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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC3S200-5PQ208C: Xilinx Spartan-3 FPGA – Full Specifications, Features & Applications

Product Details

The XC3S200-5PQ208C is a high-performance, commercially graded Xilinx FPGA from the Spartan-3 family, manufactured by AMD (formerly Xilinx). Housed in a 208-pin Plastic Quad Flat Pack (PQFP) package, this device delivers 200,000 system gates, making it an ideal programmable logic solution for cost-sensitive, high-volume embedded applications. The “-5” speed grade designation indicates the fastest available performance tier in the Spartan-3 series, providing designers with maximum timing margin and flexibility.

Whether you are designing digital signal processing (DSP) pipelines, communication interfaces, or custom embedded controllers, the XC3S200-5PQ208C offers a compelling combination of logic density, I/O flexibility, and ease of use with Xilinx ISE design tools.


XC3S200-5PQ208C Key Specifications at a Glance

Parameter Value
Manufacturer AMD (Xilinx)
Part Number XC3S200-5PQ208C
Series Spartan-3
Logic Gates (System Gates) 200,000
Logic Cells 4,320
CLB Slices 1,920
Distributed RAM 30 Kb
Block RAM 216 Kb
Multipliers (18×18) 12
DCM (Digital Clock Manager) 4
Package PQFP-208 (PQ208)
Speed Grade -5 (Fastest)
Operating Temperature 0°C to +85°C (Commercial)
Supply Voltage (VCC INT) 1.2 V
Supply Voltage (VCC IO) 1.2 V – 3.3 V
Maximum User I/O Pins 141
ROHS Status Lead-Free / RoHS Compliant

What Is the Spartan-3 Family?

The Spartan-3 is Xilinx’s third-generation low-cost FPGA platform, optimized for high-volume consumer and industrial applications. The family is built on a 90nm process technology and features a rich set of programmable logic resources, dedicated multiplier blocks, and flexible I/O standards. The XC3S200 is the entry-to-mid tier device in the Spartan-3 lineup, balancing logic capacity with power efficiency and affordability.

Spartan-3 Family Comparison: Where Does XC3S200 Fit?

Device System Gates Logic Cells Block RAM Multipliers Max I/O
XC3S50 50,000 1,728 72 Kb 4 124
XC3S200 200,000 4,320 216 Kb 12 141
XC3S400 400,000 8,064 288 Kb 16 264
XC3S1000 1,000,000 17,280 432 Kb 24 391
XC3S1500 1,500,000 29,952 576 Kb 32 487

XC3S200-5PQ208C: Detailed Feature Breakdown

#### Configurable Logic Blocks (CLBs)

The XC3S200 contains 1,920 CLB slices, each slice comprising two 4-input Look-Up Tables (LUTs) and two flip-flops. These LUTs can be used either as logic functions or as 16×1-bit distributed RAM. This architecture enables highly flexible, fine-grained logic implementation for both combinational and registered designs.

#### Block RAM (BRAM)

With 12 block RAM tiles providing a total of 216 Kb of on-chip synchronous dual-port memory, the XC3S200 is well-suited for buffering, FIFOs, lookup tables, and small embedded CPU data stores. Each BRAM block can be configured in various aspect ratios from 16K×1 to 512×36.

#### Dedicated 18×18 Multipliers

The 12 hardware multipliers (18×18-bit) enable high-throughput DSP functions without consuming CLB resources. These are particularly valuable for FIR filters, FFTs, image processing, and software-defined radio (SDR) applications.

#### Digital Clock Manager (DCM)

Four Digital Clock Managers provide clock synthesis, clock multiplication/division, phase shifting, and deskewing. The DCM enables designers to generate multiple derived clocks from a single reference, simplifying multi-domain designs and eliminating clock skew.

#### I/O Standards and Pins

The 141 user I/O pins support a wide range of single-ended and differential I/O standards, including:

I/O Standard Description
LVCMOS 1.8V / 2.5V / 3.3V General-purpose low-voltage CMOS
LVTTL Low-voltage TTL compatible
LVDS Low-voltage differential signaling
SSTL2 / SSTL3 Stub Series Terminated Logic
GTL / GTLP Gunning Transceiver Logic
PCI 3.3V PCI bus compatible

XC3S200-5PQ208C vs XC3S200-4PQ208C: Speed Grade Comparison

The primary difference between the -5 and -4 variants is the speed grade. A higher speed grade means shorter propagation delays and higher maximum clock frequencies.

Parameter XC3S200-4PQ208C XC3S200-5PQ208C
Speed Grade -4 (Standard) -5 (Fast)
Typical Fmax Lower Higher
Part Number XC3S200-4PQ208C XC3S200-5PQ208C
Package PQ208 PQ208
Temperature Grade Commercial (0°C to +85°C) Commercial (0°C to +85°C)
Logic Resources Identical Identical

The -5 speed grade is the preferred choice when designs are timing-critical or when operating at clock frequencies that push the limits of the -4 variant. For less demanding applications, the -4 variant is a cost-effective alternative with pin and package compatibility.


PQ208 Package: Physical and PCB Design Details

The PQ208 (PQFP-208) is a 208-pin plastic quad flat package with a 0.5 mm lead pitch. This surface-mount package is widely used in commercial FPGA designs and is fully compatible with standard PCB fabrication processes.

PQ208 Package Dimensions

Parameter Value
Package Type PQFP (Plastic Quad Flat Pack)
Pin Count 208
Lead Pitch 0.5 mm
Body Size 28 mm × 28 mm (nominal)
Height 3.4 mm max
Soldering Method SMT Reflow
RoHS Compliant

PCB designers should follow Xilinx’s recommended land pattern for the PQ208 package and ensure proper decoupling capacitors are placed close to the VCCINT (1.2 V core) and VCCO (I/O bank) power pins to maintain signal integrity.


