The XC2S200-6FGG1076C is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. It features 200,000 system gates, 5,292 logic cells, and comes in a 1076-pin Fine-Pitch Ball Grid Array (FGG BGA) Pb-free package. With a -6 speed grade and commercial temperature rating (0°C to +85°C), the XC2S200-6FGG1076C is an ideal choice for high-volume embedded systems, digital signal processing, and cost-sensitive programmable logic designs.
If you are sourcing or evaluating Xilinx FPGA solutions, the XC2S200-6FGG1076C offers a compelling balance of logic density, I/O flexibility, and industry-proven reliability.
What Is the XC2S200-6FGG1076C?
The XC2S200-6FGG1076C is part of the Xilinx Spartan-II 2.5V FPGA family. Spartan-II devices were designed as a superior, lower-cost alternative to mask-programmed ASICs. Unlike fixed ASICs, FPGAs like the XC2S200-6FGG1076C allow in-field design upgrades with no hardware replacement required — a major advantage in rapidly evolving applications.
Breaking Down the Part Number
Understanding the part number helps buyers confirm they are selecting the correct component.
| Code Segment |
Meaning |
| XC2S200 |
Xilinx Spartan-II, 200K system gates |
| -6 |
Speed grade 6 (fastest, commercial only) |
| FGG |
Fine-Pitch Ball Grid Array, Pb-free (RoHS-compliant) |
| 1076 |
1,076 total pins |
| C |
Commercial temperature range (0°C to +85°C) |
XC2S200-6FGG1076C Key Specifications
The table below summarizes the complete technical specifications for the XC2S200-6FGG1076C.
General Electrical & Logic Specifications
| Parameter |
Value |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Core Supply Voltage (VCCINT) |
2.5V |
| I/O Supply Voltage (VCCO) |
1.5V – 3.3V |
| Process Technology |
0.18 µm |
| Maximum System Clock |
263 MHz |
Memory Resources
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
| Total On-Chip RAM |
~131K bits |
Package & Physical Specifications
| Parameter |
Value |
| Package Type |
FGG BGA (Fine-Pitch Ball Grid Array) |
| Pin Count |
1,076 |
| RoHS / Pb-Free |
Yes (double “G” in FGG) |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Speed Grade |
-6 (fastest available for Spartan-II) |
XC2S200-6FGG1076C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1076C contains 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture supports combinational logic, shift registers, and distributed RAM functions.
Input/Output Blocks (IOBs)
The device provides 284 user-configurable I/O pins. Each IOB supports:
- Single-ended and differential signaling
- Programmable slew rate control
- 3-state output capability
- Optional pull-up, pull-down, or keeper circuits
- Multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, GTL, and more)
Delay-Locked Loops (DLLs)
The XC2S200-6FGG1076C features four Delay-Locked Loops (DLLs), one at each corner of the die. DLLs are used for:
- Zero clock skew distribution
- Clock frequency synthesis
- Phase shifting
- Clock edge alignment for high-speed interfaces
Block RAM
The device contains two columns of block RAM, providing 56K bits of dedicated synchronous dual-port memory. Block RAM operates independently from the CLB logic fabric and supports:
- True dual-port access
- Configurable width and depth
- Synchronous read and write
Spartan-II Family Comparison Table
The XC2S200 is the largest device in the Spartan-II family. The table below shows how it compares to smaller family members.
| Device |
Logic Cells |
System Gates |
CLB Array |
User I/O |
Dist. RAM (bits) |
Block RAM (bits) |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
6,144 |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
13,824 |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
24,576 |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
38,400 |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
55,296 |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
75,264 |
56K |
The XC2S200-6FGG1076C uses the largest XC2S200 die with the highest I/O pin count package (1076-pin FGG BGA), making it the most expandable choice in the Spartan-II line.
XC2S200-6FGG1076C vs Other XC2S200 Package Variants
Xilinx offered the XC2S200 die in multiple package options. The FGG1076 is the largest, offering maximum I/O access.
| Part Number |
Package |
Pins |
Pb-Free |
Max User I/O |
| XC2S200-6FG256C |
FBGA |
256 |
No |
176 |
| XC2S200-6FGG256C |
FBGA |
256 |
Yes |
176 |
| XC2S200-6FG456C |
FBGA |
456 |
No |
284 |
| XC2S200-6FGG456C |
FBGA |
456 |
Yes |
284 |
| XC2S200-6FGG1076C |
BGA |
1,076 |
Yes |
284 |
Note: The FGG1076 package provides the same 284 user I/O pins as the FGG456 but with a larger, more spread-out ball pitch — making PCB routing easier for high-density designs.
