What Is the XC2S200-6FGG1107C?

The XC2S200-6FGG1107C is a field-programmable gate array (FPGA) manufactured by Xilinx. It belongs to the Spartan-II family — one of Xilinx’s most trusted cost-optimized FPGA product lines. This specific part number decodes as follows:

The XC2S200-6FGG1107C is therefore a lead-free, commercial-grade, high-speed FPGA in a large fine-pitch BGA package. It is ideal for complex digital designs that require maximum I/O density and fast logic operation.

Key Features of the XC2S200-6FGG1107C Xilinx Spartan-II FPGA

The XC2S200-6FGG1107C packs a robust set of features into a single chip. Consequently, engineers choose this device for applications that demand real-time processing and flexible I/O management.

Core Logic Features

• 5,292 Logic Cells organized in a 28 × 42 Configurable Logic Block (CLB) array
• 200,000 System Gates (logic and RAM combined)
• 1,176 total CLBs for highly parallel processing
• Four Delay-Locked Loops (DLLs) — one at each corner of the die — for precise clock management
• 2.5 V core voltage operation using Xilinx’s proven 0.18 µm process technology

Memory Resources

The XC2S200-6FGG1107C provides two types of on-chip memory. Both types can be used simultaneously to optimize design performance.

I/O and Package Advantages

• 284 maximum user I/O pins (not including global clock inputs)
• Fine-pitch BGA package with 1,107 total pins for maximum board-level routing flexibility
• Supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL
• Pb-Free (RoHS-compliant) packaging indicated by the “G” in “FGG”

XC2S200-6FGG1107C Electrical Specifications

Understanding the electrical parameters is essential before selecting this FPGA for your design. The table below summarizes the most critical specifications.

Spartan-II Family Comparison: Where Does the XC2S200 Fit?

To better understand the XC2S200’s position, it is helpful to compare it against other members of the Spartan-II family. As shown below, the XC2S200 sits at the top of the family in terms of logic density.

Clearly, the XC2S200-6FGG1107C offers the highest logic density and the most I/O pins in the Spartan-II lineup. Furthermore, its -6 speed grade is the fastest available, making it the premium choice within this product family.

Understanding the Speed Grade: Why “-6” Matters

The -6 speed grade is the fastest option available in the Spartan-II family. It is exclusively available in the Commercial temperature range (0°C to +85°C). Therefore, if your application requires the highest operating frequency — up to 263 MHz — but does not need to operate below 0°C or above 85°C, the XC2S200-6FGG1107C is the optimal selection.

Spartan-II Speed Grade Overview

XC2S200-6FGG1107C Package Details: FGG1107

The FGG1107 package is a Fine-Pitch Ball Grid Array with 1,107 solder balls. This package type offers several advantages for high-density PCB designs.

Why Choose the FGG1107 Package?

• High pin density allows more I/O in a compact board footprint
• BGA construction reduces package inductance for better signal integrity at high frequencies
• Pb-Free (RoHS) construction meets global environmental compliance requirements
• The large ball count supports full exploitation of the 284 user I/O pins plus power and ground distribution

PCB Design Note: When designing with the FGG1107 package, it is important to plan for controlled-impedance routing and careful power decoupling. For more design resources and to source the XC2S200-6FGG1107C and other devices, visit Xilinx FPGA at PCBSync.

On-Chip Clock Management: Four Delay-Locked Loops (DLLs)

One of the most important features of the XC2S200-6FGG1107C is its four integrated Delay-Locked Loops (DLLs). Each DLL is placed at a corner of the die for optimum clock distribution.

What DLLs Enable

These capabilities make the XC2S200-6FGG1107C well-suited for synchronous digital systems, high-speed data interfaces, and DSP pipelines where clock integrity is critical.

Typical Applications for the XC2S200-6FGG1107C

Because of its high gate count, fast speed grade, and abundant I/O, the XC2S200-6FGG1107C is a strong fit for demanding digital applications. In addition, its reprogrammability makes it ideal for designs that may need field updates.

