Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG1086C: Complete Guide to Xilinx Spartan-II FPGA

Product Details

The XC2S200-6FGG1086C is a high-performance, cost-effective field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, logic-intensive applications, this 2.5V FPGA delivers 200,000 system gates, 5,292 logic cells, and 284 user I/Os — all housed in a robust 1086-ball Fine-Pitch BGA (FGG1086) package. Whether you are building communications equipment, consumer electronics, or embedded processing systems, the XC2S200-6FGG1086C offers a powerful, programmable alternative to mask-programmed ASICs.


What Is the XC2S200-6FGG1086C?

The XC2S200-6FGG1086C belongs to Xilinx’s Spartan-II FPGA series — a family optimized for cost-sensitive, high-volume production environments. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200,000 system gates
-6 Speed Grade 6 (fastest available in Spartan-II; commercial range only)
FGG Fine-Pitch Ball Grid Array (Pb-free package, “G” denotes RoHS-compliant)
1086 1086-ball package
C Commercial temperature range (0°C to +85°C)

This device is ideal for engineers sourcing Xilinx FPGA solutions for complex, production-grade designs that demand high I/O density and fast clock-to-output timing.


XC2S200-6FGG1086C Key Specifications

Core Logic and Memory

Parameter XC2S200 Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Distributed RAM 75,264 bits
Block RAM 56K bits
Configuration Bits 1,335,840

I/O and Package

Parameter Value
Maximum User I/O 284
Package Type FGG1086 (Fine-Pitch BGA, Pb-Free)
Total Package Pins 1,086
Global Clock/User Input Pins 4 (not included in 284 I/O count)

Power and Speed

Parameter Value
Core Voltage 2.5V
Speed Grade -6 (fastest in Spartan-II family)
Operating Temperature 0°C to +85°C (Commercial)
I/O Standards Supported LVTTL, LVCMOS2, PCI, GTL, HSTL, SSTL, and more

XC2S200-6FGG1086C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 features 1,176 CLBs arranged in a 28×42 array. Each CLB contains four logic cells, with each logic cell consisting of a function generator (LUT), carry logic, and a storage element. This architecture supports both combinational and synchronous logic designs with ease.

Input/Output Blocks (IOBs)

Surrounding the CLB array are programmable Input/Output Blocks. These IOBs support a wide variety of I/O standards and offer features including:

  • Programmable drive strength
  • Slew rate control
  • Optional pull-up and pull-down resistors
  • Input delay (using the on-chip DLL)
  • 3-state outputs

Block RAM

The XC2S200 includes 56K bits of dedicated block RAM arranged in two columns along opposite sides of the die. Each block RAM can be configured as a synchronous dual-port RAM, making it ideal for FIFOs, lookup tables, and data buffering applications.

Delay-Locked Loops (DLLs)

Four DLLs — one at each corner of the die — provide on-chip clock management. The DLLs eliminate clock distribution delay, multiply or divide clock frequencies, and shift clock phase. This makes the XC2S200-6FGG1086C well-suited for high-speed synchronous designs.


Spartan-II Family Comparison Table

Understanding where the XC2S200 fits within the broader Spartan-II family helps engineers select the right device for their design requirements.

Device Logic Cells System Gates CLB Array Total CLBs Max User I/O Distributed RAM Block RAM
XC2S15 432 15,000 8×12 96 86 6,144 bits 16K
XC2S30 972 30,000 12×18 216 92 13,824 bits 24K
XC2S50 1,728 50,000 16×24 384 176 24,576 bits 32K
XC2S100 2,700 100,000 20×30 600 176 38,400 bits 40K
XC2S150 3,888 150,000 24×36 864 260 55,296 bits 48K
XC2S200 5,292 200,000 28×42 1,176 284 75,264 bits 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic density, the most user I/O, and the largest RAM capacity in the lineup.


Configuration Modes

The XC2S200-6FGG1086C supports multiple configuration modes to suit different system architectures and board designs.

Configuration Mode Pre-Config Pull-ups M[2:0] CCLK Direction Data Width DOUT
Master Serial No 000 Output 1-bit Yes
Slave Parallel Yes 010 Input 8-bit No
Boundary-Scan (JTAG) Yes 100 N/A 1-bit No
Slave Serial Yes 110 Input 1-bit Yes

During power-on and throughout configuration, all I/O drivers remain in a high-impedance state, protecting connected circuitry from unintended signals.


