The XC2S200-6FGG1099C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, price-sensitive applications, this device delivers 200,000 system gates in a compact 2.5V architecture. Whether you’re an embedded engineer, hardware designer, or procurement specialist, this guide covers everything you need to know about the XC2S200-6FGG1099C — from core specifications to applications and ordering details.
What Is the XC2S200-6FGG1099C?
The XC2S200-6FGG1099C is part of Xilinx’s Spartan-II FPGA family, a series of programmable logic devices built on 0.18-micron, 8-layer metal CMOS process technology. It is a direct, reprogrammable alternative to mask-programmed ASICs, offering flexibility without the high non-recurring engineering (NRE) costs.
Part Number Breakdown
Understanding the part number helps you identify exactly what you’re buying:
| Code Segment |
Meaning |
| XC2S200 |
Xilinx Spartan-II, 200K system gate device |
| -6 |
Speed Grade 6 (fastest available for this family) |
| FGG |
Fine-Pitch Ball Grid Array (BGA), Pb-free package |
| 1099 |
1099-ball package (high pin-count variant) |
| C |
Commercial temperature range (0°C to +85°C) |
Note: The “G” in “FGG” indicates a Pb-free (RoHS-compliant) packaging option, making it suitable for environmentally conscious manufacturing pipelines.
XC2S200-6FGG1099C Key Specifications
The table below summarizes the most critical technical parameters for the XC2S200-6FGG1099C:
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Family |
Spartan-II |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (7 × 8KB blocks) |
| Speed Grade |
-6 (fastest) |
| Supply Voltage |
2.5V core |
| I/O Voltage |
3.3V tolerant |
| Package Type |
FGG (Fine-Pitch BGA, Pb-Free) |
| Pin Count |
1099 |
| Temperature Range |
Commercial (0°C to +85°C) |
| Process Technology |
0.18µm, 8-layer metal CMOS |
| DLLs (Delay-Locked Loops) |
4 |
| Configuration Interface |
Master/Slave Serial, SelectMAP, JTAG |
Spartan-II Family Comparison: Where Does the XC2S200 Stand?
The XC2S200 is the largest device in the Spartan-II family, offering the most logic resources. Here’s how it compares to its siblings:
| Device |
Logic Cells |
System Gates |
CLB Array |
Total CLBs |
Max I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
96 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
216 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
384 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
600 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
864 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
1,176 |
284 |
75,264 bits |
56K |
XC2S200-6FGG1099C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200’s 1,176 CLBs are the primary logic building blocks of the device. Each CLB contains four logic cells organized into two slices, with each slice including two 4-input Look-Up Tables (LUTs), flip-flops, carry logic, and dedicated multiplexers. This architecture supports efficient implementation of both combinational and sequential logic.
Input/Output Blocks (IOBs)
The device provides up to 284 user I/O pins arranged in a perimeter I/O structure. Each IOB supports programmable input/output standards including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL, giving designers broad compatibility with modern digital interfaces.
Block RAM
The XC2S200 includes 56K bits of dedicated Block RAM, organized as seven 8K-bit dual-port memory blocks. These can be configured as single-port or dual-port RAM and are useful for FIFOs, buffers, and look-up tables in complex designs.
Delay-Locked Loops (DLLs)
Four on-chip DLLs (one at each corner of the die) provide zero-propagation-delay clock distribution, clock phase shifting, and frequency synthesis — critical features for high-speed synchronous designs.
Configuration
The XC2S200-6FGG1099C supports multiple configuration modes:
| Mode |
Description |
| Master Serial |
Self-loading from an external PROM |
| Slave Serial |
Loaded by an external microprocessor |
| SelectMAP |
Fast 8-bit parallel configuration |
| JTAG (IEEE 1149.1) |
Boundary scan and in-system programming |
Speed Grade -6: Performance Characteristics
The -6 speed grade is the fastest available in the Spartan-II family and is exclusively available in the Commercial temperature range (0°C to +85°C). This makes it the ideal choice for performance-critical applications where maximum clock frequency is a design requirement.