Supported I/O Standards
The XC2S200-6FGG1076C supports a broad range of I/O signaling standards, enabling easy integration with various system interfaces.
| I/O Standard |
Description |
| LVTTL |
Low-Voltage TTL (3.3V) |
| LVCMOS2 / LVCMOS18 |
Low-Voltage CMOS (2.5V / 1.8V) |
| PCI / PCI-X |
3.3V PCI bus compatible |
| GTL / GTL+ |
Gunning Transceiver Logic |
| SSTL2 / SSTL3 |
Stub-Series Terminated Logic |
| HSTL |
High-Speed Transceiver Logic |
| AGP |
Accelerated Graphics Port |
Configuration Modes
The XC2S200-6FGG1076C supports multiple configuration modes, providing flexibility in system design.
| Configuration Mode |
Description |
| Master Serial |
FPGA drives configuration clock from internal oscillator |
| Slave Serial |
External source drives configuration clock |
| Slave Parallel (SelectMAP) |
8-bit parallel data interface for fast configuration |
| JTAG (IEEE 1149.1) |
Boundary scan and in-system programming |
| Master Parallel |
FPGA drives parallel interface |
Typical Applications for XC2S200-6FGG1076C
The XC2S200-6FGG1076C is widely used across multiple industries and application domains.
#### Digital Signal Processing (DSP)
The CLB architecture and high distributed RAM density make the XC2S200-6FGG1076C well-suited for:
- FIR and IIR digital filters
- FFT / IFFT engines
- Arithmetic logic units (ALUs)
#### Telecommunications & Networking
With its 284 I/O pins, high-speed clock support, and flexible I/O standards, this FPGA is used in:
- Line cards and switch fabrics
- Protocol conversion bridges
- Serializer/deserializer (SERDES) interfaces
#### Embedded Control Systems
The XC2S200-6FGG1076C is a reliable choice for:
- Custom microcontroller implementations
- Motor control logic
- Industrial automation interfaces
#### Consumer Electronics
Cost-sensitive designs benefit from the Spartan-II’s low-cost, high-volume pricing, including:
- Set-top boxes
- Display controllers
- Audio/video processing units
XC2S200-6FGG1076C Design Tools & Software
Xilinx provides dedicated development tools to program and simulate the XC2S200-6FGG1076C.
| Tool |
Description |
| ISE Design Suite |
Legacy design environment for Spartan-II (recommended) |
| ModelSim / XSim |
HDL simulation tools |
| ChipScope Pro |
In-system logic analyzer |
| iMPACT |
Programming and configuration tool |
Tip: Vivado Design Suite does not support Spartan-II devices. Use Xilinx ISE 14.7 for XC2S200-6FGG1076C design, synthesis, and implementation.
Ordering & Availability
When purchasing the XC2S200-6FGG1076C, verify the following to ensure you receive an authentic component:
- Manufacturer: Xilinx (now AMD)
- Full Part Number: XC2S200-6FGG1076C
- RoHS Compliance: Yes (Pb-free, FGG package)
- Temperature Grade: Commercial (0°C – 85°C)
- Speed Grade: -6
The XC2S200-6FGG1076C is not recommended for new designs (NRND) by AMD Xilinx. For new designs, consider migrating to the Spartan-6 or Artix-7 FPGA families. However, the XC2S200-6FGG1076C remains widely used for maintenance, repair, and legacy system production.
Frequently Asked Questions (FAQ)
What is the XC2S200-6FGG1076C used for?
The XC2S200-6FGG1076C is a Spartan-II FPGA used in digital logic design, DSP, embedded systems, communications, and consumer electronics. It is particularly suited for designs requiring high I/O density in a Pb-free BGA package.
What is the difference between XC2S200-6FGG1076C and XC2S200-6FGG456C?
Both devices use the same XC2S200 die with identical logic resources. The FGG1076 package has a larger 1076-pin BGA footprint with wider ball pitch, making PCB routing easier. The FGG456 is more compact with 456 balls.
Is the XC2S200-6FGG1076C RoHS compliant?
Yes. The double “G” in FGG indicates a Pb-free (lead-free), RoHS-compliant package, meeting global environmental and safety regulations.
What voltage does the XC2S200-6FGG1076C operate at?
The core (VCCINT) operates at 2.5V. The I/O voltage (VCCO) is configurable from 1.5V to 3.3V depending on the I/O standard selected.
Can the XC2S200-6FGG1076C be reprogrammed?
Yes. Like all Spartan-II FPGAs, the XC2S200-6FGG1076C is infinitely reprogrammable via JTAG or supported configuration modes.
Summary
The XC2S200-6FGG1076C is the top-tier device in the Xilinx Spartan-II 2.5V FPGA family. It combines 200,000 system gates, 5,292 logic cells, 284 user I/O pins, and a Pb-free 1076-pin BGA package with the fastest -6 commercial speed grade. Whether you are maintaining legacy systems or sourcing components for high-volume production, the XC2S200-6FGG1076C delivers proven performance and design flexibility.
