The XC2S200-6FGG1073C is a high-density, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, performance-critical applications, this device delivers 200,000 system gates in a lead-free 1073-ball Fine-Pitch Ball Grid Array (FBGA) package — making it one of the most I/O-rich configurations in the XC2S200 lineup. Whether you’re designing communication systems, industrial controllers, or embedded signal processing solutions, the XC2S200-6FGG1073C offers the programmable logic density and pin count to support demanding designs.

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What Is the XC2S200-6FGG1073C? — Xilinx Spartan-II FPGA Overview

The XC2S200-6FGG1073C belongs to the Xilinx FPGA Spartan-II product family — a 2.5V programmable logic platform built on a 0.18µm process technology. The Spartan-II series was engineered as a low-cost alternative to mask-programmed ASICs, delivering the flexibility of full in-field reconfigurability without the high NRE (non-recurring engineering) cost or long development cycles associated with traditional ASIC development.

The part number breaks down as follows:

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XC2S200-6FGG1073C Key Specifications at a Glance

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XC2S200-6FGG1073C Detailed Technical Features

Configurable Logic Blocks (CLBs) — Programmable Logic Core

The heart of the XC2S200-6FGG1073C is its array of 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains:

• Look-Up Tables (LUTs): Four-input LUTs for implementing any combinational logic function
• Flip-Flops: Storage elements for synchronous logic and pipeline designs
• Multiplexers: Internal mux resources enabling complex routing without consuming dedicated logic
• Carry Logic: Fast carry chains that optimize arithmetic operations such as adders and counters

This architecture delivers 5,292 equivalent logic cells, supporting highly complex digital designs including state machines, data paths, and custom processors.

Block RAM — On-Chip Memory Resources

The XC2S200-6FGG1073C includes 56K bits (56,000 bits) of dedicated block RAM, organized in two columns on opposite sides of the die. Key memory characteristics include:

Block RAM supports true dual-port operation, allowing simultaneous read and write access from different clock domains — ideal for FIFOs, data buffers, and lookup tables in high-throughput designs.

Input/Output Blocks (IOBs) — High-Density I/O Interface

The XC2S200-6FGG1073C in the FGG1073 package supports up to 284 user I/O pins, providing connectivity for wide data buses and multi-interface designs. Each IOB includes:

• Programmable input delay for setup/hold time optimization
• Slew rate control for EMI reduction
• Optional pull-up and pull-down resistors
• Support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL, etc.)

Delay-Locked Loops (DLLs) — Clock Management

Four on-chip DLLs are distributed at each corner of the device to provide:

• Zero-skew clock distribution across the entire fabric
• Clock multiplication and division
• Phase shifting for interface timing alignment
• Up to four independent clock networks for complex multi-clock designs

Speed Grade -6 — Maximum Performance

The -6 speed grade is the fastest speed grade in the Spartan-II family and is exclusively available in the Commercial temperature range. This ensures the lowest propagation delays and highest system clock frequencies, making the XC2S200-6FGG1073C suitable for time-critical digital signal processing and communication applications.

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XC2S200-6FGG1073C Package Information — FGG1073 Fine-Pitch BGA

The FGG1073 package is a Pb-Free (lead-free, RoHS-compliant) Fine-Pitch Ball Grid Array with 1,073 solder balls. The “G” in “FGG” specifically designates the Pb-free variant, as opposed to the standard “FG” package. This is Xilinx’s largest package offering for the XC2S200 device, providing the highest available user I/O count of 284 pins.

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XC2S200 Spartan-II Family Comparison — Where Does the XC2S200 Fit?

The XC2S200 is the largest device in the Spartan-II family. The table below shows how it compares to other members:

The XC2S200 provides the most logic resources, the largest memory, and the highest I/O count in the Spartan-II lineup, making it ideal for designs that have outgrown smaller-capacity devices.

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XC2S200-6FGG1073C Applications — Where Is This FPGA Used?

#### Communication Systems and Networking

The XC2S200-6FGG1073C’s high I/O count and fast -6 speed grade make it well-suited for implementing communication protocols, data framing, and network interface logic. Applications include serial-to-parallel conversion, protocol bridging, and FPGA-based routers.

