The XC2S200-6FGG1108C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) manufactured by Xilinx as part of the Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates in a compact 1108-ball Fine-Pitch BGA (Pb-free) package. Whether you are designing embedded systems, communications hardware, or digital signal processing circuits, the XC2S200-6FGG1108C offers an exceptional balance of logic density, speed, and I/O capability.

If you are sourcing or comparing Xilinx FPGA components for your next project, this guide covers everything you need to know — from core specifications and package details to architecture highlights and application use cases.

What Is the XC2S200-6FGG1108C?

The XC2S200-6FGG1108C belongs to Xilinx’s Spartan-II FPGA series, which was engineered as a cost-optimized, programmable alternative to mask-programmed ASICs. The part number breaks down as follows:

This device combines 5,292 logic cells, four Delay-Locked Loops (DLLs), 56Kb of block RAM, and up to 284 user I/O pins — all in an advanced 0.18µm CMOS process technology running on a 2.5V core supply.

XC2S200-6FGG1108C Key Specifications

Core Logic Resources

Electrical & Process Specifications

Package Details

XC2S200-6FGG1108C Architecture Overview

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1108C is its array of 1,176 Configurable Logic Blocks (CLBs) arranged in a 28-column by 42-row matrix. Each CLB contains:

• Four logic cells, each with a 4-input Look-Up Table (LUT)
• Dedicated fast carry logic for arithmetic operations
• Flip-flops with synchronous/asynchronous set and reset

This architecture allows designers to implement complex combinational and sequential logic efficiently across the device fabric.

Block RAM

The XC2S200-6FGG1108C includes 56Kb of dual-port block RAM organized in two vertical columns. Each block RAM can operate independently or be cascaded for larger memory structures. This makes the device well-suited for applications requiring FIFOs, LUTs, shift registers, and frame buffers.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) — one at each corner of the die — provide:

• Clock deskewing and phase alignment
• Frequency synthesis (divide/multiply)
• Duty cycle correction

These DLLs are essential for high-speed synchronous designs where precise clock distribution is critical.

Input/Output Blocks (IOBs)

The 284 user-configurable I/O pins support multiple programmable I/O standards, including:

Each IOB also supports programmable slew rate control, pull-up/pull-down resistors, and input delay elements.

XC2S200-6FGG1108C vs. Other Spartan-II Devices

Understanding where the XC2S200 sits in the Spartan-II family helps you select the right device for your design:

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the maximum logic density, I/O count, and memory resources. The -6 speed grade is the highest performance option and is exclusively available in the commercial temperature range.

Why Choose the XC2S200-6FGG1108C?

Cost-Effective ASIC Alternative

The Spartan-II family was specifically designed as a programmable replacement for mask-programmed ASICs. Unlike ASICs, the XC2S200-6FGG1108C requires no upfront Non-Recurring Engineering (NRE) costs, shortens product development cycles, and allows in-field design updates — all without hardware replacement.

High-Speed Performance

With a -6 speed grade rated up to 263 MHz system clock and optimized routing resources, the XC2S200-6FGG1108C is capable of handling demanding real-time processing tasks that require low-latency, deterministic execution.

Pb-Free Compliance

The “G” in the FGG package designation confirms that this device ships in RoHS-compliant, lead-free packaging, meeting modern environmental regulations for electronics manufacturing (EU RoHS, WEEE).

Versatile I/O Standards

With support for more than eight programmable I/O standards and 284 user I/O pins, the XC2S200-6FGG1108C integrates easily with a broad range of system buses, memory interfaces, and peripheral devices.

Typical Applications for the XC2S200-6FGG1108C

The XC2S200-6FGG1108C is well-suited for a wide range of applications across multiple industries:

Telecommunications & Networking

• Line card controllers and framing logic
• Protocol bridging (PCI, UART, SPI, I2C)
• High-speed serial data routing

Industrial & Embedded Control

• Motor control and PID loop implementation
• Sensor fusion and real-time data acquisition
• Machine vision pre-processing pipelines

Consumer Electronics & Display

• Video frame buffering and pixel processing
• Multi-channel audio routing
• Interface protocol conversion (HDMI, LVDS)

Signal Processing & Computing

• Custom DSP pipelines (FIR/IIR filters)
• Custom microprocessor/co-processor designs
• Cryptographic acceleration (AES, RSA)

Programming & Design Tools

The XC2S200-6FGG1108C is supported by Xilinx’s legacy ISE Design Suite, which provides:

• HDL synthesis (VHDL and Verilog)
• Place & route with timing analysis
• Bitstream generation and JTAG configuration
• Simulation support via ModelSim / ISIM

Note: Because the Spartan-II family predates Vivado, designers should use ISE 14.7 (the final ISE release) for full support of XC2S200 devices.

XC2S200-6FGG1108C Ordering & Part Number Decoding

Full Part Number Breakdown

XC2S200 - 6 - FGG - 1108 - C
  |       |    |      |     |
  |       |    |      |     +-- Temperature Range: C = Commercial (0°C to +85°C)
  |       |    |      +-------- Pin Count: 1108 balls
  |       |    +--------------- Package: Fine Pitch BGA, Pb-Free (G suffix = Lead-Free)
  |       +-------------------- Speed Grade: -6 (Fastest available)
  +---------------------------- Device: Spartan-II, 200K gates

Related Part Numbers

Frequently Asked Questions (FAQ)

What is the difference between XC2S200-6FGG1108C and XC2S200-6FG256C?

Both devices share the same XC2S200 silicon die with identical logic resources. The key difference is the package: the FGG1108 is a larger Pb-free 1108-ball BGA that exposes more routing pins, while the FG256 is a 256-ball standard BGA. The FGG1108 package provides greater PCB routing flexibility for designs with high I/O requirements.

Is the XC2S200-6FGG1108C RoHS compliant?

Yes. The “G” in the FGG package type confirms that this part is shipped in lead-free, RoHS-compliant packaging, complying with the European Union’s RoHS Directive.

What programming software supports the XC2S200-6FGG1108C?

The XC2S200-6FGG1108C is fully supported by Xilinx ISE Design Suite version 14.7. Vivado does not support the Spartan-II family, so ISE is the required toolchain.

What is the maximum operating frequency of the XC2S200-6FGG1108C?

The -6 speed grade device is rated for system clock frequencies up to 263 MHz, making it the fastest variant available in the Spartan-II family.

Can the XC2S200-6FGG1108C operate at industrial temperatures?

No. The “C” suffix designates the commercial temperature range (0°C to +85°C). For industrial temperature operation (-40°C to +85°C), you would require a part with an “I” suffix, which is not available at this speed grade — the -6 speed grade is exclusively offered in the commercial temperature range.

Summary

The XC2S200-6FGG1108C is the highest-density, fastest-speed variant in the Xilinx Spartan-II FPGA family. With 200,000 system gates, 5,292 logic cells, 56Kb of block RAM, and 284 user I/O pins housed in a Pb-free 1108-ball Fine-Pitch BGA package, it delivers exceptional design flexibility for commercial applications. Its speed-grade -6 rating, advanced DLL clock management, and multi-standard I/O support make it a proven choice for telecommunications, industrial control, digital signal processing, and embedded computing designs.

For engineers and procurement teams looking for reliable Xilinx Spartan-II inventory, competitive pricing, and expert technical support, sourcing from a trusted distributor ensures you receive authentic, quality-verified components backed by full traceability.