Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1080C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1080C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. Designed for commercial-grade applications that demand reliable programmable logic at an accessible price point, this device combines 200,000 system gates, a 1080-ball Fine-Pitch BGA (FGG) package, and a -6 speed grade — making it an exceptional choice for engineers targeting high-volume embedded systems, communications hardware, and digital signal processing designs.

Whether you are replacing an ASIC, prototyping a new design, or sourcing a drop-in replacement for an existing board, the XC2S200-6FGG1080C delivers the logic density, I/O flexibility, and design security your project demands. Explore the full range of programmable logic solutions on Xilinx FPGA.


What Is the XC2S200-6FGG1080C?

The XC2S200-6FGG1080C belongs to Xilinx’s Spartan-II FPGA family, a 2.5V FPGA platform engineered as a cost-effective alternative to mask-programmed ASICs. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with ~200,000 system gates
-6 Speed grade (-6 is the fastest available for commercial range)
FGG Fine-Pitch Ball Grid Array package (Pb-Free variant, “G” suffix)
1080 1080 total package pins
C Commercial temperature range (0°C to +85°C)

XC2S200-6FGG1080C Key Specifications

Core Logic Resources

Parameter XC2S200 Specification
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM (bits) 75,264
Block RAM (bits) 56K
Delay-Locked Loops (DLLs) 4

Electrical & Package Specifications

Parameter Value
Supply Voltage (VCC) 2.5V
I/O Voltage Support 2.5V, 3.3V (LVTTL, LVCMOS)
Speed Grade -6 (fastest commercial grade)
Package Type FGG – Fine Pitch Ball Grid Array (Pb-Free)
Package Pins 1080
Operating Temperature 0°C to +85°C (Commercial)
Configuration Modes Master Serial, Slave Serial, Slave Parallel, JTAG

Spartan-II Family Comparison

Device Logic Cells System Gates CLB Array Max User I/O Block RAM
XC2S15 432 15,000 8 × 12 86 16K
XC2S30 972 30,000 12 × 18 92 24K
XC2S50 1,728 50,000 16 × 24 176 32K
XC2S100 2,700 100,000 20 × 30 176 40K
XC2S150 3,888 150,000 24 × 36 260 48K
XC2S200 5,292 200,000 28 × 42 284 56K

The XC2S200 sits at the top of the Spartan-II family, offering the highest logic density, the most user I/O, and the largest block RAM capacity in this product line.


XC2S200-6FGG1080C Architecture Deep Dive

Configurable Logic Blocks (CLBs)

The XC2S200 features 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB contains four logic cells capable of implementing combinatorial and registered logic. The CLB architecture supports fast carry-chain arithmetic, making it ideal for counters, accumulators, and ALU designs.

Input/Output Blocks (IOBs)

The device provides up to 284 maximum user I/O pins, each housed in dedicated Input/Output Blocks. Each IOB supports:

  • Programmable input delay for setup/hold optimization
  • Optional output slew-rate control
  • Pull-up, pull-down, and keeper resistors
  • Compatibility with multiple I/O standards (LVTTL, LVCMOS25, LVCMOS33, PCI, GTL, HSTL, SSTL)

Block RAM

The XC2S200 includes 56 Kbits of true dual-port Block RAM organized in two columns on opposite sides of the die. Block RAM can be configured as various widths and depths, serving as FIFOs, lookup tables, or local memory buffers.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops — one at each corner of the die — enable precise clock management, phase shifting, duty-cycle correction, and clock multiplication/division without external components.


Why Choose the -6 Speed Grade?

The -6 speed grade is the highest (fastest) speed grade available for the XC2S200 in the commercial temperature range. It offers the shortest propagation delays through the CLB fabric and I/O, enabling higher system clock frequencies and tighter timing margins.

Speed Grade Target Application
-5 Standard-speed, cost-sensitive designs
-6 Maximum performance, commercial range

Note: The -6 speed grade is exclusively available in the Commercial (C) temperature range (0°C to +85°C). Industrial temperature range designs must use the -5 speed grade.


FGG Package & Pb-Free Compliance

The FGG (Fine Pitch Ball Grid Array, Pb-Free) package is identified by the double “G” in the package code, confirming RoHS-compliant, lead-free construction. With 1080 pins, this package provides exceptional I/O density and routing flexibility for complex, multi-bus board designs.