#### Industrial Automation and Motor Control

In industrial environments, this FPGA handles motor control algorithms, real-time process control, and machine vision preprocessing. Its in-field reprogrammability allows engineers to update control logic without hardware replacement.

#### Digital Signal Processing (DSP)

With 75,264 bits of distributed RAM and 56K bits of block RAM, the XC2S200-6FGG1073C efficiently implements FIR/IIR filters, FFT cores, and other DSP algorithms commonly used in audio, video, and radar processing.

#### Embedded Systems and Custom Processors

The device supports implementation of soft-core processors (such as PicoBlaze) and custom datapath architectures for embedded control applications.

#### Test and Measurement Equipment

Its programmable architecture and wide I/O support make it a popular choice for automated test equipment (ATE), logic analyzers, and signal capture platforms.

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XC2S200-6FGG1073C vs. Alternative Variants — Choosing the Right Part

If the FGG1073 package does not meet your board layout requirements, the XC2S200 core logic is available in alternative packages:

Note: The -6 speed grade is available in the Commercial temperature range only. For Industrial temperature range (-40°C to +85°C) applications, a -5 or lower speed grade variant must be selected.

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How to Configure the XC2S200-6FGG1073C — Programming and Design Tools

#### Supported Configuration Modes

The XC2S200-6FGG1073C supports multiple configuration modes for maximum system design flexibility:

#### Design Software

The XC2S200-6FGG1073C is supported by Xilinx ISE Design Suite (the appropriate toolchain for legacy Spartan-II devices). Key steps in the design flow include:

1. RTL Design — Write VHDL or Verilog HDL source code
2. Synthesis — Convert RTL to a gate-level netlist using XST or third-party tools
3. Implementation — Map, place, and route the design within the FPGA fabric
4. Timing Analysis — Verify that the design meets -6 speed grade timing constraints
5. Bitstream Generation — Produce the .bit configuration file
6. Programming — Download via JTAG or program a serial/parallel PROM

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XC2S200-6FGG1073C Electrical Characteristics — Power and Timing

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Frequently Asked Questions — XC2S200-6FGG1073C

#### Is the XC2S200-6FGG1073C RoHS-compliant?

Yes. The “G” in the package designation “FGG” indicates that this is the Pb-free, RoHS-compliant version of the FGG1073 package.

#### What temperature range does the XC2S200-6FGG1073C support?

The “C” suffix in the part number indicates the Commercial temperature range: 0°C to +85°C. The -6 speed grade is only offered in the Commercial range. For industrial temperature applications, a different speed grade variant is required.

#### Is the XC2S200 recommended for new designs?

The Spartan-II family is a mature, legacy product line. While inventory is still available on the market, Xilinx/AMD recommends newer families (such as Spartan-6, Spartan-7, or Artix-7) for new designs. The XC2S200-6FGG1073C remains a strong choice for board repairs, legacy system support, and supply chain continuity.

#### How many user I/O pins does the FGG1073 package provide?

The FGG1073 package offers the maximum available I/O count for the XC2S200: 284 user I/O pins, plus 4 global clock/user input pins.

#### What is the difference between FG1073 and FGG1073?

The “G” in FGG1073 denotes Pb-free (lead-free) solder balls. FG1073 uses standard tin-lead solder, while FGG1073 uses RoHS-compliant lead-free solder — an important distinction for designs targeting European or other markets with environmental compliance requirements.

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Summary — Why Choose the XC2S200-6FGG1073C?

The XC2S200-6FGG1073C delivers the largest logic capacity in the Spartan-II family, combined with the fastest available speed grade (-6) and the highest I/O count (284 user pins) in a lead-free 1073-ball BGA package. It is a proven, well-documented device with extensive industry deployment across communications, industrial automation, DSP, and embedded systems applications.

For engineers sourcing Xilinx Spartan-II FPGAs or exploring the broader portfolio of programmable logic devices, the XC2S200-6FGG1073C remains a reliable and well-supported choice for legacy and volume production designs.