Meta Description: Buy XC2S200-6FGG1055C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, -6 speed grade, FGG1055 package. Full specs, pinout, applications & datasheet guide.
What Is the XC2S200-6FGG1055C?
The XC2S200-6FGG1055C is a high-density, 2.5V field-programmable gate array (FPGA) from Xilinx’s industry-proven Spartan-II family. Designed for high-volume commercial applications, this device packs 200,000 system gates and 5,292 configurable logic cells into a fine-pitch ball grid array (FGG) package with 1,055 pins. It operates at a -6 speed grade — the fastest available in the Spartan-II lineup — and is rated for the commercial temperature range (0°C to +85°C).
Whether you are working on telecommunications equipment, digital signal processing systems, or embedded control boards, the XC2S200-6FGG1055C delivers a compelling mix of performance, flexibility, and cost efficiency.
For a broader overview of the Xilinx Spartan product ecosystem, visit Xilinx FPGA.
XC2S200-6FGG1055C Part Number Breakdown
Understanding the part number is essential for procurement and design verification.
| Code Segment |
Meaning |
| XC |
Xilinx product identifier |
| 2S200 |
Spartan-II family, 200K system gates |
| -6 |
Speed grade (fastest for Spartan-II) |
| FGG |
Fine-pitch ball grid array, Pb-free package |
| 1055 |
Total number of pins |
| C |
Commercial temperature range (0°C to +85°C) |
XC2S200-6FGG1055C Key Specifications
Core Logic Resources
The XC2S200 is the largest member of the Spartan-II family, featuring 5,292 logic cells, 200,000 system gates (logic and RAM combined), and a CLB array of 28 columns × 42 rows, yielding 1,176 total configurable logic blocks (CLBs).
| Parameter |
Value |
| Device Family |
Spartan-II (2.5V) |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Speed Grade |
-6 (Commercial only) |
| Core Voltage |
2.5V |
| Technology Node |
0.18 µm |
| Package |
FGG1055 (Fine-Pitch BGA) |
| Pin Count |
1,055 |
| Temperature Range |
0°C to +85°C (Commercial) |
Architecture & Internal Features
Configurable Logic Blocks (CLBs)
Each CLB in the XC2S200-6FGG1055C contains four logic cells arranged in two slices. Every slice includes two 4-input look-up tables (LUTs), which can be used either as logic functions or as 16-bit distributed RAM. This flexibility allows designers to optimize for either logic density or on-chip memory.
Input/Output Blocks (IOBs)
The device supports up to 284 user-configurable I/O pins, each with programmable drive strength, slew rate control, and optional input delay. The IOBs support a wide variety of single-ended and differential I/O standards, making the XC2S200-6FGG1055C suitable for interfacing with diverse external components and buses.
Block RAM
The XC2S200 includes 56K bits of dedicated block RAM, organized in two columns on opposite sides of the die between the CLBs and IOB columns. Each block RAM is a true dual-port memory that can be configured in various depth-and-width combinations.
Delay-Locked Loops (DLLs)
The XC2S200-6FGG1055C integrates four Delay-Locked Loops (DLLs), one at each corner of the die. DLLs eliminate clock distribution delays, enabling precise, zero-skew clock distribution across the entire device — critical for high-speed synchronous designs.
Spartan-II Family Comparison Table
| Device |
Logic Cells |
System Gates |
CLB Array |
Max I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
75,264 bits |
56K |
The XC2S200 is the top-tier device in the Spartan-II family, offering the largest gate count, logic capacity, I/O count, and memory resources.
