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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC3S400-5TQG144C: Xilinx Spartan-3 FPGA – Full Product Description & Specifications

Product Details

The XC3S400-5TQG144C is a high-performance, cost-optimized field-programmable gate array (FPGA) from the Xilinx FPGA Spartan-3 family, now under the AMD product portfolio. Designed for high-volume, cost-sensitive applications, this device delivers 400,000 system gates in a compact 144-pin TQFP package — making it an ideal solution for embedded systems, digital signal processing, communications, and consumer electronics.


What Is the XC3S400-5TQG144C?

The XC3S400-5TQG144C is a member of the Spartan-3 FPGA family from Xilinx (AMD). The “400” in the part number indicates approximately 400,000 system gates, while the “5” speed grade denotes a faster-than-standard speed rating. The TQG144 refers to the 144-pin Thin Quad Flat Package (TQFP), and the “C” suffix indicates the commercial temperature range (0°C to +85°C).

This device is widely used in applications requiring a balance of logic density, I/O flexibility, and price efficiency.


XC3S400-5TQG144C Key Specifications

Parameter Value
Manufacturer AMD (Xilinx)
Series Spartan-3
Part Number XC3S400-5TQG144C
Logic Cells 8,064
System Gates ~400,000
CLBs (Configurable Logic Blocks) 1,260
Flip-Flops 16,128
Distributed RAM 56 Kb
Block RAM 288 Kb
Dedicated Multipliers 20 (18×18-bit)
DCMs (Digital Clock Managers) 4
Maximum User I/Os 97
Package TQFP-144 (TQG144)
Speed Grade -5 (fastest in family)
Core Voltage (VCCINT) 1.2 V
I/O Voltage (VCCIO) 1.2 V – 3.3 V
Operating Temperature 0°C to +85°C (Commercial)
Configuration Standards Master Serial, Slave Serial, SelectMAP, JTAG

XC3S400-5TQG144C Package & Pinout Overview

### TQFP-144 Package Details

Package Attribute Detail
Package Type Thin Quad Flat Package (TQFP)
Pin Count 144
Package Code TQG144
Body Size 20mm × 20mm
Lead Pitch 0.5mm
Mounting Type Surface Mount Technology (SMT)
RoHS Compliant Yes

The TQFP-144 is a standard SMT package suitable for automated PCB assembly. Its compact footprint makes it well-suited for space-constrained designs where BGA packages are not practical.


Spartan-3 Architecture: Inside the XC3S400-5TQG144C

### Configurable Logic Blocks (CLBs)

The XC3S400-5TQG144C contains 1,260 CLBs, each consisting of four slices. Every slice includes two 4-input LUTs (Look-Up Tables), two storage elements (flip-flops or latches), and dedicated carry/arithmetic logic. This gives designers a total of 16,128 flip-flops and substantial combinatorial logic resources.

### Block RAM

The device integrates 18 block RAM tiles, providing 288 Kb of true dual-port synchronous block memory. Each 18-Kb tile can be configured as 16K×1, 8K×2, 4K×4, 2K×9, 1K×18, or 512×36 — offering significant flexibility for FIFOs, data buffers, and lookup tables.

### Dedicated Multiplier Blocks

20 dedicated 18×18-bit multipliers are embedded in the silicon, enabling high-throughput DSP functions such as digital filters, FFT engines, and correlation without consuming CLB resources.

### Digital Clock Managers (DCMs)

The 4 integrated DCMs support clock multiplication, division, phase shifting, and de-skewing — essential for synchronizing clocks across complex multi-domain digital designs.


I/O Bank Configuration & Supported Standards

The XC3S400-5TQG144C supports a wide range of I/O signaling standards across its I/O banks, providing maximum design flexibility.

I/O Standard Description
LVCMOS 3.3V / 2.5V / 1.8V / 1.5V / 1.2V Single-ended low-voltage CMOS
LVTTL 3.3V low-voltage TTL
SSTL2 / SSTL3 Stub series terminated logic for DDR memory
HSTL High-speed transceiver logic
PCI / PCI-X PCI bus compatible
LVDS Low-voltage differential signaling
RSDS Reduced swing differential signaling
GTL / GTL+ Gunning transceiver logic

XC3S400-5TQG144C Speed Grade -5: Performance Advantages

The -5 speed grade is the fastest offering in the Spartan-3 family for this device. Compared to the -4 grade, the -5 variant provides reduced propagation delays and higher maximum clock frequencies — critical for timing-sensitive applications.

