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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1057C: Complete Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1057C is a high-density, 2.5V Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, cost-sensitive applications, this device delivers up to 200,000 system gates in a robust 1057-ball Fine-Pitch BGA (FGG) Pb-free package, operating at the fastest commercial -6 speed grade. Whether you’re designing communications equipment, embedded systems, or industrial controllers, the XC2S200-6FGG1057C offers a powerful and programmable logic solution.


What Is the XC2S200-6FGG1057C?

The XC2S200-6FGG1057C is part of the Xilinx Spartan-II FPGA family — a 2.5V programmable logic device built on an advanced 0.18µm, 6-layer metal process. It combines high logic density with low power consumption, making it a strong alternative to mask-programmed ASICs. The part number breaks down as follows:

Part Number Segment Description
XC2S200 Spartan-II device with ~200,000 system gates
-6 Speed grade (-6 is fastest; commercial range only)
FGG Fine-Pitch Ball Grid Array — Pb-free (lead-free) package
1057 1057-pin package
C Commercial temperature range (0°C to +85°C)

Key Features of the XC2S200-6FGG1057C

The XC2S200-6FGG1057C inherits all the architectural strengths of the Spartan-II family, tailored for the largest device in the lineup:

  • 5,292 logic cells with ~200,000 usable system gates
  • 1,176 Configurable Logic Blocks (CLBs) arranged in a 28 × 42 array
  • 284 maximum user I/O pins (excluding 4 global clock inputs)
  • 75,264 bits of distributed RAM for fast on-chip data storage
  • 56K bits of dedicated block RAM (7 block RAM modules × 8K bits each)
  • Four Delay-Locked Loops (DLLs) for clock management and skew reduction
  • 2.5V core voltage with 5V-tolerant I/O capability
  • IEEE 1149.1 JTAG Boundary Scan support for in-circuit testing
  • Supports SelectIO™ multi-standard I/O technology
  • Pb-free (RoHS-compliant) packaging with “G” suffix in part number

XC2S200-6FGG1057C Full Specifications

General Logic Specifications

Parameter Value
Device Family Spartan-II
Logic Cells 5,292
System Gates (Logic + RAM) ~200,000
CLB Array 28 rows × 42 columns
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM (bits) 75,264
Block RAM (bits) 56K (7 × 8K)
Delay-Locked Loops (DLLs) 4

Package & Electrical Specifications

Parameter Value
Package Type FGG (Fine-Pitch BGA, Pb-free)
Pin Count 1057
Speed Grade -6 (fastest available)
Core Supply Voltage (VCCINT) 2.5V
I/O Supply Voltage (VCCO) 1.5V – 3.3V
Temperature Range Commercial: 0°C to +85°C
Process Technology 0.18µm, 6-layer metal CMOS
Configuration Interface Master Serial, Slave Serial, SelectMAP, JTAG

Speed Grade Comparison for XC2S200

Speed Grade Availability Temperature Range
-6 Commercial only 0°C to +85°C
-5 Commercial & Industrial 0°C to +85°C / –40°C to +100°C

XC2S200-6FGG1057C Architecture Overview

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200 contains two logic cells, each with a 4-input Look-Up Table (LUT), dedicated carry logic, and a D-type flip-flop. CLBs are arranged in a regular grid and interconnected through a hierarchical routing matrix, enabling flexible logic implementation for both combinational and sequential designs.

Input/Output Blocks (IOBs)

The programmable IOBs support multiple I/O standards through Xilinx SelectIO technology, including LVTTL, LVCMOS33/25/18, GTL+, HSTL, and SSTL. Each IOB features input and output flip-flops, tri-state control, and optional pull-up/pull-down resistors.

Block RAM

The XC2S200 features 7 block RAM modules (56K bits total), each configurable as:

  • 4K × 1-bit
  • 2K × 2-bit
  • 1K × 4-bit
  • 512 × 8-bit (or 9-bit with parity)

This dedicated RAM is ideal for FIFOs, data buffers, and look-up tables in signal processing applications.

Delay-Locked Loops (DLLs)

Four on-chip DLLs — positioned at each corner of the die — provide zero-skew clock distribution, frequency synthesis, and phase shifting. The DLLs eliminate clock distribution delays and enable synchronous designs operating at high clock frequencies.


Spartan-II Family Comparison Table

Device Logic Cells System Gates CLB Array Max User I/O Dist. RAM (bits) Block RAM (bits)
XC2S15 432 15,000 8 × 12 86 6,144 16K
XC2S30 972 30,000 12 × 18 92 13,824 24K
XC2S50 1,728 50,000 16 × 24 176 24,576 32K
XC2S100 2,700 100,000 20 × 30 176 38,400 40K
XC2S150 3,888 150,000 24 × 36 260 55,296 48K
XC2S200 5,292 200,000 28 × 42 284 75,264 56K

The XC2S200 is the largest and most powerful device in the Spartan-II family, offering maximum logic capacity and I/O count in the lineup.


