Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3S50-5TQ144C: Xilinx Spartan-3 FPGA – Complete Product Guide

Product Details

The XC3S50-5TQ144C is a low-cost, high-performance field-programmable gate array (FPGA) from AMD Xilinx’s Spartan-3 family. Designed for cost-sensitive applications that demand programmable logic flexibility, this device delivers 50,000 system gates, a 144-pin TQFP package, and a commercial temperature rating — making it one of the most popular entry-level FPGAs in the industry.

Whether you are a hardware engineer prototyping a new design or sourcing components for a production run, the XC3S50-5TQ144C provides the right balance of logic capacity, I/O flexibility, and affordability. As part of the broader Xilinx FPGA product line, it benefits from decades of Xilinx design tools, IP cores, and community support.


XC3S50-5TQ144C Key Specifications at a Glance

Parameter Value
Manufacturer AMD (Xilinx)
Part Number XC3S50-5TQ144C
FPGA Family Spartan-3
System Gates 50,000
Logic Cells 1,728
CLB Slices 768
Distributed RAM (bits) 12,288
Block RAM (bits) 72,864
Multipliers (18×18) 4
DCM (Digital Clock Manager) 2
Max User I/O Pins 97
Package 144-pin TQFP (TQ144)
Package Size 20mm × 20mm
Speed Grade -5 (Commercial)
Operating Voltage (VCC_INT) 1.2V
Operating Voltage (VCC_AUX) 3.3V
Temperature Range 0°C to +85°C (Commercial)
Configuration Interface Master/Slave Serial, JTAG, SPI, BPI
Process Technology 90nm
RoHS Compliance Yes

What Does the Part Number XC3S50-5TQ144C Mean?

Understanding the part number helps engineers confirm they are ordering the correct variant:

Field Value Meaning
XC XC Xilinx Commercial IC
3S 3S Spartan-3 Family
50 50 ~50,000 System Gates
-5 -5 Speed Grade (-4 = slowest, -5 = mid, -6 = fastest)
TQ TQ TQFP Package Style
144 144 144 Pin Count
C C Commercial Temperature (0°C to 85°C)

The “C” suffix differentiates this from industrial (-I) or extended temperature variants. The -5 speed grade means it operates at moderate clock speeds — suitable for most general-purpose digital designs.


XC3S50-5TQ144C Detailed Specifications

Logic and Fabric Resources

Resource Quantity
System Gates 50,000
CLB (Configurable Logic Blocks) 192
Slices per CLB 4
Total Slices 768
4-input LUTs 1,536
Flip-Flops 1,536
Max Distributed RAM 12,288 bits

Memory Resources

Memory Type Capacity
Block RAM (total) 72,864 bits (~72 Kb)
Number of Block RAMs 4 × 18Kb
Distributed RAM 12,288 bits

Clock and Timing Resources

Resource Quantity
Digital Clock Managers (DCM) 2
Global Clock Buffers 8
Max Internal Clock Frequency ~200 MHz (design-dependent)

I/O and Interface

Parameter Value
Maximum User I/O 97
I/O Standards Supported LVTTL, LVCMOS 3.3V/2.5V/1.8V/1.5V, SSTL, HSTL, PCI, GTL
Differential I/O Pairs Supported (LVDS, RSDS, PPDS)
I/O Banks 4

Power Supply Requirements

Rail Voltage
VCC_INT (Core) 1.2V
VCC_AUX (Auxiliary) 3.3V
VCCO (I/O Bank, configurable) 1.2V – 3.3V

Package Dimensions and PCB Footprint – TQ144

The XC3S50-5TQ144C uses a 144-pin Thin Quad Flat Package (TQFP), one of the most common surface-mount packages in professional PCB design.

Parameter Value
Package Type TQFP
Total Pins 144
Body Size 20mm × 20mm
Pin Pitch 0.5mm
Mounting Style Surface Mount Technology (SMT)
Height (max) 1.6mm

The 0.5mm pin pitch requires careful PCB layout and a fine-pitch soldering process or reflow oven. Decoupling capacitors should be placed as close as possible to VCC_INT and VCC_AUX pins for stable operation.


Spartan-3 Family Architecture Overview

The Spartan-3 is Xilinx’s third-generation low-cost FPGA platform, built on a 90nm process node. The XC3S50-5TQ144C is the smallest member of the Spartan-3 family, sitting at the entry point of the portfolio.

Spartan-3 Family Comparison

Device System Gates Slices Block RAM (Kb) Multipliers Max I/O
XC3S50 50,000 768 72 4 124
XC3S200 200,000 1,920 216 12 173
XC3S400 400,000 3,584 288 16 264
XC3S1000 1,000,000 7,680 432 24 391
XC3S1500 1,500,000 10,752 648 32 487
XC3S2000 2,000,000 14,336 720 40 565
XC3S4000 4,000,000 28,672 1,728 96 784
XC3S5000 5,000,000 33,280 1,872 104 784

The XC3S50 is ideal for designs that do not require large logic capacity but benefit from FPGA reprogrammability and flexible I/O.