Package Dimensions & Pinout Overview

Attribute Detail
Package Name FGG1080
Package Style Fine Pitch BGA
Total Pins 1,080
Pb-Free Yes (RoHS Compliant)
Ball Pitch Fine pitch (high-density PCB routing)
Configuration Pins Dedicated (not counted in user I/O)

XC2S200-6FGG1080C Typical Applications

The XC2S200-6FGG1080C is well-suited for a wide range of commercial and industrial applications:

#### Communications & Networking

  • Protocol bridging (UART, SPI, I2C, custom serial)
  • Line-rate packet processing and filtering
  • Multi-port interface controllers

#### Digital Signal Processing (DSP)

  • FIR/IIR filter implementations
  • FFT and spectral analysis engines
  • Image and video processing pipelines

#### Embedded Systems & SoC Integration

  • Glue logic replacement in multi-chip designs
  • Bus arbitration and DMA controllers
  • Processor coprocessors and peripherals

#### Industrial Control

  • Motor drive controllers
  • Sensor fusion and real-time data acquisition
  • Machine vision front-ends

#### Consumer Electronics

  • Display controllers
  • Audio processing units
  • Custom interface solutions

Ordering Information & Part Number Decoder

Field Value Description
Device XC2S200 200K gate Spartan-II FPGA
Speed Grade -6 Fastest commercial speed
Package FGG Pb-Free Fine Pitch BGA
Pin Count 1080 Total package balls
Temp Range C Commercial (0°C to +85°C)
Full Part XC2S200-6FGG1080C Complete ordering code

Design Tools & Configuration Support

The XC2S200-6FGG1080C is fully supported by Xilinx ISE Design Suite and compatible with standard JTAG-based programming and boundary scan. Configuration options include:

  • Master Serial – Self-loading from external serial PROM
  • Slave Serial – Controlled by an external microprocessor
  • Slave Parallel (SelectMAP) – High-speed parallel configuration
  • JTAG (IEEE 1149.1) – Boundary scan and in-system programming

The device supports PROM-based configuration using Xilinx XC17V and XCF PROM families.


XC2S200-6FGG1080C vs Competing Devices

Feature XC2S200-6FGG1080C Typical Competing Device
System Gates 200,000 Comparable logic class
Speed Grade -6 (fastest) Varies
Package FGG1080 (Pb-Free BGA) Various
Supply Voltage 2.5V 1.8V–3.3V
Block RAM 56 Kbits 18K–72K typical
DLLs 4 2–8
Config. Modes 4 2–4
Temp Range Commercial Commercial/Industrial

Frequently Asked Questions (FAQ)

Q: What is the maximum operating frequency of the XC2S200-6FGG1080C? A: The -6 speed grade achieves the highest operating frequencies in the Spartan-II family. Typical system clock frequencies range from 100 MHz to over 200 MHz depending on the design and routing, as validated through timing analysis in Xilinx ISE.

Q: Is the XC2S200-6FGG1080C RoHS compliant? A: Yes. The double “G” suffix in the package code (FGG) confirms that this is a Pb-free, RoHS-compliant package.

Q: What is the difference between XC2S200-6FGG1080C and XC2S200-5FGG1080C? A: The -6 speed grade offers faster propagation delays and higher maximum clock frequencies compared to the -5 grade. The -6 grade is only available in the commercial temperature range (0°C to +85°C), while -5 is available in both commercial and industrial ranges.

Q: Can the XC2S200-6FGG1080C replace ASICs? A: Yes. The Spartan-II family was specifically designed as a cost-effective, reconfigurable alternative to mask-programmed ASICs for high-volume applications, eliminating NRE costs and reducing time to market.

Q: What programming software is required? A: The XC2S200-6FGG1080C is supported by Xilinx ISE Design Suite (WebPACK and full editions). VHDL, Verilog, and schematic-based design entry are all supported.


Summary

The XC2S200-6FGG1080C is the premier device in the Xilinx Spartan-II FPGA family for commercial-grade designs requiring maximum logic density and the fastest available speed grade. With 5,292 logic cells, 200,000 system gates, 284 user I/Os, 56 Kbits of block RAM, and 4 DLLs — all housed in a 1080-ball Pb-Free Fine Pitch BGA package — this FPGA delivers outstanding performance per dollar for production-volume applications.

Its -6 speed grade, broad I/O standard support, and flexible configuration options make it an enduring choice for communications, DSP, embedded control, and industrial applications. For a comprehensive selection of programmable logic devices and expert sourcing support, visit Xilinx FPGA.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.