Key performance metrics for the -6 speed grade include:
| Timing Parameter |
Value |
| Maximum System Clock |
Up to ~200 MHz (design-dependent) |
| CLB-to-CLB Propagation Delay |
Minimized vs. -5 grade |
| I/O Setup Time |
Faster than lower speed grades |
| Temperature Range |
0°C to +85°C (Commercial only) |
Applications of the XC2S200-6FGG1099C
Thanks to its rich feature set and high I/O count, the XC2S200-6FGG1099C is deployed across a wide variety of industries and use cases:
Industrial & Embedded Control
- Motor control systems
- Industrial automation logic
- Sensor fusion and data acquisition
Communications & Networking
- Protocol bridging (SPI, I2C, UART, parallel)
- Line card interface logic
- Packet processing engines
Consumer Electronics
- Digital signal processing (DSP) applications
- Video/image processing pipelines
- Audio processing modules
Test & Measurement Equipment
- Logic analyzers and oscilloscopes
- Pattern generators
- Automated test equipment (ATE)
Medical Devices
- Real-time data acquisition
- Medical imaging front-end logic
FGG1099 Package Information
The FGG1099 package (Fine-Pitch Ball Grid Array, 1099 balls, Pb-free) is designed for high pin-count applications where routing density and board space are critical. Key package details:
| Parameter |
Detail |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Ball Count |
1,099 |
| Pb-Free |
Yes (RoHS Compliant) |
| Lead Finish |
SnAgCu (SAC) solder balls |
| PCB Compatibility |
Standard FR4, requires 0.8mm or 1.0mm pitch BGA design rules |
XC2S200-6FGG1099C vs. Other Package Options
The XC2S200 core is available in several packages. The 1099-ball variant offers the highest pin count and is suited for designs requiring maximum I/O flexibility.
| Part Number |
Package |
Pins |
Pb-Free |
Temperature |
| XC2S200-6FG256C |
FG BGA |
256 |
No |
Commercial |
| XC2S200-6FGG256C |
FGG BGA |
256 |
Yes |
Commercial |
| XC2S200-6FG456C |
FG BGA |
456 |
No |
Commercial |
| XC2S200-6FGG456C |
FGG BGA |
456 |
Yes |
Commercial |
| XC2S200-6FGG1099C |
FGG BGA |
1099 |
Yes |
Commercial |
Why Choose the XC2S200-6FGG1099C?
✔ Superior Logic Density in the Spartan-II Family
With 5,292 logic cells and 200,000 system gates, the XC2S200 is the most capable device in the Spartan-II lineup.
✔ Maximum Speed Performance
The -6 speed grade delivers the lowest propagation delays and highest achievable clock frequencies in the Spartan-II range.
✔ High I/O Count with Flexible Standards
284 user I/Os with support for multiple I/O voltage standards enables seamless integration into complex, mixed-voltage system designs.
✔ Pb-Free, RoHS-Compliant Packaging
The FGG (Pb-free) package ensures compatibility with modern environmental compliance requirements (RoHS, WEEE).
✔ Reprogrammable Architecture
Unlike ASICs, the XC2S200-6FGG1099C can be reconfigured in-system, enabling iterative design updates and field firmware upgrades via JTAG.
Frequently Asked Questions (FAQ)
Q: What is the difference between XC2S200-6FGG1099C and XC2S200-6FGG456C? The primary difference is the package pin count. The FGG1099 has 1,099 balls vs. 456 balls in the FGG456 package, allowing for more I/O routing options on complex PCBs.
Q: Is the XC2S200-6FGG1099C still in production? The Spartan-II family has reached end-of-life with Xilinx (AMD). The XC2S200-6FGG1099C is available through authorized distributors and specialty electronic component suppliers.
Q: What software tools support the XC2S200-6FGG1099C? The device is supported by Xilinx ISE Design Suite. Note that it is not supported by the newer Vivado Design Suite, which targets 7-series and newer devices.
Q: What configuration PROM is compatible with XC2S200? Compatible PROMs include the Xilinx XC18V04, XC17V08, and similar Xilinx Platform Flash series devices.
Q: What is the core supply voltage? The XC2S200 operates at a 2.5V core supply, with I/O banks supporting 3.3V LVTTL/LVCMOS interfaces.
Where to Buy the XC2S200-6FGG1099C
Looking for a reliable source for Xilinx FPGA components including the XC2S200-6FGG1099C? Ensure you source from authorized or reputable distributors to avoid counterfeit components. Always verify date codes, country of origin, and request test reports when purchasing legacy Xilinx parts.
Summary
The XC2S200-6FGG1099C is the largest, fastest, and most I/O-capable member of the Xilinx Spartan-II FPGA family in a Pb-free 1099-ball BGA package. With 200,000 system gates, 5,292 logic cells, 284 user I/Os, 56K bits of block RAM, and a -6 speed grade optimized for commercial temperature operation, it remains a powerful solution for embedded, communications, industrial, and DSP applications. While based on a mature process node, its proven architecture, reprogrammability, and broad I/O standard support make it a dependable choice for both new designs and legacy system maintenance.
