The XC2S200-6FGG1081C is a high-performance, 2.5V Spartan-II FPGA from Xilinx, featuring 200,000 system gates, 5,292 logic cells, and a 1081-ball Fine Pitch BGA (Pb-free) package. Designed for cost-sensitive, high-volume applications, it delivers the speed and flexibility of a programmable logic solution while eliminating the lengthy design cycles and high NRE costs associated with traditional ASICs. If you are sourcing programmable logic ICs, this device is one of the most capable options in the Spartan-II lineup.
What Is the XC2S200-6FGG1081C?
The XC2S200-6FGG1081C belongs to Xilinx’s Spartan-II FPGA family, manufactured on a proven 0.18 µm process technology. The “-6” speed grade is the fastest available within the Spartan-II series and is exclusive to the commercial temperature range (0°C to +85°C). The “FGG1081” denotes a 1081-ball Fine Pitch Ball Grid Array (FBGA) package with Pb-free (RoHS-compliant) construction, indicated by the double “G” in the package code.
This device is ideal for engineers who need a large gate count, abundant I/O, and on-chip memory in a compact BGA footprint. For a broader range of programmable solutions, explore our full selection of Xilinx FPGA components.
XC2S200-6FGG1081C Key Specifications
General Specifications
| Parameter |
Value |
| Part Number |
XC2S200-6FGG1081C |
| Manufacturer |
Xilinx (AMD) |
| FPGA Family |
Spartan-II |
| Process Technology |
0.18 µm |
| Core Supply Voltage (VCCINT) |
2.5V |
| Speed Grade |
-6 (Fastest in Family) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Package Type |
Fine Pitch BGA (Pb-Free) |
| Package Code |
FGG1081 |
| Number of Pins |
1,081 |
| RoHS Compliance |
Yes (Pb-Free) |
Logic Resources
| Resource |
XC2S200 Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM Bits |
75,264 |
| Block RAM Bits |
56K (56,000 bits) |
Performance & Timing
| Parameter |
Value |
| Maximum Operating Frequency |
Up to 263 MHz |
| Speed Grade |
-6 (Commercial only) |
| Delay-Locked Loops (DLLs) |
4 (one at each corner of die) |
| I/O Standards Supported |
LVTTL, LVCMOS, GTL, HSTL, SSTL, PCI, and more |
XC2S200-6FGG1081C Package & Ordering Information
Understanding the Part Number Breakdown
| Code Segment |
Meaning |
| XC2S200 |
Xilinx Spartan-II, 200K gates |
| -6 |
Speed Grade 6 (fastest; commercial only) |
| FGG |
Fine Pitch BGA, Pb-Free (double “G” = Pb-free) |
| 1081 |
Number of package balls/pins |
| C |
Commercial temperature range (0°C to +85°C) |
Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1081C contains 1,176 CLBs arranged in a 28 × 42 array. Each CLB consists of two slices, and each slice contains two 4-input look-up tables (LUTs) and two flip-flops, enabling efficient implementation of combinational and registered logic.
Block RAM
The device includes 56K bits of dedicated block RAM, organized as two columns on opposite sides of the die. Block RAM supports synchronous dual-port operation, making it suitable for FIFOs, buffers, and embedded memory structures.
Delay-Locked Loops (DLLs)
Four on-chip Delay-Locked Loops (one in each corner of the die) provide clock deskewing, frequency synthesis, and phase shifting. This is critical for high-speed synchronous designs that require precise clock management.
Input/Output Blocks (IOBs)
The XC2S200-6FGG1081C supports up to 284 user I/O pins (not including the four global clock/user input pins). Each IOB supports a wide range of single-ended and differential I/O standards, including PCI compliance, making the device versatile across different interface applications.
Spartan-II Family Comparison
| Device |
Logic Cells |
System Gates |
Total CLBs |
Max User I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
96 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
216 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
384 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
600 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
864 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
1,176 |
284 |
56K |
The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic density, user I/O count, and on-chip memory.
