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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1098C: Xilinx Spartan-II FPGA – Complete Product Guide & Specifications

Product Details

The XC2S200-6FGG1098C is a high-performance field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and 284 user I/O pins in a 1098-ball Fine Pitch BGA (FGG) package. Whether you’re building embedded systems, communications hardware, or digital signal processing solutions, the XC2S200-6FGG1098C offers the reliability and flexibility engineers demand.

For a full lineup of compatible devices, visit Xilinx FPGA.


What Is the XC2S200-6FGG1098C?

The XC2S200-6FGG1098C is part of Xilinx’s Spartan-II 2.5V FPGA family — a proven, production-grade FPGA platform engineered as a cost-effective alternative to mask-programmed ASICs. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200K system gates
-6 Speed Grade 6 (fastest available for commercial range)
FGG Fine Pitch Ball Grid Array (BGA) package
1098 1,098 total package pins
C Commercial temperature range (0°C to +85°C)

XC2S200-6FGG1098C Key Specifications

Core Logic Resources

Specification Value
Logic Cells 5,292
System Gates 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits
Delay-Locked Loops (DLLs) 4

Electrical & Timing Characteristics

Parameter Value
Core Supply Voltage 2.5V
I/O Supply Voltage 2.5V (LVCMOS/LVTTL compatible)
Speed Grade -6 (fastest commercial grade)
Operating Temperature 0°C to +85°C (Commercial)
Configuration Interface Master/Slave Serial, SelectMAP, JTAG

Package Information

Parameter Value
Package Type Fine Pitch Ball Grid Array (FGG)
Pin Count 1,098
Package Code FGG1098
Lead-Free Option Yes (FGG suffix with “G” ordering code)

XC2S200-6FGG1098C Architecture Overview

Configurable Logic Blocks (CLBs)

The Spartan-II architecture centers on a grid of Configurable Logic Blocks. Each CLB contains two slices, and each slice includes two 4-input look-up tables (LUTs), two flip-flops, and dedicated carry logic. The 28×42 CLB array in the XC2S200 provides 1,176 total CLBs, enabling complex combinational and sequential logic designs.

Input/Output Blocks (IOBs)

With 284 user-configurable I/O pins, the XC2S200-6FGG1098C supports a wide range of I/O standards, including LVCMOS, LVTTL, SSTL, GTL, and PCI. Each IOB features programmable pull-up/pull-down resistors, slew-rate control, and input delay elements for setup-time optimization.

Block RAM

Two columns of dedicated block RAM provide 56K bits of high-speed synchronous storage. Each block RAM can be configured as a true dual-port RAM, making it ideal for FIFOs, lookup tables, and data buffering applications.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops — one at each corner of the die — provide zero-delay clock buffering, clock domain crossing, and frequency synthesis. DLLs eliminate clock distribution skew and improve system timing margins significantly.


Spartan-II Family Comparison Table

Use this table to compare the XC2S200 against other devices in the Spartan-II family and select the right fit for your design.

Device Logic Cells System Gates CLB Array Max User I/O Distributed RAM Block RAM
XC2S15 432 15,000 8×12 86 6,144 bits 16K
XC2S30 972 30,000 12×18 92 13,824 bits 24K
XC2S50 1,728 50,000 16×24 176 24,576 bits 32K
XC2S100 2,700 100,000 20×30 176 38,400 bits 40K
XC2S150 3,888 150,000 24×36 260 55,296 bits 48K
XC2S200 5,292 200,000 28×42 284 75,264 bits 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest I/O count, the most CLBs, and the largest memory footprint — making it the preferred choice for complex, I/O-intensive applications.


