What Is the XC2S200-6FGG1105C?

The XC2S200-6FGG1105C is a high-performance Field Programmable Gate Array (FPGA) manufactured by Xilinx (now AMD Xilinx), belonging to the Spartan-II family. This device combines 200,000 system gates with 5,292 logic cells in a 1105-ball Fine Pitch BGA (Pb-free) package, making it one of the most capable devices in the Spartan-II lineup. It operates at a commercial temperature range with a -6 speed grade — the fastest available in the Spartan-II series.

The XC2S200-6FGG1105C is widely used in high-volume embedded applications, digital signal processing, telecommunications, and industrial control systems. If you are sourcing or designing with this part, understanding its full specification profile is essential for successful integration. For a broader overview of the Spartan series and related devices, visit our complete guide to Xilinx FPGA products.

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XC2S200-6FGG1105C Key Specifications at a Glance

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Understanding the Part Number: XC2S200-6FGG1105C Decoded

Breaking down the XC2S200-6FGG1105C part number helps buyers verify they are ordering the correct component.

Note: The double “G” in FGG confirms this is the Pb-free (RoHS-compliant) variant of the FG1105 package, distinguishing it from older non-Pb-free versions.

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XC2S200-6FGG1105C Architecture & Internal Features

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1105C features a 28 × 42 CLB array providing 1,176 total CLBs. Each CLB contains four logic cells, each built around a 4-input Look-Up Table (LUT). This architecture delivers maximum design flexibility for complex combinational and sequential logic.

Memory Resources

Block RAM columns are placed on both sides of the CLB array, enabling efficient data buffering and FIFO implementation without consuming LUT resources.

Input/Output Blocks (IOBs)

The device provides up to 284 user-configurable I/O pins, supporting multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL. Each IOB includes programmable input and output delays, making the XC2S200-6FGG1105C highly compatible with diverse bus interfaces.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) are positioned at each corner of the die. They provide:

• Zero-delay clock buffering
• Clock frequency synthesis (multiply/divide)
• Phase shifting and duty cycle correction

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XC2S200-6FGG1105C Speed Grade -6: What It Means

The -6 speed grade is exclusively available in the commercial temperature range and represents the fastest timing performance within the Spartan-II family. Below is a comparison of key speed grades for the XC2S200:

Choosing the -6 grade is ideal for timing-critical designs requiring maximum clock frequency and minimum propagation delay.

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Spartan-II Family Comparison: Where XC2S200 Stands

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest gate count, I/O count, and memory resources across the entire lineup.

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XC2S200-6FGG1105C Package: FGG1105 Fine Pitch BGA

Package Overview

The 1105-ball FGG package provides a compact PCB footprint relative to its I/O density, making it suitable for high-density board designs. The Pb-free construction ensures compliance with modern environmental regulations including RoHS and WEEE directives.

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Typical Applications for the XC2S200-6FGG1105C

The XC2S200-6FGG1105C is suited for a wide range of applications:

• Telecommunications & Networking – protocol bridging, line card control, and data path management
• Industrial Automation – motor control, sensor fusion, and real-time control systems
• Digital Signal Processing (DSP) – FIR/IIR filters, FFT acceleration, image processing
• Embedded Computing – soft processor cores (e.g., MicroBlaze-compatible), memory controllers
• Test & Measurement Equipment – logic analyzers, signal generators, data acquisition
• Consumer Electronics – display controllers, set-top box logic, audio processing

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XC2S200-6FGG1105C vs. Alternative Parts

When selecting between variants, consider pin compatibility, PCB layout, and whether your design requires lead-free packaging for compliance.

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Design Tools & Programming Support

The XC2S200-6FGG1105C is supported by the following Xilinx design tools:

• Xilinx ISE Design Suite – the primary legacy tool for Spartan-II development
• JTAG Boundary Scan – for in-system programming and debugging
• Xilinx CORE Generator – for IP core instantiation
• Third-party tools – Synopsys Synplify, Mentor ModelSim

Configuration is achieved through industry-standard JTAG or via Xilinx Platform Flash PROMs.

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Frequently Asked Questions (FAQ)

What does the “C” suffix mean in XC2S200-6FGG1105C?

The “C” at the end of the part number indicates the Commercial temperature range, which is 0°C to +85°C. Industrial-grade parts would use the suffix “I” (-40°C to +85°C).

Is the XC2S200-6FGG1105C RoHS compliant?

Yes. The “GG” (double-G) in the package designation FGG1105 confirms this is the Pb-free, RoHS-compliant version of the FG1105 package.

What is the maximum operating frequency of the XC2S200-6FGG1105C?

The Spartan-II XC2S200 at the -6 speed grade supports internal frequencies up to 263 MHz, making it the highest-performing speed option in the Spartan-II family.

Can the XC2S200-6FGG1105C be used in new designs?

The XC2S200 Spartan-II family is a legacy product. Xilinx has classified it as “Not Recommended for New Designs” (NRND). However, it is widely available through authorized distributors for replacement, repair, and legacy system maintenance.

What is the core voltage for the XC2S200-6FGG1105C?

The device operates at a 2.5V core voltage, with I/O banks supporting multiple voltage levels depending on the I/O standard selected.

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Summary: Why Choose the XC2S200-6FGG1105C?

The XC2S200-6FGG1105C remains a proven, reliable FPGA solution for legacy system support and cost-sensitive designs that benefit from high I/O counts and substantial logic resources. Its combination of the fastest -6 speed grade, Pb-free 1105-ball BGA packaging, and 200,000 system gates places it at the top of the Spartan-II lineup.

Whether you are maintaining an existing system, performing a board-level repair, or building a compatible replacement design, the XC2S200-6FGG1105C delivers the density and performance needed to get the job done.