Typical Applications for XC3S50-5TQ144C

The XC3S50-5TQ144C is used across a broad range of industries and application types:

Industrial and Embedded Applications

  • Glue logic replacement: Replacing discrete logic ICs with a single programmable device
  • Serial protocol bridges: UART, SPI, I²C bridging and protocol conversion
  • Motor control sequencing: Simple state machines for stepper or DC motor controllers
  • Sensor interface logic: Data acquisition front-ends for ADCs and sensors

Communications

  • LVDS data links: High-speed differential data transmission between boards
  • FIFO buffers and data alignment: Synchronizing data between clock domains
  • Custom framing and packetization logic: Lightweight protocol implementations

Consumer Electronics and Education

  • FPGA learning boards: Ideal for students learning HDL (VHDL or Verilog)
  • Embedded controller peripherals: Offloading peripheral logic from microcontrollers
  • Prototype and evaluation boards: Quick proof-of-concept for new digital designs

Automotive and Military (with appropriate screening)

  • Signal conditioning: Pre-processing of sensor signals
  • Safety interlocks and monitoring logic: Watchdog and supervisory circuits

Configuration Modes for XC3S50-5TQ144C

The XC3S50-5TQ144C supports multiple configuration modes, allowing flexibility in system design:

Configuration Mode Description
Master Serial FPGA reads bitstream from an external serial flash (e.g., SPI Flash)
Slave Serial External host loads configuration via serial bitstream
JTAG IEEE 1149.1 boundary scan and in-circuit programming
Master SelectMAP Parallel mode, FPGA drives byte-wide configuration bus
Slave SelectMAP External microcontroller or CPU drives configuration data

For most standalone embedded applications, Master Serial mode with an external SPI flash (e.g., Xilinx XCF02S or compatible) is the most common approach.


Design Tools and IP Support

Xilinx ISE Design Suite

The XC3S50-5TQ144C is supported by Xilinx ISE Design Suite (up to version 14.7, the final ISE release). This includes:

  • ISE Project Navigator – HDL synthesis, simulation, and implementation
  • CORE Generator – IP cores for memory interfaces, DSP, communications
  • ChipScope Pro – In-circuit debugging and logic analysis
  • iMPACT – JTAG-based device programming

Note: The Spartan-3 family is not supported by Vivado. Engineers must use ISE 14.7, which remains freely downloadable from the AMD/Xilinx website.

HDL Language Support

Language Support
VHDL Full synthesis and simulation
Verilog Full synthesis and simulation
SystemVerilog Partial (via ISE with simulation tools)
Schematic Entry Supported in ISE

XC3S50-5TQ144C vs XC3S50-4TQ144C vs XC3S50A: Speed Grade and Variant Comparison

Parameter XC3S50-4TQ144C XC3S50-5TQ144C XC3S50-5TQG144C
Speed Grade -4 (slower) -5 (standard) -5
Package TQFP-144 TQFP-144 TQFP-144 (lead-free)
Lead-Free Standard tin-lead Standard tin-lead Yes (RoHS, G suffix)
Temperature Commercial (0–85°C) Commercial (0–85°C) Commercial (0–85°C)
Logic Resources Same Same Same

The XC3S50-5TQG144C (note the “G”) is the Pb-free/RoHS-compliant version. The XC3S50-5TQ144C and XC3S50-5TQG144C are functionally equivalent and pin-compatible.


Ordering Information and Part Variants

Part Number Speed Grade Package Lead-Free Temp Range
XC3S50-4TQ144C -4 TQ144 No Commercial
XC3S50-5TQ144C -5 TQ144 No Commercial
XC3S50-5TQG144C -5 TQ144 Yes Commercial
XC3S50-4TQ144I -4 TQ144 No Industrial
XC3S50-5TQ144I -5 TQ144 No Industrial

PCB Design Guidelines for XC3S50-5TQ144C

Decoupling and Power Supply

  • Place 100nF ceramic capacitors on every VCC_INT pin, as close as possible to the pad
  • Place 100nF ceramic capacitors on every VCC_AUX and VCCO pin
  • Add 10µF bulk capacitors per power rail near the device for low-frequency ripple suppression
  • Use a 4-layer PCB minimum: signal, ground plane, power plane, signal

Signal Integrity

  • Keep JTAG traces short and matched in length
  • Use series termination resistors (22–33Ω) on high-speed output signals
  • Route differential pairs (LVDS) with controlled impedance (100Ω differential)
  • Avoid routing signals under the FPGA die area on inner layers

Thermal Considerations

  • The XC3S50 has a low power envelope and does not require a heatsink in most applications
  • Ensure adequate copper pour around the exposed paddle if using QFN variants (not applicable for TQ144)
  • Operating junction temperature should be kept below 85°C for commercial-grade devices

Frequently Asked Questions (FAQ)

Q: Is the XC3S50-5TQ144C still in production? A: The Spartan-3 family has reached end-of-life status with AMD Xilinx. However, significant inventory exists through authorized distributors and component brokers. Always verify stock availability before designing it into new products.

Q: Can I use Vivado with XC3S50-5TQ144C? A: No. Vivado does not support Spartan-3. You must use Xilinx ISE Design Suite version 14.7 or earlier.

Q: What is the difference between XC3S50-5TQ144C and XC3S50-5TQG144C? A: The “G” suffix denotes RoHS-compliant, lead-free solder terminals. Both parts are functionally and pin-identical.

Q: What configuration flash should I use with the XC3S50-5TQ144C? A: Common choices include the Xilinx XCF02S, Atmel AT45DB series, or standard SPI NOR flash chips compatible with Xilinx master serial configuration.

Q: What is the minimum VCC_INT voltage for the XC3S50? A: The core voltage (VCC_INT) is nominally 1.2V, with an operating range of 1.14V to 1.26V.


Summary

The XC3S50-5TQ144C is a proven, widely adopted entry-level FPGA delivering 50,000 system gates, 97 user I/Os, dual DCMs, and block RAM in a compact 144-pin TQFP package. While based on mature 90nm technology, it remains a practical choice for legacy system maintenance, prototyping, education, and cost-sensitive applications where reprogrammable logic is required.

Its broad tool support under Xilinx ISE 14.7, extensive application examples, and affordable price point make it a reliable starting point for engineers new to FPGA design as well as seasoned professionals maintaining existing product lines.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.