The XC2S200-6FGG1109C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, a -6 speed grade, and is housed in a fine-pitch 1109-pin BGA package — making it one of the most capable configurations in the Spartan-II lineup. Whether you are a hardware engineer sourcing components or a procurement specialist evaluating FPGA options, this guide covers everything you need to know about the XC2S200-6FGG1109C.

What Is the XC2S200-6FGG1109C? — Overview of the Xilinx Spartan-II FPGA

The XC2S200-6FGG1109C belongs to Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic platform built on 0.18µm CMOS technology. It is widely regarded as a superior, lower-cost alternative to mask-programmed ASICs, offering the flexibility of field-programmable logic without the long development cycles or non-recurring engineering (NRE) costs typically associated with custom silicon.

Part Number Breakdown: Decoding XC2S200-6FGG1109C

Understanding the part number is essential for procurement and design decisions:

XC2S200-6FGG1109C Key Specifications at a Glance

The table below summarizes the most critical technical parameters for the XC2S200-6FGG1109C, enabling fast comparison during component evaluation.

XC2S200-6FGG1109C Architecture: Inside the Spartan-II FPGA

Configurable Logic Blocks (CLBs)

The XC2S200 contains 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB includes:

• Four logic cells, each with a 4-input Look-Up Table (LUT)
• Dedicated carry logic for fast arithmetic
• Flip-flops with synchronous/asynchronous set and reset
• Wide function multiplexers for implementing complex logic

This architecture enables efficient implementation of state machines, data paths, arithmetic units, and custom logic functions.

Block RAM — On-Chip Memory for High-Speed Data Buffering

The XC2S200 provides 56K bits of block RAM, organized in fully synchronous dual-port 4096-bit RAM blocks. Key features include:

• Independent control signals for each port
• Configurable data widths on each port independently
• Support for single-port or dual-port operation
• Ideal for FIFOs, look-up tables, and local data storage

Input/Output Blocks (IOBs) and User I/O Capabilities

Delay-Locked Loops (DLLs) for Clock Management

The XC2S200-6FGG1109C includes four Delay-Locked Loops (DLLs), one at each corner of the die. These DLLs enable:

• Zero clock skew distribution across the device
• Clock frequency synthesis (multiply/divide)
• Board-level clock deskewing (drive off-chip and back in)
• Phase shifting for timing margin optimization

Speed Grade -6: Performance Characteristics of the XC2S200-6FGG1109C

The -6 speed grade is the fastest commercially available option in the Spartan-II family, exclusively available in the commercial (C) temperature range. This makes the XC2S200-6FGG1109C ideal for latency-sensitive and high-throughput designs.

Speed Grade Comparison for XC2S200

Note: The -6 speed grade is exclusively available in the Commercial temperature range and is the recommended choice for maximum performance in controlled environments.

Package Details: FGG1109 Fine-Pitch Ball Grid Array

Why the FGG1109 Package?

The FGG1109 is a Fine-pitch Ball Grid Array with 1,109 solder balls. This package type offers significant advantages over traditional leaded packages:

• Smaller PCB footprint compared to equivalent leaded packages
• Superior electrical performance due to shorter lead paths
• Better thermal dissipation through the ground plane connection
• Higher pin density enabling access to more I/Os in compact board designs

FGG1109 Package Mechanical Specifications

Configuration Modes Supported by XC2S200-6FGG1109C

The XC2S200-6FGG1109C supports multiple industry-standard configuration methods, providing flexibility for various system designs:

Configuration can be stored in an external serial PROM, flash memory, or loaded via JTAG during development and debugging.

XC2S200-6FGG1109C Applications: Where Is This FPGA Used?

Thanks to its combination of 200K gates, -6 speed grade, and extensive I/O capability, the XC2S200-6FGG1109C is used across a wide range of industries and applications:

Typical Application Areas

For engineers working on custom PCB designs with Xilinx FPGAs, you can explore our full selection on Xilinx FPGA to find related parts, compatible devices, and procurement support.

XC2S200-6FGG1109C vs. Comparable Spartan-II Variants

When selecting the right Spartan-II part, comparing package and speed grade options is critical. The table below positions the XC2S200-6FGG1109C against similar variants:

The XC2S200-6FGG1109C offers the highest pin count and fastest speed grade, making it the top choice when maximum I/O expansion and performance are both required.

Design Tool Support for XC2S200-6FGG1109C

Xilinx (AMD) provides complete design tool support for the Spartan-II family:

Supported EDA Tools

Supported HDL Languages

• VHDL
• Verilog / SystemVerilog
• ABEL (legacy)
• Schematic capture (ISE Schematic Editor)

Ordering Information and Availability

How to Read the Full Part Number

XC2S200 - 6 - FGG - 1109 - C
   |       |    |     |     |
   |       |    |     |     └─ Temperature: C = Commercial
   |       |    |     └─────── Pin Count: 1109
   |       |    └───────────── Package: FGG (Fine-pitch BGA, Pb-free)
   |       └────────────────── Speed Grade: -6 (fastest)
   └────────────────────────── Device: Spartan-II, 200K gates

Key Purchasing Considerations

Frequently Asked Questions About XC2S200-6FGG1109C

What does the -6 speed grade mean on the XC2S200-6FGG1109C?

The -6 speed grade indicates the fastest performance tier within the commercial Spartan-II range. It supports a maximum operating frequency of 263 MHz and offers the lowest propagation delays, making it optimal for timing-critical digital designs.

Is the XC2S200-6FGG1109C RoHS compliant?

Yes. The “G” in the FGG package suffix confirms that this device uses Pb-free (lead-free) solder balls, making it fully RoHS compliant for environmentally regulated markets.

What is the operating voltage of the XC2S200-6FGG1109C?

The device operates on a 2.5V core supply voltage. I/O banks can interface at 3.3V (LVTTL/LVCMOS) with appropriate I/O standard selection, making it compatible with a wide range of peripheral devices.

Can the XC2S200-6FGG1109C be used in industrial temperature applications?

No. The “C” suffix denotes a commercial temperature range (0°C to +85°C). For industrial environments requiring operation down to -40°C, the XC2S200-xFGxxI variants (industrial suffix “I”) should be selected instead.

What configuration storage options work with this FPGA?

The XC2S200-6FGG1109C can be configured using a dedicated Xilinx serial PROM, standard SPI flash, parallel flash memory, or via JTAG (Boundary-Scan mode) directly from a programmer. Configuration data is volatile and must be loaded at every power-up.

Are there pin-compatible alternatives to the XC2S200-6FGG1109C?

Within the Spartan-II family, different speed grades in the same FGG1109 package are pin-compatible. However, migrating to newer families (Spartan-3, Spartan-6, or Artix-7) requires PCB redesign as these are different packages and architectures.

Summary: Why Choose the XC2S200-6FGG1109C?

The XC2S200-6FGG1109C delivers a proven combination of logic capacity, I/O flexibility, and peak performance in a compact BGA format. It is particularly well-suited for:

• Applications demanding the maximum -6 speed grade in the Spartan-II family
• Designs requiring high I/O pin count (up to 284 user I/Os)
• Systems needing on-chip memory (56K block RAM + 75K distributed RAM)
• Cost-effective ASIC replacement with in-field reprogrammability
• Pb-free, RoHS-compliant manufacturing requirements

While the Spartan-II family is a mature product line, the XC2S200-6FGG1109C remains in active use across legacy system maintenance, defense applications, and industrial equipment where the Spartan-II is a qualified and certified component.