The XC2S200-6FGG1072C is a high-performance, cost-optimized Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. It delivers 200,000 system gates in a robust 1072-ball Fine-Pitch Ball Grid Array (FBGA) Pb-free package, making it one of the largest and most capable devices in the Spartan-II lineup. Whether you are designing high-volume embedded systems, digital signal processing pipelines, or communication interfaces, the XC2S200-6FGG1072C offers the performance, flexibility, and reliability your application demands.

Engineered on a proven 0.18 µm process node and powered by a 2.5V core supply, this device brings together speed, logic density, and versatile I/O — all at a competitive cost point. For engineers looking to explore the full range of Xilinx FPGA solutions, the XC2S200-6FGG1072C is an excellent entry point into the Spartan-II platform.

What Is the XC2S200-6FGG1072C? Understanding the Part Number

Before diving into the full specification tables, it is important to understand what each segment of the part number means. The XC2S200-6FGG1072C follows Xilinx’s standard ordering convention for the Spartan-II family.

The “G” in “FGG” is the key indicator that this is a Pb-free, RoHS-compliant package — an important distinction for modern production environments subject to environmental regulations.

XC2S200-6FGG1072C Key Specifications at a Glance

Core Logic Resources

Electrical and Physical Characteristics

Clocking and Delay-Locked Loops (DLL)

Why Choose the XC2S200-6FGG1072C?

Speed Grade -6: Maximum Performance for Demanding Designs

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the Commercial temperature range. This makes the XC2S200-6FGG1072C the ideal choice for applications where clock-to-output propagation delay, setup and hold times, and maximum operating frequency are critical design constraints. The -6 grade delivers the tightest timing margins in the family, enabling designers to push logic performance to its limit without migrating to a higher-cost device family.

1,072-Ball FBGA Package: High I/O Density in a Compact Footprint

The FGG1072 package offers up to 284 user I/O pins in a fine-pitch BGA form factor. This high pin density makes the XC2S200-6FGG1072C perfectly suited for applications that require wide data buses, multiple peripheral interfaces, or complex board interconnects. The ball grid array format also provides excellent signal integrity at high frequencies compared to traditional leaded packages.

Pb-Free Construction: RoHS Compliance for Modern Manufacturing

The double “G” in “FGG” confirms that this device uses Pb-free solder balls, meeting the requirements of the European Union’s RoHS directive and modern global environmental standards. This is essential for products sold in the EU, Japan, California, and other regions with strict hazardous substance restrictions.

Four Delay-Locked Loops for Robust Clock Management

The XC2S200-6FGG1072C integrates four on-chip DLLs, one positioned at each corner of the die. These DLLs provide zero-skew clock distribution, clock multiplication, clock division, and configurable phase shifting — all without consuming CLB resources. This makes it straightforward to implement multi-clock domain designs and high-speed synchronous interfaces.

XC2S200-6FGG1072C Internal Architecture

Configurable Logic Blocks (CLBs)

The Spartan-II architecture organizes its logic into Configurable Logic Blocks (CLBs), arranged in a 28-column by 42-row matrix for the XC2S200. Each CLB contains two slices, and each slice contains two 4-input Look-Up Tables (LUTs), two storage elements (flip-flops or latches), and fast carry logic. This structure allows efficient implementation of both combinational and sequential logic functions.

Block RAM

The XC2S200-6FGG1072C includes 56K bits of dedicated block RAM organized in two columns on opposite sides of the die. Each block RAM is a true dual-port memory supporting independent read and write operations on both ports simultaneously. Block RAM is ideal for implementing FIFOs, lookup tables, small memories, and data buffers within your design.

Distributed RAM

In addition to block RAM, the device supports 75,264 bits of distributed RAM implemented within the CLB LUTs. This provides extremely fast, single-cycle access to small memory structures without consuming dedicated RAM blocks — a key advantage for state machines, coefficient storage, and small data tables.

Input/Output Blocks (IOBs)

Each IOB in the XC2S200-6FGG1072C is highly configurable. I/O banks support programmable voltage levels from 1.5V to 3.3V, allowing mixed-voltage board designs. Supported I/O standards include LVTTL, LVCMOS (1.5V / 2.5V / 3.3V), PCI, GTL, GTL+, SSTL, and more. Each IOB also includes optional registered inputs, registered outputs, and programmable pull-up or pull-down resistors.