Applications of the XC2S200-6FGG1081C
The XC2S200-6FGG1081C is suitable for a wide range of embedded and programmable logic applications:
Digital Signal Processing (DSP)
High gate count and DLLs make this device well-suited for implementing FIR/IIR filters, FFTs, and other DSP pipelines.
Communications & Networking
With 284 I/O pins supporting multiple I/O standards (including HSTL and SSTL), the device integrates easily into line cards, protocol bridges, and data path logic.
Industrial Control Systems
The Spartan-II FPGA family is widely deployed in industrial automation where field-upgradeable programmable logic reduces maintenance overhead.
Consumer Electronics
Cost-effective for high-volume production, this device serves as a flexible logic hub in set-top boxes, displays, and embedded multimedia systems.
ASIC Prototyping & Replacement
The XC2S200-6FGG1081C is a proven ASIC alternative, allowing design teams to avoid high NRE costs while retaining the ability to update logic in the field — something impossible with mask-programmed ASICs.
Design Tools & Programming
Supported Development Environments
| Tool |
Notes |
| Xilinx ISE Design Suite |
Primary legacy design environment for Spartan-II |
| ModelSim / Vivado Simulator |
HDL simulation and functional verification |
| ChipScope Pro |
In-circuit debugging via JTAG |
| JTAG Boundary Scan |
IEEE 1149.1 compliant, supported natively |
The XC2S200-6FGG1081C is configured via serial or parallel SelectMAP bitstream loading, and supports master/slave serial modes for production programming. The device retains configuration as long as power is maintained; an external configuration PROM is required for persistent configuration across power cycles.
Advantages Over Traditional ASICs
| Feature |
XC2S200-6FGG1081C (FPGA) |
Mask-Programmed ASIC |
| NRE Cost |
None |
High (tooling & masks) |
| Time to Market |
Fast |
Slow (months) |
| Field Upgradability |
Yes (reprogrammable) |
No |
| Design Risk |
Low |
High |
| Volume Flexibility |
Any quantity |
Best for very high volume |
| Prototyping |
Yes |
No |
Frequently Asked Questions (FAQ)
What does the “-6” speed grade mean on the XC2S200-6FGG1081C?
The -6 speed grade is the fastest speed bin available in the Spartan-II family. It is exclusively offered in the commercial temperature range (0°C to +85°C). Higher speed grade numbers indicate faster timing characteristics and lower propagation delays.
What is the difference between FGG1081 and FG1081 package codes?
The double “G” in FGG1081 indicates a Pb-free (lead-free) package, making it compliant with RoHS environmental regulations. The single “G” variant (FG1081) uses standard tin-lead solder. Both are physically compatible in layout.
Is the XC2S200-6FGG1081C still in production?
The Spartan-II family has been marked as “Not Recommended for New Designs” (NRND) by Xilinx/AMD. However, it remains widely available through authorized distributors and electronics component suppliers for legacy maintenance, repair, and retrofit applications.
What configuration memory is compatible with the XC2S200-6FGG1081C?
Xilinx XCF (Platform Flash) and XC18V PROMs are commonly paired with Spartan-II devices for persistent configuration storage.
Can the XC2S200-6FGG1081C be reprogrammed in-system?
Yes. The device supports in-system configuration via JTAG or SelectMAP interface. Logic updates can be applied without removing the device from the PCB.
Summary
The XC2S200-6FGG1081C is the top-tier device in Xilinx’s Spartan-II FPGA lineup, combining 200K system gates, 5,292 logic cells, 284 user I/O pins, and 56K bits of block RAM in a Pb-free 1081-ball FBGA package. Running at speeds up to 263 MHz with the -6 speed grade, it is an ideal choice for digital signal processing, communications, industrial control, and ASIC replacement applications. Its reprogrammable architecture, low NRE cost, and broad I/O standard support make it a reliable and flexible solution for both prototyping and production deployments.