Package Information: FGG1055
The FGG1055 is a fine-pitch ball grid array package with 1,055 solder balls. The “G” in “FGG” indicates a Pb-free (RoHS-compliant) packaging option, which is essential for designs targeting modern environmental regulations in Europe (RoHS Directive), China (China RoHS), and other markets.
| Package Attribute |
Detail |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Pins |
1,055 |
| Lead-Free (Pb-Free) |
Yes (“G” suffix in FGG) |
| RoHS Compliant |
Yes |
| Mounting |
Surface Mount |
Speed Grade & Timing Performance
The -6 speed grade designates the fastest performance tier available for the Spartan-II family. The -6 speed grade is exclusively available in the commercial temperature range. Designers targeting maximum clock frequency and minimal propagation delay should select the -6 grade to extract peak performance from the XC2S200 architecture.
| Speed Grade |
Max Frequency |
Temperature Range |
| -6 |
~200+ MHz (internal logic) |
Commercial only (0°C to +85°C) |
| -5 |
Slower |
Commercial and Industrial |
XC2S200-6FGG1055C Applications
The XC2S200-6FGG1055C is well-suited for a wide range of embedded and high-volume applications:
- Telecommunications & Networking – Protocol bridging, framing logic, and switch fabrics
- Digital Signal Processing (DSP) – FIR filters, FFT cores, and data path acceleration
- Industrial Control – Motor control, sensor fusion, and real-time logic
- Consumer Electronics – Video processing, image scaling, and display control
- Embedded Systems – Soft-core processor implementations (e.g., MicroBlaze-compatible logic)
- ASIC Prototyping – Pre-silicon verification and design emulation
Why Choose the XC2S200-6FGG1055C Over an ASIC?
The Spartan-II family was specifically designed as a cost-effective alternative to mask-programmed ASICs. The XC2S200-6FGG1055C offers several distinct advantages:
| Factor |
ASIC |
XC2S200-6FGG1055C FPGA |
| NRE Cost |
Very high (mask costs) |
None |
| Design Cycle |
Months |
Days to weeks |
| Field Updates |
Not possible |
Yes, reconfigurable |
| Risk |
High (tape-out risk) |
Low |
| Minimum Order |
High volume required |
Available in small quantities |
Ordering Information & Compliance
When ordering the XC2S200-6FGG1055C, note the following:
- The “C” suffix confirms commercial temperature range (0°C to +85°C)
- The “G” in “FGG” confirms Pb-free / RoHS-compliant packaging
- Always verify the latest availability status, as some Spartan-II variants have been subject to product lifecycle notices (PDN)
Frequently Asked Questions (FAQ)
Q: What is the XC2S200-6FGG1055C used for? It is used in digital logic design, DSP, telecommunications, embedded systems, and ASIC prototyping applications requiring a high-density, reconfigurable FPGA.
Q: Is the XC2S200-6FGG1055C RoHS compliant? Yes. The “G” in the FGG package designator confirms it uses Pb-free solder balls, making it compliant with RoHS regulations.
Q: What is the maximum I/O count for the XC2S200-6FGG1055C? The XC2S200 supports up to 284 user I/O pins (excluding the four global clock/user input pins).
Q: What programming tools does the XC2S200-6FGG1055C support? This device is supported by Xilinx ISE Design Suite. Configuration modes include Master Serial, Slave Serial, Master Parallel (SelectMAP), and JTAG boundary scan.
Q: Can the XC2S200-6FGG1055C be used in industrial temperature environments? No. The -6 speed grade with the “C” suffix is rated for commercial temperature only (0°C to +85°C). For industrial range (-40°C to +85°C), select the -5 speed grade with the “I” suffix.
Summary
The XC2S200-6FGG1055C is the flagship device of the Xilinx Spartan-II family, offering the maximum available gate count (200K), logic cells (5,292), and I/O resources (284 pins) in a Pb-free FGG1055 fine-pitch BGA package. With its -6 speed grade for peak performance and commercial-grade temperature rating, it is an excellent choice for high-volume, cost-sensitive digital design projects ranging from DSP to embedded control to ASIC replacement.
For a complete range of Spartan, Virtex, and Kintex programmable logic solutions, visit Xilinx FPGA.
