Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3S200-4VQ100C: Xilinx Spartan-3 FPGA — Complete Product Guide

Product Details

The XC3S200-4VQ100C is a high-performance, cost-optimized field-programmable gate array (FPGA) from the Xilinx FPGA Spartan-3 family. Designed for high-volume, cost-sensitive applications, this device delivers powerful logic density in a compact 100-pin VQFP package. Whether you are developing embedded systems, digital signal processing circuits, or custom logic controllers, the XC3S200-4VQ100C offers an ideal combination of performance, I/O flexibility, and affordability.


What Is the XC3S200-4VQ100C?

The XC3S200-4VQ100C is a member of AMD (formerly Xilinx) Spartan-3 series — one of the most widely deployed FPGA families in industrial and commercial electronics. The “200” in the part number indicates 200,000 equivalent system gates, while “4” refers to the speed grade, “VQ100” specifies the 100-pin VQFP package, and “C” denotes the commercial temperature grade (0°C to +85°C).

This device is programmable using Xilinx ISE Design Suite and supports VHDL, Verilog, and schematic-based design entry, making it accessible to both beginner and experienced hardware engineers.


XC3S200-4VQ100C Key Specifications

General Electrical Characteristics

Parameter Value
Manufacturer AMD (Xilinx)
Part Number XC3S200-4VQ100C
Series Spartan-3
Logic Gates (Equivalent) 200,000
Configurable Logic Blocks (CLBs) 1,176
Flip-Flops 4,320
Maximum Distributed RAM 30 Kb
Block RAM 216 Kb (12 × 18 Kb blocks)
DSP / Multiplier Blocks 12 (18×18-bit multipliers)
Maximum User I/O 63
Package VQFP-100 (VQ100)
Package Dimensions 14mm × 14mm
Temperature Grade Commercial (0°C to +85°C)
Supply Voltage (VCCINT) 1.2V
Supply Voltage (VCCO) 1.2V – 3.3V
Speed Grade -4

XC3S200 Clock and Timing Specifications

Feature Value
Digital Clock Managers (DCMs) 4
Maximum System Clock Frequency Up to 280 MHz (speed grade dependent)
Global Clock Networks 8
DLL / PLL Support Yes (via DCM)
Clock Jitter < 200 ps (typical)

XC3S200-4VQ100C Package and Pin Information

Attribute Details
Package Type Plastic Very Thin Quad Flat Pack (VQFP)
Pin Count 100
Package Code VQ100
Body Size 14mm × 14mm
Lead Pitch 0.5mm
Mounting Type Surface Mount (SMD)
RoHS Compliance Yes

XC3S200-4VQ100C vs XC3S200-4VQ100I: What Is the Difference?

A common comparison is between the XC3S200-4VQ100C (commercial) and the XC3S200-4VQ100I (industrial). The core silicon, logic, and I/O are identical — the only difference is the operating temperature range.

Parameter XC3S200-4VQ100C XC3S200-4VQ100I
Temperature Grade Commercial Industrial
Operating Temperature 0°C to +85°C -40°C to +100°C
Typical Application Consumer, commercial electronics Industrial, automotive, harsh environments
Price Lower Slightly Higher

Choose the C variant for office and lab environments; select the I variant when the device will operate in temperature-extreme conditions such as factory floors or outdoor enclosures.


Spartan-3 Architecture: Internal Resources Explained

Configurable Logic Blocks (CLBs)

The XC3S200 contains 1,176 CLBs, each consisting of four slices. Each slice includes two 4-input look-up tables (LUTs), two flip-flops, carry logic, and multiplexers. This architecture supports both combinational and sequential logic efficiently.

Block RAM (BRAM)

Twelve 18 Kb dual-port block RAM tiles provide 216 Kb of total on-chip RAM. These memories are configurable as single-port or dual-port and support various aspect ratios from 16K×1 to 512×36. Block RAM is ideal for FIFOs, lookup tables, and on-chip data buffers.

Dedicated Multipliers

Twelve 18×18-bit dedicated hardware multipliers accelerate DSP tasks such as digital filtering, FFTs, and modulation/demodulation operations — without consuming CLB resources.

Digital Clock Managers (DCMs)

Four DCMs support clock synthesis, phase shifting, frequency division, and multiplication. They allow designers to generate multiple clock domains with precise phase and frequency relationships from a single input clock.

SelectIO Technology

The XC3S200-4VQ100C supports multiple I/O standards through Xilinx SelectIO, including LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V), SSTL, HSTL, and PCI. This flexibility allows seamless interfacing with diverse memory chips, processors, and peripheral devices.