Performance Metric XC3S400-5TQG144C
Maximum System Clock (Fmax) Up to ~200 MHz (design-dependent)
CLB-to-CLB Propagation Delay Reduced vs. -4 grade
Setup/Hold Time Improved vs. slower speed grades
DCM Output Jitter Low

Configuration Modes

The XC3S400-5TQG144C supports multiple configuration methods to match different system architectures:

Configuration Mode Description
Master Serial FPGA drives configuration from external serial Flash
Slave Serial External controller drives configuration data
SelectMAP (Slave Parallel) 8-bit parallel mode for fast configuration
JTAG Boundary-scan and in-circuit configuration/debug
Master SPI Boot from SPI Flash (with Platform Flash)

Xilinx recommends using Platform Flash XL or third-party SPI Flash devices for production configuration.


Typical Applications of the XC3S400-5TQG144C

The XC3S400-5TQG144C is a versatile device suited for a broad range of embedded and digital design applications:

  • Embedded Processing – Implement soft-core processors (e.g., MicroBlaze, PicoBlaze) for embedded control
  • Digital Signal Processing (DSP) – Leverage dedicated multipliers for FIR/IIR filters, FFT, and audio processing
  • Communications Interfaces – Build UART, SPI, I2C, Ethernet MAC, and CAN controllers
  • Motor Control – PWM generation, encoder decoding, and PID control loops
  • Image & Video Processing – Line buffering, pixel processing, and frame synchronization
  • Industrial Automation – Custom I/O expansion and protocol bridging
  • Consumer Electronics – Display controllers, USB interfaces, and multimedia logic
  • Prototyping & Development – Rapid hardware prototyping and algorithm acceleration

XC3S400-5TQG144C vs. Related Spartan-3 Variants

Part Number Gates Package Speed Grade Temp Range
XC3S400-4TQG144C ~400K TQFP-144 -4 Commercial
XC3S400-5TQG144C ~400K TQFP-144 -5 Commercial
XC3S400-5FTG256C ~400K FTBGA-256 -5 Commercial
XC3S700A-5TQG144C ~700K TQFP-144 -5 Commercial
XC3S1000-5FTG256C ~1M FTBGA-256 -5 Commercial

Design Tools & Software Support

The XC3S400-5TQG144C is supported by Xilinx ISE Design Suite (the legacy tool for Spartan-3 series). Key tools include:

Tool Function
ISE Project Navigator RTL design entry, synthesis, and implementation
XST (Xilinx Synthesis Technology) HDL synthesis engine
iMPACT JTAG programming and configuration management
ChipScope Pro In-system logic analyzer and signal debugging
CORE Generator IP core instantiation (memory controllers, DSP blocks, etc.)
PlanAhead Floorplanning and timing closure

Note: Xilinx ISE is a mature, stable toolchain available as a free download for Spartan-3 family devices.


Ordering Information

Attribute Detail
Full Part Number XC3S400-5TQG144C
DigiKey Part Number 122-1435-ND
Manufacturer AMD (Xilinx)
Series Spartan-3
Datasheet Available at xilinx.com
RoHS Status RoHS Compliant
Export Control ECCN 3A991
HTSUS 8542.39.00.01

Frequently Asked Questions (FAQ)

Q: What is the difference between XC3S400-4TQG144C and XC3S400-5TQG144C?
The only difference is the speed grade. The -5 variant offers faster propagation delays and higher achievable clock frequencies compared to the -4 grade, making it preferable for timing-critical designs.

Q: Is the XC3S400-5TQG144C still in production?
The Spartan-3 family has reached end-of-life announcement from Xilinx/AMD, but inventory remains available through authorized distributors. Engineers are encouraged to evaluate migration paths to Spartan-6 or Artix-7 families for new designs.

Q: What programming tool is used for the XC3S400-5TQG144C?
Xilinx ISE Design Suite (version 14.7 is the final release) is the primary tool. JTAG-based programming is performed using the iMPACT utility.

Q: Can the XC3S400-5TQG144C run a soft-core processor?
Yes. The PicoBlaze (8-bit) and MicroBlaze (32-bit) soft-core processors from Xilinx are both supported on Spartan-3 devices, subject to available logic resources.


Summary

The XC3S400-5TQG144C is a proven, cost-effective FPGA from the Xilinx Spartan-3 family, offering 400,000 system gates, 97 user I/Os, 20 dedicated multipliers, 288 Kb block RAM, and 4 DCMs in a 144-pin TQFP package. Its -5 speed grade makes it one of the fastest options in this series, suitable for demanding timing requirements. Whether used for embedded processing, DSP, communications, or prototyping, this device remains a reliable choice for commercial-temperature applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.