,112-pin Fine-Pitch Ball Grid Array (FBGA) package — making it a versatile choice for engineers seeking programmable logic at a competitive price point.
Whether you are designing embedded systems, communications hardware, digital signal processing circuits, or industrial control equipment, the XC2S200-6FGG1112C offers the flexibility and performance needed to bring complex designs to life. For a broader overview of the entire product line, explore our complete guide to Xilinx FPGA solutions.
What Is the XC2S200-6FGG1112C? Part Number Breakdown
Understanding the part number helps engineers quickly identify the device’s key characteristics:
| Code Segment |
Meaning |
Value |
| XC2S200 |
Device family and gate count |
Spartan-II, 200K system gates |
| -6 |
Speed grade |
Fastest (-6), Commercial only |
| FGG |
Package type (Pb-Free BGA) |
Fine-Pitch Ball Grid Array |
| 1112 |
Pin count |
1,112 pins |
| C |
Temperature range |
Commercial (0°C to +85°C) |
Note: The “G” in “FGG” indicates a Pb-free (RoHS-compliant) package, ideal for designs subject to environmental regulations.
XC2S200-6FGG1112C Key Specifications
Core Logic and Memory Specifications
| Parameter |
XC2S200 Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Total Distributed RAM Bits |
75,264 bits |
| Total Block RAM Bits |
56K bits (56,000) |
| Block RAM Columns |
2 |
| Delay-Locked Loops (DLLs) |
4 |
Package and Electrical Specifications
| Parameter |
Value |
| Package Type |
FGG (Fine-Pitch BGA, Pb-Free) |
| Pin Count |
1,112 |
| Supply Voltage (VCC) |
2.5V |
| Speed Grade |
-6 (fastest available) |
| Temperature Range |
Commercial: 0°C to +85°C |
| Configuration Modes |
Master/Slave Serial, SelectMAP, JTAG Boundary Scan |
Spartan-II FPGA Family Comparison
The table below positions the XC2S200 at the top of the Spartan-II lineup, helping buyers choose the right density for their application:
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8 × 12 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12 × 18 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16 × 24 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20 × 30 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24 × 36 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28 × 42 |
284 |
75,264 bits |
56K |
The XC2S200 offers the highest logic density, I/O count, and memory resources in the Spartan-II family, making it the go-to choice for designs that have outgrown smaller FPGA devices.
Architecture Overview: How the XC2S200 Is Built
Configurable Logic Blocks (CLBs)
The heart of the XC2S200-6FGG1112C is its array of 1,176 Configurable Logic Blocks (CLBs). Each CLB contains lookup tables (LUTs), flip-flops, and carry logic, which can be configured to implement virtually any combinational or sequential logic function. The CLBs can also be used as distributed RAM, giving designers flexible, fine-grained memory resources directly embedded in the logic fabric.
Input/Output Blocks (IOBs)
Surrounding the CLB array is a perimeter of programmable Input/Output Blocks (IOBs). Each IOB can be independently configured to support a wide range of single-ended and differential I/O standards, including LVTTL, LVCMOS, PCI, SSTL, and GTL. This flexibility allows the XC2S200 to interface directly with a broad range of external components without additional glue logic.
Block RAM
The XC2S200 includes two columns of dedicated Block RAM, positioned on opposite sides of the die. These offer a combined capacity of 56K bits of on-chip memory, configurable in various aspect ratios. Block RAM is ideal for implementing FIFOs, lookup tables, and data buffers without consuming CLB resources.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide precise clock management. DLLs eliminate clock distribution delay, allow frequency multiplication and division, and enable phase shifting for advanced timing control. This makes the XC2S200 well-suited for high-speed synchronous designs.
Routing Architecture
All functional elements are interconnected by a hierarchical routing architecture with local, long-line, and global routing resources. This ensures that even complex, high-fanout designs achieve timing closure efficiently.
XC2S200-6FGG1112C Speed Grade Explained
The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the Commercial temperature range (0°C to +85°C). It is ideal for applications where maximum clock frequency and minimum propagation delay are critical.
Speed Grade Comparison
| Speed Grade |
Performance Level |
Temperature Range |
| -5 |
Standard |
Commercial & Industrial |
| -6 |
Fastest |
Commercial only |
Designers working on industrial or extended-temperature applications should opt for the -5 speed grade, while commercial applications can take full advantage of the -6 speed grade’s superior timing performance.
