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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC3S50-4PQG208C: Xilinx Spartan-3 FPGA – Full Specs, Pinout & Datasheet

Product Details

Meta Description: Buy XC3S50-4PQG208C – Xilinx Spartan-3 50K gate FPGA in 208-pin PQFP package. Speed grade -4, 3.3V I/O, 1.2V core. Full specs, pinout, and datasheet inside.


The XC3S50-4PQG208C is a field-programmable gate array (FPGA) from the Xilinx FPGA Spartan-3 family, manufactured by AMD (formerly Xilinx). Designed for cost-sensitive, high-volume applications, this device delivers a balance of logic density, I/O flexibility, and low power consumption — making it a popular choice for embedded systems, communications, and industrial control designs.


XC3S50-4PQG208C Overview

The XC3S50-4PQG208C belongs to the Spartan-3 series, Xilinx’s landmark low-cost FPGA platform. With 50,000 system gates, a commercial temperature rating, and a 208-pin Plastic Quad Flat Pack (PQFP) package, this device suits a wide range of logic implementation tasks. The “-4” speed grade and “C” commercial temperature suffix make it ideal for fast prototype development and production designs operating in standard environments.


XC3S50-4PQG208C Key Specifications

Parameter Value
Manufacturer AMD (Xilinx)
Part Number XC3S50-4PQG208C
Series Spartan-3
System Gates 50,000
Logic Cells 1,728
CLB Slices 768
Flip-Flops 1,536
Distributed RAM 24 Kb
Block RAM 72 Kb
Multipliers (18×18) 4
Digital Clock Managers (DCM) 2
Maximum User I/O 124
Package PQFP-208 (PQG208)
Speed Grade -4
Core Voltage (VCCINT) 1.2V
I/O Voltage (VCCIO) 3.3V (multi-standard)
Temperature Range 0°C to +85°C (Commercial)
Operating Frequency Up to ~200 MHz (depending on design)
RoHS Status RoHS Compliant

XC3S50-4PQG208C Package Information

Package Attribute Detail
Package Type Plastic Quad Flat Pack (PQFP)
Package Code PQG208
Pin Count 208
Mounting Type Surface Mount Technology (SMT)
Package Dimensions 28mm × 28mm (body)
Lead Pitch 0.5mm
Lead Finish Tin (Sn) – RoHS compliant

The 208-pin PQFP is a widely supported SMT package, compatible with standard PCB assembly processes and reflow soldering. Its fine 0.5mm pitch provides a high density of I/O in a compact footprint — an advantage over larger BGA packages when board space and inspection accessibility matter.


XC3S50-4PQG208C Logic Architecture

Configurable Logic Blocks (CLBs)

The Spartan-3 CLB architecture uses a matrix of 768 slices, each containing two 4-input Look-Up Tables (LUTs) and two flip-flops. This gives designers fine-grained control over logic implementation and resource utilization.

Block RAM

The XC3S50 integrates 72 Kb of on-chip Block RAM, organized as two 18 Kb true dual-port RAM blocks. These are suitable for FIFOs, lookup tables, data buffers, and small embedded memories.

Multiplier Blocks

Four dedicated 18×18-bit hardware multipliers accelerate DSP operations such as filtering, correlation, and arithmetic-intensive algorithms without consuming CLB resources.

Digital Clock Managers (DCMs)

Two integrated DCMs support clock synthesis, deskewing, phase shifting, and frequency division. Each DCM can eliminate clock distribution delays and generate multiple derived clock frequencies from a single source.


XC3S50-4PQG208C I/O Capabilities

I/O Feature Detail
Max User I/O Pins 124
I/O Standards Supported LVCMOS, LVTTL, SSTL, HSTL, PCI, GTL+
Differential Pair Support Yes (LVDS, RSDS, mini-LVDS)
On-chip Termination Pull-up, pull-down, keeper
Drive Strength 2mA to 24mA (programmable)
Slew Rate Control Yes (Fast / Slow)

The multi-standard I/O architecture allows each I/O bank to be independently powered, enabling seamless interfacing to 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V logic devices.


XC3S50-4PQG208C Configuration Options

The XC3S50 supports several configuration modes:

Configuration Mode Description
Master Serial External serial PROM (e.g., XCF series)
Slave Serial Controlled by an external host
Master Parallel (SelectMAP) Fast 8-bit parallel configuration
Slave Parallel (SelectMAP) External processor-driven configuration
JTAG IEEE 1149.1 boundary scan and configuration
Slave SPI Via external SPI Flash

Configuration bitstream size for the XC3S50 is approximately 439 Kb.


XC3S50-4PQG208C Electrical Characteristics

Electrical Parameter Min Typical Max
Core Supply (VCCINT) 1.14V 1.20V 1.26V
I/O Supply (VCCIO) 3.3V
Auxiliary Supply (VCCAUX) 2.375V 2.5V 2.625V
Input Voltage (LVCMOS33) VCCIO + 0.5V
Static Current (ICCINTQ) ~5 mA
Junction Temperature 0°C +85°C

XC3S50-4PQG208C Speed Grade “-4” Explained

What Does Speed Grade -4 Mean?