Supported I/O Standards

I/O Standard Voltage Use Case
LVTTL 3.3V General logic interface
LVCMOS33 3.3V Microcontroller interfacing
LVCMOS25 2.5V Low-power digital logic
LVCMOS18 1.8V Low-voltage peripherals
LVCMOS15 1.5V DDR memory interface
SSTL2 / SSTL3 2.5V / 3.3V SDRAM, DDR1
HSTL 1.5V High-speed internal bus
PCI 3.3V PCI bus compliance

XC3S200-4VQ100C Typical Applications

The XC3S200-4VQ100C is suitable for a wide range of digital design applications:

  • Embedded control systems — custom state machines, bus bridges, peripheral controllers
  • Digital Signal Processing (DSP) — FIR/IIR filters, FFT engines, audio/video processing
  • Communications interfaces — UART, SPI, I2C, CAN bus controllers
  • Glue logic replacement — consolidating multiple discrete logic ICs into a single programmable device
  • Motor control — PWM generation, encoder decoding, servo control
  • Prototyping and education — university labs, FPGA learning boards, hardware proof-of-concept
  • Industrial automation — PLC I/O expansion, sensor data acquisition

Configuration Modes

The XC3S200 is a volatile SRAM-based FPGA and must be reconfigured at every power-up. It supports multiple configuration modes:

Mode Description
Master Serial FPGA drives clock; reads bitstream from serial PROM
Slave Serial External controller drives clock and data
Master Parallel (SelectMAP) High-speed parallel configuration from byte-wide flash
Slave Parallel (SelectMAP) Processor-driven byte-wide configuration
JTAG Boundary scan and in-system programming via 4-wire JTAG

The XCF02S or XCF04S Platform Flash PROM is commonly paired with the XC3S200 for reliable non-volatile configuration storage.


Design Tool Support

Tool Details
Primary IDE Xilinx ISE Design Suite (free WebPACK edition available)
Hardware Description Languages VHDL, Verilog, SystemVerilog
IP Core Library Xilinx LogiCORE IP cores
Simulation ModelSim, ISim (included with ISE)
Third-Party Support Synplify Pro, Mentor Precision
Programming Hardware Xilinx Platform Cable USB II, Digilent JTAG-HS2

Note: Vivado Design Suite does NOT support Spartan-3 devices. Use Xilinx ISE 14.7 (the final ISE release) for design, synthesis, and implementation.


Power Consumption Overview

Rail Typical Current (Active) Notes
VCCINT (1.2V) ~80–150 mA Core logic switching power
VCCO (3.3V) ~30–80 mA I/O bank power (depends on load)
VCCAUX (2.5V) ~10–20 mA Auxiliary circuits, DCM

Power consumption varies significantly with design activity factor, I/O loading, and clock frequency. Xilinx XPower Analyzer (included in ISE) should be used for accurate power estimation.


Ordering Information

Part Number Package Speed Grade Temperature Description
XC3S200-4VQ100C VQFP-100 -4 Commercial (0°C to +85°C) This product
XC3S200-4VQ100I VQFP-100 -4 Industrial (-40°C to +100°C) Industrial version
XC3S200-5VQ100C VQFP-100 -5 Commercial Faster speed grade
XC3S200-4PQ208C PQFP-208 -4 Commercial More I/O (141 user I/O)
XC3S200-4FT256C FTBGA-256 -4 Commercial BGA package, more I/O

Frequently Asked Questions (FAQ)

What does the “-4” speed grade mean on the XC3S200-4VQ100C?

The speed grade “-4” indicates timing performance relative to other speed grades in the family. Higher speed grade numbers (e.g., -5) are faster but more expensive. The -4 grade is the standard option and supports clock frequencies up to approximately 250–280 MHz depending on the design.

Is the XC3S200-4VQ100C RoHS compliant?

Yes. The commercial VQ100 package of the XC3S200 is available in a RoHS-compliant (lead-free) version. Verify with your supplier that the specific lot is lead-free if compliance is required.

Can I use the XC3S200-4VQ100C in automotive designs?

The “C” (commercial) temperature grade is rated only from 0°C to +85°C, making it unsuitable for most automotive applications. Use the XC3S200-4VQ100I industrial grade (-40°C to +100°C) or consider automotive-qualified parts from higher-end families.

What is the maximum I/O count of the XC3S200 in VQ100 package?

The 100-pin VQFP package provides 63 user-configurable I/O pins. If more I/O is needed, consider the PQ208 (141 I/O) or FT256 (173 I/O) packages of the same XC3S200 die.

What non-volatile storage should I use to configure the XC3S200?

Xilinx recommends Platform Flash PROMs such as the XCF01S (1 Mb), XCF02S (2 Mb), or XCF04S (4 Mb). The XC3S200 bitstream is approximately 1.0 Mb, so the XCF01S is the minimum suitable device.


Summary

The XC3S200-4VQ100C is a dependable, cost-effective FPGA solution for commercial-temperature applications requiring up to 200K logic gates, 216 Kb of block RAM, and 63 user I/O pins in a compact 100-pin VQFP form factor. With 12 dedicated multipliers, 4 digital clock managers, and support for a broad range of I/O standards, this Spartan-3 device continues to be a popular choice for embedded systems, DSP applications, and digital logic prototyping worldwide.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.