Configuration and Programming
Supported Configuration Modes
The XC2S200-6FGG1112C supports multiple industry-standard configuration modes, enabling flexible integration into diverse board designs:
| Mode |
Description |
| Master Serial |
FPGA drives a serial PROM for self-configuration |
| Slave Serial |
External controller drives the configuration data |
| SelectMAP (x8) |
Parallel byte-wide configuration for faster programming |
| JTAG (IEEE 1149.1) |
Boundary Scan for in-circuit testing and programming |
Pb-Free (RoHS) Compliance
The “G” designation in the FGG package code confirms Pb-free (lead-free) packaging, complying with RoHS environmental directives. This is increasingly required for products sold in the EU, and is best practice globally for new designs.
Typical Applications for the XC2S200-6FGG1112C
The XC2S200-6FGG1112C is well-suited for a wide range of applications where programmable logic, high I/O count, and 2.5V operation intersect:
| Application Area |
Use Case Example |
| Communications |
Protocol bridging, line cards, framing logic |
| Industrial Control |
Motor control, sensor fusion, custom bus interfaces |
| Consumer Electronics |
Set-top boxes, display controllers |
| Embedded Systems |
Custom processor peripherals, DMA controllers |
| Digital Signal Processing |
FIR/IIR filters, FFT accelerators |
| Test & Measurement |
Pattern generators, logic analyzers |
| Prototyping & Emulation |
ASIC prototyping, system emulation |
Its large I/O count of up to 284 user I/Os, combined with the generous 1,112-pin BGA package, makes this device particularly valuable in bus-intensive and multi-interface applications where board real estate must be optimized.
Why Choose the XC2S200-6FGG1112C?
Superior Cost-to-Performance Ratio
The Spartan-II family was designed from the ground up as a cost-optimized alternative to mask-programmed ASICs. The XC2S200 provides ASIC-level integration at a fraction of the non-recurring engineering (NRE) cost, with the added advantage of full reprogrammability.
Proven, Mature Technology
The Spartan-II is a mature, well-documented platform with decades of proven deployment. Designers benefit from extensive documentation, reference designs, and community support through Xilinx (now AMD) and third-party resources.
Flexible I/O Standards
Support for multiple I/O voltage standards (LVTTL, LVCMOS2, PCI, SSTL2, GTL, and more) means the XC2S200 can seamlessly interface with both legacy and modern components on the same PCB.
High-Quality Pb-Free Packaging
The Pb-free FGG1112 BGA package ensures environmental compliance and suitability for long-lifecycle industrial and commercial products.
Ordering Information Summary
| Attribute |
Value |
| Part Number |
XC2S200-6FGG1112C |
| Manufacturer |
Xilinx (AMD) |
| Series |
Spartan-II |
| Supply Voltage |
2.5V |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| Package |
1112-Ball FBGA (Pb-Free) |
| Speed Grade |
-6 |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Yes (Pb-Free “G” package) |
Frequently Asked Questions (FAQ)
Q: What does the “-6” mean in XC2S200-6FGG1112C?
A: The “-6” designates the speed grade. It is the fastest speed grade available for the Spartan-II family, offering the lowest propagation delays and highest clock frequencies. It is only available in the Commercial temperature range (0°C to +85°C).
Q: Is the XC2S200-6FGG1112C RoHS compliant?
A: Yes. The “G” in “FGG” indicates a Pb-free, RoHS-compliant package.
Q: How many user I/Os does the XC2S200 support?
A: The XC2S200 supports up to 284 user I/Os (not counting the four global clock/user input pins).
Q: What configuration methods are supported?
A: The device supports Master Serial, Slave Serial, SelectMAP (parallel), and JTAG Boundary Scan configuration modes.
Q: What is the difference between XC2S200-5FGG1112C and XC2S200-6FGG1112C?
A: The primary difference is speed grade. The -6 version offers faster timing performance than -5, but is restricted to the Commercial temperature range. The -5 is available in both Commercial and Industrial temperature ranges.
Q: Can the XC2S200 be used as an ASIC replacement?
A: Yes. The Spartan-II family was specifically designed as a cost-effective alternative to mask-programmed ASICs, offering full reprogrammability without NRE costs.
Conclusion
The XC2S200-6FGG1112C remains a compelling choice for engineers working on high-volume, cost-sensitive applications that require robust programmable logic, a wide range of I/O standards, and proven reliability. With its 200,000 system gates, 284 user I/Os, integrated block RAM, and high-speed -6 timing, it delivers the performance and flexibility expected from the Xilinx Spartan-II platform — all in a RoHS-compliant 1,112-pin BGA package.