XC2S200-6FGG1098C Configuration Modes

The XC2S200-6FGG1098C supports multiple configuration modes, allowing flexible integration into diverse system designs:

Configuration Mode Description
Master Serial FPGA controls configuration from an external PROM
Slave Serial External controller drives configuration data
SelectMAP (Parallel) Fast parallel byte-wide configuration interface
JTAG (Boundary Scan) IEEE 1149.1 compliant; supports in-system programming
Slave Parallel Microprocessor-driven configuration

Key Features & Benefits of the XC2S200-6FGG1098C

#### High Logic Density for Complex Designs

With 5,292 logic cells and 200,000 equivalent system gates, the XC2S200 handles demanding digital designs that smaller devices cannot accommodate — from multi-channel data processing pipelines to complex state machines.

#### Speed Grade -6: Maximum Performance

The -6 speed grade is the fastest available in the Spartan-II commercial range, delivering the best possible timing margins for clock-critical applications. This is particularly valuable in communications, industrial control, and test equipment designs.

#### 1,098-Pin FGG Package for High I/O Density

The FGG1098 package provides ample PCB connectivity for systems requiring many simultaneous signal interfaces, including wide data buses, multiple peripherals, and high-density connector arrays.

#### 4 Delay-Locked Loops for Clock Management

Four on-chip DLLs enable sophisticated clock architectures with precise phase control, frequency multiplication/division, and duty-cycle correction — all without external clock management ICs.

#### JTAG Boundary Scan Support

Full IEEE 1149.1 JTAG support makes board-level testing and in-system debugging straightforward, reducing bring-up time and long-term field maintenance costs.

#### Cost-Effective ASIC Replacement

The Spartan-II family was engineered from the ground up as an ASIC alternative, combining low per-unit cost with the flexibility of in-field reprogramming — shortening product development cycles significantly.


Typical Applications for the XC2S200-6FGG1098C

The XC2S200-6FGG1098C is well-suited for a broad range of applications, including:

  • Embedded processing — custom processor cores and hardware accelerators
  • Communications — protocol bridging, line cards, and data link control
  • Industrial control — motor drives, PLCs, and sensor fusion
  • Test & measurement — signal acquisition, pattern generation, and data logging
  • Consumer electronics — display controllers, image processing, and multimedia interfaces
  • Military & aerospace (commercial grade variants) — digital signal processing and avionics interfaces

Ordering Information & Part Number Decoder

Field Code Description
Device Family XC2S Spartan-II
Density 200 200,000 system gates
Speed Grade -6 Fastest commercial speed grade
Package Type FGG Fine Pitch Ball Grid Array
Pin Count 1098 1,098 total pins
Temperature Range C Commercial: 0°C to +85°C

Note: The “G” within “FGG” also denotes the lead-free (Pb-free) packaging option, compliant with RoHS requirements.


Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1098C used for?

The XC2S200-6FGG1098C is a programmable logic device used in embedded systems, communications hardware, industrial control, and digital signal processing applications requiring up to 200,000 system gates and 284 I/O pins.

What does the “-6” speed grade mean?

The -6 speed grade indicates the fastest timing bin available for the Spartan-II family in the commercial temperature range, offering the lowest propagation delays and the best overall timing performance.

Is the XC2S200-6FGG1098C RoHS compliant?

Yes. The “FGG” designation includes lead-free packaging, making the XC2S200-6FGG1098C RoHS compliant for use in environmentally regulated markets.

What configuration tools are compatible with this FPGA?

The XC2S200-6FGG1098C is supported by Xilinx ISE Design Suite and can be programmed via iMPACT or third-party JTAG tools that support the Spartan-II BSDL files.

What is the operating temperature of the XC2S200-6FGG1098C?

The “C” suffix specifies the commercial temperature range: 0°C to +85°C ambient operating temperature.


Summary

The XC2S200-6FGG1098C is Xilinx’s flagship Spartan-II FPGA, combining the highest logic density and I/O count in its family with the fastest available commercial speed grade. Its mature, proven architecture, wide I/O standard support, four on-chip DLLs, and 56K bits of block RAM make it an outstanding choice for engineers seeking a reliable, cost-effective, high-performance programmable logic solution.

For sourcing, pricing, and additional Xilinx FPGA product options, visit PCBSync today.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.