In Xilinx Spartan-3 nomenclature, the speed grade (–4, –5) indicates the relative internal propagation delay performance. Speed grade –4 is the standard commercial-grade speed option, offering a balance of performance and cost:

  • –4: Standard performance, suited for designs up to ~100–200 MHz.
  • –5: Higher performance (faster), typically used in timing-critical designs.

For most embedded control, interface bridging, and protocol conversion applications, the -4 speed grade provides ample performance margin.


XC3S50-4PQG208C vs. Other Spartan-3 Devices

Part Number Gates Slices Block RAM I/O Package
XC3S50-4PQG208C 50K 768 72 Kb 124 PQFP-208
XC3S200-4PQG208C 200K 1,920 216 Kb 141 PQFP-208
XC3S400-4PQG208C 400K 3,584 288 Kb 141 PQFP-208
XC3S50-4VQG100C 50K 768 72 Kb 63 VQFP-100
XC3S50AN-4TQG144C 50K 768 72 Kb 97 TQFP-144

The XC3S50-4PQG208C offers the highest I/O count (124 pins) for the 50K gate density within the Spartan-3 family, making it the preferred choice when pin count matters more than logic density.


XC3S50-4PQG208C Typical Applications

The XC3S50-4PQG208C is widely used in:

  • Industrial Control: Motor drive controllers, PLC I/O expansion, and sensor interfaces
  • Communications: UART/SPI/I2C/JTAG protocol bridges and multi-protocol converters
  • Consumer Electronics: Display controllers, keyboard/HID interfaces
  • Test & Measurement: Signal capture, data logging front-ends
  • Embedded Systems: Custom peripheral logic, glue logic replacement
  • Automotive (non-AEC-Q100): Infotainment and body control logic prototyping

XC3S50-4PQG208C Design Tools & Support

Tool Description
Xilinx ISE Design Suite Primary design, synthesis, and implementation tool for Spartan-3
ISim Integrated simulation environment
ChipScope Pro In-system logic analysis (ILA, VIO cores)
iMPACT Device programming and configuration utility
CORE Generator IP core generation for DSP, memory, and interfaces
PlanAhead Floorplanning and timing analysis

Note: Spartan-3 is supported by Xilinx ISE 14.7 (the final ISE release). Vivado does not support Spartan-3 devices. Designers working with legacy Spartan-3 projects should maintain an ISE 14.7 installation.


XC3S50-4PQG208C Ordering Information

Field Detail
Full Part Number XC3S50-4PQG208C
Manufacturer AMD / Xilinx
DigiKey Part # 122-1522-ND
Package 208-PQFP
Lead-Free Yes
RoHS Compliant
Moisture Sensitivity Level (MSL) MSL 3

XC3S50-4PQG208C Part Number Decoder

Understanding the Spartan-3 part number format:

Segment Value Meaning
XC XC Xilinx Commercial FPGA
3S 3S Spartan-3 family
50 50 50,000 system gates
-4 -4 Speed grade (standard)
PQ PQ Plastic Quad Flat Pack (PQFP)
G G Green / lead-free package
208 208 208 pins
C C Commercial temperature (0°C to +85°C)

Frequently Asked Questions – XC3S50-4PQG208C

Q: Is the XC3S50-4PQG208C still in production? The XC3S50-4PQG208C is classified as a mature product by AMD/Xilinx. It remains available through authorized distributors, though designers starting new projects may wish to evaluate the Spartan-7 or Artix-7 families for long-term supply chain confidence.

Q: What programming tool do I need for the XC3S50-4PQG208C? You need Xilinx ISE 14.7 and the iMPACT utility, along with a compatible JTAG programming cable (e.g., Platform Cable USB II).

Q: Can the XC3S50-4PQG208C operate at 3.3V I/O? Yes. The I/O banks support 3.3V LVCMOS and LVTTL signaling natively. The core voltage (VCCINT) is 1.2V and must be supplied separately.

Q: What is the difference between XC3S50-4PQG208C and XC3S50-5PQG208C? The only difference is the speed grade. The -5 variant is faster (lower propagation delays), while the -4 is the standard performance option.

Q: Does the XC3S50-4PQG208C support DDR memory interfaces? Yes. Using the SSTL2/SSTL18 I/O standards and the DCM for clock alignment, it can interface with DDR SDRAM at low data rates. For higher-speed DDR2/DDR3 interfaces, a larger or newer FPGA family is recommended.


Summary

The XC3S50-4PQG208C is a proven, cost-effective FPGA solution for applications requiring moderate logic density, rich I/O, and standard-performance timing. Its 208-pin PQFP package with 124 user I/Os, integrated DCMs, Block RAM, and hardware multipliers make it a versatile choice for both prototyping and volume production in commercial-temperature environments. Backed by Xilinx’s ISE toolchain and a broad ecosystem of IP cores, this device remains a reliable platform for legacy and new designs alike.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.