Typical Applications of the XC3S200-5PQ208C

The XC3S200-5PQ208C is used across a broad range of industries and application domains:

#### Industrial and Embedded Control

  • Custom PLC logic and state machines
  • Motor control interfaces
  • Sensor fusion and data aggregation

#### Communications and Networking

  • UART, SPI, I²C, and custom serial protocol bridges
  • Ethernet MAC implementations
  • Wireless baseband processing

#### Consumer Electronics

  • Display controllers
  • Video scaler and timing generation
  • USB bridge implementations

#### Prototyping and Development

  • Hardware emulation of ASICs
  • IP core verification platforms
  • University and research FPGA development boards

#### Defense and Aerospace (Commercial Grade Constraints Apply)

  • Signal processing front-ends
  • Interface adapters for legacy systems
  • Note: For mil/aero requirements, consider industrial or extended temperature variants

Design and Programming: Getting Started with XC3S200-5PQ208C

#### Supported Design Tools

The XC3S200-5PQ208C is fully supported by Xilinx ISE Design Suite (the legacy toolchain for Spartan-3 devices). While Xilinx Vivado does not support Spartan-3, ISE 14.7 (the final release) remains available and functional on Linux and Windows.

Tool Version Notes
Xilinx ISE Design Suite 14.7 (Final) Full support for Spartan-3
iMPACT Included with ISE Programming and configuration
ChipScope Pro Included with ISE In-circuit debugging
PlanAhead Legacy version Floor planning

#### Configuration Modes

The XC3S200 supports multiple configuration modes, selectable via the M0, M1, M2 pins:

Mode Description
Master Serial External serial Flash (e.g., SPI) drives the FPGA
Slave Serial External controller drives the FPGA serially
Master SelectMAP (Parallel) Parallel byte-wide configuration bus
JTAG In-system programming via JTAG boundary scan

JTAG is the most commonly used configuration interface during development. For production, Master Serial mode with an external SPI Flash (e.g., Xilinx Platform Flash or Micron SPI NOR) is standard.


Power Consumption and Supply Requirements

Supply Rail Voltage Purpose
VCCINT 1.2 V Core logic power
VCCO (Bank 0–3) 1.2 V – 3.3 V I/O bank voltage (per bank)
VCCAUX 2.5 V Auxiliary circuits (DCM, config)

Careful power sequencing is recommended: VCCINT should ideally power up before or simultaneously with VCCO. The total static power consumption for the XC3S200 at room temperature is typically under 100 mW, with dynamic power depending on toggle rate and design activity.


Ordering Information and Part Number Decoder

Understanding the XC3S200-5PQ208C part number:

Segment Value Meaning
XC XC Xilinx Commercial Device
3S 3S Spartan-3 Family
200 200 200,000 System Gates
Separator
5 5 Speed Grade (-5 = Fastest)
PQ PQ PQFP Package
208 208 208 Pins
C C Commercial Temperature (0°C to +85°C)

Related Part Numbers

Part Number Speed Grade Package Temp Grade
XC3S200-4PQ208C -4 PQ208 Commercial
XC3S200-5PQ208C -5 PQ208 Commercial
XC3S200-4PQ208I -4 PQ208 Industrial (-40°C to +100°C)
XC3S200-4TQ144C -4 TQ144 Commercial
XC3S200-5VQ100C -5 VQ100 Commercial

Why Choose the XC3S200-5PQ208C?

  • Maximum Speed: The -5 speed grade delivers the highest performance available in the Spartan-3 200K gate tier, ensuring timing closure even in demanding designs.
  • Rich Logic Resources: 4,320 logic cells, 12 hardware multipliers, and 216 Kb block RAM provide sufficient resources for mid-complexity designs.
  • Proven Architecture: The Spartan-3 has millions of units deployed globally in industrial, automotive, and consumer applications, with a well-documented design ecosystem.
  • Wide I/O Flexibility: Support for 15+ I/O standards across 141 user pins enables seamless interfacing with a wide range of external devices.
  • Cost-Effective PQ208 Package: The standard PQFP footprint is easy to hand-solder for prototyping and well-supported by automated PCB assembly processes.
  • RoHS Compliant: Meets global environmental compliance requirements for lead-free manufacturing.

Frequently Asked Questions (FAQ)

Q: Is the XC3S200-5PQ208C still in production? A: The Spartan-3 family is in a mature/end-of-life phase. Availability depends on distributor stock. Check current inventory with authorized distributors or contact AMD directly for longevity commitments.

Q: What is the difference between XC3S200-5PQ208C and XC3S200-4PQ208C? A: The only difference is the speed grade. The -5 variant has faster propagation delays and supports higher maximum clock frequencies than the -4. All other specifications, logic resources, and pinouts are identical.

Q: Can I program the XC3S200-5PQ208C with Vivado? A: No. Vivado does not support Spartan-3 devices. Use Xilinx ISE Design Suite 14.7, the final version that supports the full Spartan-3 family.

Q: What FPGA programmer is compatible with this device? A: The Xilinx Platform Cable USB II (DLC10), Digilent JTAG-HS2/HS3, and compatible third-party JTAG cables work with ISE iMPACT for programming via JTAG.

Q: Is there a soft-core processor option for this device? A: Yes. Xilinx’s PicoBlaze (8-bit, minimal resources) and MicroBlaze (32-bit soft processor, requires more resources) are both compatible with the XC3S200. MicroBlaze with a minimal configuration fits comfortably within the 4,320 logic cells.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.