Common Use Cases

#### Industrial & Embedded Control

• Motor drive controllers
• Industrial Ethernet interfaces
• Sensor fusion and data aggregation

#### Communications & Networking

• Packet processing and filtering
• Serial protocol bridges (UART, SPI, I2C, custom)
• High-speed bus arbitration

#### Consumer Electronics & Imaging

• Video signal processing pipelines
• Display timing controllers
• Image acquisition interfaces

#### Prototyping & ASIC Emulation

• Pre-production ASIC logic validation
• Algorithm acceleration for proof-of-concept designs
• Custom co-processors for embedded systems

XC2S200-6FGG1107C vs. Common Alternatives

When evaluating the XC2S200-6FGG1107C, engineers often compare it against similar Spartan-II variants or adjacent families. The table below highlights the most relevant alternatives.

If your design requires the same logic resources but fewer I/O pins, the 456-pin or 208-pin packages offer a smaller and lower-cost PCB footprint. Alternatively, if industrial temperature range (-40°C to +85°C) is a requirement, the “-I” suffix variants are more appropriate — though they will not support the -6 speed grade.

Design Tools & Programming Support

The XC2S200-6FGG1107C is supported by Xilinx’s ISE Design Suite (the recommended toolchain for Spartan-II). The design flow typically follows these steps:

1. RTL Design — Write HDL (VHDL or Verilog) describing your logic
2. Synthesis — Convert RTL to a gate-level netlist using XST (Xilinx Synthesis Technology)
3. Implementation — Map, place, and route the netlist for the XC2S200 device
4. Simulation — Verify timing and functional behavior with ModelSim or ISim
5. Bitstream Generation — Produce the configuration file (.bit)
6. Device Programming — Load the bitstream via JTAG using iMPACT or a compatible programmer

Note: Xilinx’s newer Vivado Design Suite does not support the Spartan-II family. For XC2S200-6FGG1107C designs, ISE 14.7 is the last supported version and is freely available from AMD/Xilinx.

Ordering & Procurement Information

How to Read the XC2S200-6FGG1107C Part Number

XC2S200  -  6  -  FGG  -  1107  -  C
  |          |     |        |       |
Device    Speed  Package  Pins  Temp Range
(Spartan-II 200K) (Fastest) (BGA, Pb-Free) (1107) (Commercial)

What to Verify Before Ordering

Frequently Asked Questions (FAQ)

What does the “G” in FGG1107 mean?

The extra “G” in the package code indicates that this is a Pb-Free (lead-free) package, complying with RoHS environmental directives. The standard (non-Pb-free) version would simply be “FG1107.”

Is the XC2S200-6FGG1107C still in production?

The Spartan-II family has been marked as Not Recommended for New Designs (NRND) by Xilinx/AMD. However, the part remains available through authorized distributors and component brokers for sustaining legacy designs.

Can I replace the XC2S200-6FGG1107C with a newer Xilinx FPGA?

Yes. Xilinx’s Spartan-6 or Artix-7 families offer significantly greater performance and resources. However, migration requires re-targeting the design in Vivado or ISE 14.7, and the pinout will not be directly compatible.

What configuration memory does the XC2S200-6FGG1107C use?

Spartan-II devices are SRAM-based and lose their configuration on power-down. They must be configured at every power-up, typically using a Xilinx Platform Flash PROM (such as the XCF series) or via JTAG.

What is the maximum system clock frequency?

With the -6 speed grade, the XC2S200 supports up to 263 MHz internal operation. Actual achievable frequency depends on the specific logic implementation and timing constraints of the design.

Summary: Is the XC2S200-6FGG1107C Right for Your Project?

The XC2S200-6FGG1107C is the largest and fastest device in the Spartan-II FPGA family. With 200,000 system gates, 5,292 logic cells, 284 user I/O, and the -6 speed grade delivering up to 263 MHz performance, it delivers solid capability for legacy and sustaining designs. Furthermore, its RoHS-compliant Pb-free BGA package with 1,107 pins supports I/O-intensive board designs.

However, for new designs, engineers should evaluate modern Xilinx FPGA families for better performance, lower power consumption, and long-term support.