Configuration Modes

The XC2S200-6FGG1072C supports multiple configuration modes to suit different system architectures and boot requirements.

All I/O pins remain in high-impedance state during and immediately after configuration until the design takes control — an important safety feature for hot-plug and live-system programming scenarios.

Spartan-II Family Comparison: Where XC2S200 Stands

As shown above, the XC2S200 is the largest and most capable device in the Spartan-II family. It provides the highest logic density, the most distributed RAM, the largest block RAM, and the greatest number of user I/O pins.

Typical Applications for the XC2S200-6FGG1072C

The XC2S200-6FGG1072C is a versatile FPGA well-suited for a broad range of commercial and industrial applications:

• Digital Signal Processing (DSP): FIR/IIR filters, FFTs, and custom signal processing pipelines benefit from the CLB density and distributed RAM.
• Communications: Protocol bridge ICs, PCI interface controllers, and custom bus arbiters are common use cases.
• Industrial Control: Motor control, machine vision pre-processing, and real-time control loops.
• Data Acquisition: High-speed ADC/DAC interfacing and parallel data capture using the wide I/O banks.
• Embedded System Peripherals: Custom co-processors, memory controllers, and peripheral IP blocks for SoC designs.
• Prototyping and ASIC Replacement: The Spartan-II was specifically designed as a cost-effective alternative to mask-programmed ASICs, enabling faster time-to-market with in-field reprogrammability.

Design Tool Support

The XC2S200-6FGG1072C is supported by Xilinx (now AMD) design tools. For legacy Spartan-II designs, Xilinx ISE Design Suite is the primary supported toolchain. The device is also compatible with popular third-party synthesis tools including Synopsys Synplify and Mentor Precision RTL.

Ordering Information and Part Marking

When ordering the XC2S200-6FGG1072C, use the full part number to ensure you receive the correct device. The ordering code is decoded as follows:

XC2S200  -6  FGG  1072  C
  |       |   |    |     |
  |       |   |    |     +-- Commercial temperature (0°C to +85°C)
  |       |   |    +-------- 1072 solder balls
  |       |   +------------- Fine-Pitch BGA, Pb-free (RoHS)
  |       +----------------- Speed grade -6 (fastest, Commercial only)
  +------------------------- Spartan-II, 200K gates

Note: The -6 speed grade is exclusively available in the Commercial (C) temperature range. For Industrial temperature range (-40°C to +85°C) requirements, consider the -5 or -4 speed grades.

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1072C used for?

The XC2S200-6FGG1072C is a Xilinx Spartan-II FPGA used for digital signal processing, communications, industrial control, ASIC prototyping, and embedded system co-processing. Its 200K gate capacity and 284 user I/O pins make it suitable for complex, high-I/O-count designs.

Is the XC2S200-6FGG1072C RoHS compliant?

Yes. The “G” in the “FGG” package designator confirms that the XC2S200-6FGG1072C uses Pb-free solder balls and is RoHS compliant.

What is the maximum operating frequency of the XC2S200-6FGG1072C?

The -6 speed grade is the fastest in the Spartan-II family. Internal logic operates at speeds exceeding 200 MHz for register-to-register paths, though achievable system frequency depends on the complexity and routing of the implemented design.

Can the XC2S200-6FGG1072C be reconfigured in the field?

Yes. Like all Spartan-II FPGAs, the XC2S200-6FGG1072C supports full in-system reconfiguration. The design can be updated at any time by loading a new bitstream — no hardware replacement is needed.

What supply voltage does the XC2S200-6FGG1072C require?

The device requires a 2.5V core supply (VCCINT). The I/O supply voltage (VCCO) is configurable per I/O bank and can range from 1.5V to 3.3V depending on the target I/O standard.

Conclusion: Is the XC2S200-6FGG1072C Right for Your Design?

The XC2S200-6FGG1072C is the premier device in the Spartan-II family for engineers who need maximum logic density, the highest speed grade, a large pin-count Pb-free BGA package, and broad I/O standard support — all within the cost-conscious Spartan-II architecture. Its proven 0.18 µm technology, four on-chip DLLs, 56K bits of block RAM, and 284 user I/Os make it a compelling choice for both new designs and as a pin-compatible ASIC replacement.

If you are evaluating Spartan-II devices or comparing them against newer Xilinx families, it is worth consulting a comprehensive Xilinx FPGA resource to understand the full product roadmap and identify the optimal device for your specific performance, power, and cost requirements.