Supported I/O Standards

The XC2S200-6FGG1086C’s IOBs support a broad range of industry-standard I/O interfaces, making integration into mixed-voltage PCB designs straightforward.

I/O Standard Description
LVTTL Low-Voltage TTL
LVCMOS2 2.5V CMOS
PCI 3.3V / 5V PCI Bus
GTL / GTL+ Gunning Transceiver Logic
HSTL (Class I–IV) High-Speed Transceiver Logic
SSTL2 / SSTL3 Stub Series Terminated Logic
CTT Center Tap Terminated

XC2S200-6FGG1086C Applications

The XC2S200-6FGG1086C is suited for a wide range of applications across multiple industries:

  • Telecommunications: Line cards, protocol bridging, and signal processing
  • Networking: Packet classification, switching fabric, and network interface cards
  • Industrial Automation: Motor control, sensor interfacing, and real-time processing
  • Consumer Electronics: Image processing, display controllers, and audio subsystems
  • Embedded Systems: Custom processor cores, peripheral expansion, and glue logic
  • Test & Measurement: Pattern generation, data acquisition, and protocol emulation

Why Choose the XC2S200-6FGG1086C?

Fastest Speed Grade in Spartan-II

The -6 speed grade is the highest available in the Spartan-II family and is exclusively offered in the commercial temperature range. This means faster clock-to-output delays, shorter setup times, and higher maximum operating frequencies — critical for timing-sensitive designs.

High I/O Density with FGG1086 Package

With 284 usable I/Os in a 1086-ball BGA package, the XC2S200-6FGG1086C provides exceptional pin density, enabling compact PCB designs without sacrificing connectivity.

RoHS-Compliant (Pb-Free) Packaging

The “G” in FGG1086 confirms this is a lead-free, RoHS-compliant package, making it suitable for products destined for markets with strict environmental regulations such as the EU and Japan.

Proven, Mature Technology

The Spartan-II family is a well-documented, mature FPGA platform with extensive community resources, reference designs, and toolchain support through Xilinx ISE Design Suite. Engineers benefit from decades of deployment history and a thoroughly understood design environment.


Ordering Information Decoder

Field Value Description
Device XC2S200 Spartan-II, 200K gates
Speed Grade -6 Fastest; commercial temp only
Package FGG Fine-Pitch BGA, Pb-Free
Pin Count 1086 1086-ball package
Temp Range C Commercial (0°C to +85°C)

Full Part Number: XC2S200-6FGG1086C


Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1086C?

The XC2S200-6FGG1086C is a Xilinx Spartan-II family FPGA featuring 200,000 system gates, 5,292 logic cells, and 284 user I/Os. It is packaged in a 1086-ball Fine-Pitch BGA (Pb-free), operates at 2.5V core voltage, and is rated for the commercial temperature range (0°C to +85°C).

What speed grade does the XC2S200-6FGG1086C have?

It carries the -6 speed grade, which is the fastest speed grade available in the Spartan-II family and is only available for commercial temperature range devices.

Is the XC2S200-6FGG1086C RoHS compliant?

Yes. The double “G” in FGG1086 indicates a Pb-free (lead-free), RoHS-compliant package, as defined in Xilinx’s ordering code convention.

What software tools support the XC2S200-6FGG1086C?

The XC2S200-6FGG1086C is supported by the Xilinx ISE Design Suite, which provides synthesis, implementation, and bitstream generation for Spartan-II devices.

What configuration modes are supported?

The device supports Master Serial, Slave Serial, Slave Parallel (SelectMAP), and Boundary-Scan (JTAG) configuration modes.


Summary

The XC2S200-6FGG1086C represents the pinnacle of the Spartan-II FPGA family — combining the highest gate count (200,000), the largest CLB array (28×42), the most user I/Os (284), the fastest speed grade (-6), and a modern RoHS-compliant BGA package into one versatile, production-proven device. It is an excellent choice for engineers who need maximum logic density, high I/O count, and fast timing performance within the cost-effective Spartan-II architecture.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.