Typical Applications for the XC2S200-6FGG1057C

The XC2S200-6FGG1057C is suited for a broad range of high-volume embedded and digital design applications:

  • Telecommunications — Line interface units, protocol bridging, and packet processing
  • Networking equipment — Switch fabric logic, routing controllers
  • Industrial automation — Motor control, sensor fusion, PLC replacement
  • Consumer electronics — Set-top boxes, display controllers
  • Embedded computing — Co-processors, custom peripheral logic
  • Medical devices — Signal acquisition and processing circuits
  • Automotive electronics — ADAS sensor interfacing (commercial temperature grade)

Configuration Modes

The XC2S200-6FGG1057C supports the following configuration modes:

Configuration Mode Description
Master Serial Uses external serial PROM (e.g., XCF02S)
Slave Serial Driven by an external controller
SelectMAP (Slave Parallel) 8-bit parallel configuration for fast loading
JTAG (IEEE 1149.1) Boundary scan and in-system programming

Ordering Information & Part Number Decoder

Understanding the full part number helps ensure you order the correct variant:

XC2S200 - 6 - FGG - 1057 - C
  |        |    |      |     |
  |        |    |      |     └── C = Commercial (0°C to +85°C)
  |        |    |      └──────── 1057 = 1057-pin package
  |        |    └─────────────── FGG = Fine-Pitch BGA, Pb-Free
  |        └──────────────────── 6 = Speed Grade (fastest)
  └───────────────────────────── XC2S200 = Spartan-II, 200K gates

Note: The “G” in FGG indicates a Pb-free (RoHS-compliant) package, per Xilinx’s green packaging initiative. The -6 speed grade is exclusively available in the commercial temperature range.


Why Choose the XC2S200-6FGG1057C?

Here are the top reasons engineers and procurement teams select this part:

  1. Highest density in the Spartan-II family — 200K system gates for complex logic designs
  2. Fastest speed grade (-6) — Ideal for timing-critical applications
  3. Lead-free (Pb-free) package — Meets RoHS and environmental compliance requirements
  4. Large I/O count (284 user I/Os) — Excellent for I/O-intensive interface designs
  5. Proven Xilinx architecture — Supported by Xilinx ISE design tools with extensive IP library
  6. Cost-effective ASIC alternative — Faster time-to-market with field-reprogrammability
  7. On-chip DLL clock management — Simplifies board-level clock design

Design Tools & Software Support

The XC2S200-6FGG1057C is supported by Xilinx ISE Design Suite, which includes:

  • XST (Xilinx Synthesis Technology) — RTL synthesis for VHDL and Verilog
  • PARTools (Place and Route) — Automated device fitting and timing optimization
  • iMPACT — Configuration download and JTAG boundary scan programming
  • ChipScope Pro — In-system logic analysis and debugging

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1057C used for?

It is a programmable logic device (FPGA) used to implement custom digital circuits in telecommunications, networking, industrial, and embedded system applications.

What does the “-6” speed grade mean?

The -6 speed grade is the fastest available for the Spartan-II family. A lower propagation delay means the device can operate at higher clock frequencies.

Is the XC2S200-6FGG1057C RoHS compliant?

Yes. The “G” in “FGG” indicates a Pb-free, RoHS-compliant package.

What is the operating temperature range?

The “C” suffix denotes the commercial temperature range: 0°C to +85°C.

How many I/O pins does the XC2S200-6FGG1057C have?

It supports up to 284 maximum user I/O pins (not counting the four dedicated global clock inputs).


Where to Buy XC2S200-6FGG1057C

The XC2S200-6FGG1057C can be sourced through authorized distributors and component suppliers. When purchasing, verify the part marking, date code, and lot traceability to avoid counterfeit components. For a broader range of Xilinx FPGA products and competitive pricing, ensure you work with reputable and certified suppliers.


Summary

The XC2S200-6FGG1057C stands as the top-tier device in the Xilinx Spartan-II 2.5V FPGA family. With 5,292 logic cells, 200,000 system gates, 284 user I/Os, 56K bits of block RAM, and four on-chip DLLs — all packed into a Pb-free 1057-pin FGG BGA package at the fastest -6 speed grade — it delivers exceptional performance and design flexibility for commercial-grade applications. Its proven architecture, broad tool support, and field-reprogrammability make it a reliable choice for engineers seeking a cost-effective, high-performance programmable logic solution.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.