The XC2S200-6FGG1050C is a high-performance, cost-effective field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device delivers up to 200,000 system gates, a fine-pitch BGA package, and a -6 speed grade — making it one of the most capable parts in the Spartan-II lineup. Whether you are prototyping, replacing an ASIC, or designing a production-ready embedded system, the XC2S200-6FGG1050C offers a compelling combination of logic density, I/O flexibility, and on-chip memory.

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What Is the XC2S200-6FGG1050C?

The XC2S200-6FGG1050C is a member of Xilinx’s Spartan-II 2.5V FPGA family. The part number breaks down as follows:

Note: The -6 speed grade is exclusively available in the commercial temperature range, making this part ideal for consumer and industrial electronics that operate in standard environments.

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XC2S200-6FGG1050C Key Specifications

Core Logic and Memory

Package and Electrical Characteristics

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Spartan-II Family Comparison: Where Does the XC2S200 Stand?

The table below shows where the XC2S200 ranks within the full Spartan-II device family:

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the maximum logic, I/O count, and on-chip memory.

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XC2S200-6FGG1050C Architecture Overview

Configurable Logic Blocks (CLBs)

The Spartan-II CLB is built around four-input look-up tables (LUTs) and flip-flops. Each CLB slice can be used as:

• Logic: Implement combinational or registered logic functions
• Distributed RAM: Configure LUTs as small, fast RAM
• Shift Registers: Create efficient serial-to-parallel data paths

With 1,176 CLBs arranged in a 28×42 grid, the XC2S200 supports complex logic designs that would otherwise require a mask-programmed ASIC.

Block RAM

The XC2S200 contains 56K bits of dedicated block RAM, arranged in two columns on opposite sides of the die. Block RAM is ideal for:

• FIFOs and data buffers
• Lookup tables (large)
• On-chip program storage for soft-core processors

Delay-Locked Loops (DLLs)

Four DLLs — one at each corner of the die — provide:

• Clock deskew and distribution
• Clock frequency synthesis
• Phase shifting for high-speed interfaces

Input/Output Blocks (IOBs)

The 284 user-configurable I/O pins on the XC2S200-6FGG1050C support multiple I/O standards, including LVTTL, LVCMOS, PCI, and GTL+, providing broad compatibility with system-level designs.

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XC2S200-6FGG1050C Speed Grade -6: What Does It Mean?

Speed grade -6 is the fastest available in the Spartan-II family. A higher speed grade number translates to lower propagation delays and the ability to operate at higher clock frequencies. This makes the XC2S200-6FGG1050C the preferred choice when:

• Timing margins are tight in high-speed designs
• Maximum system performance is required
• You need the fastest route through combinational logic paths

The -6 speed grade is only offered in the commercial temperature range (0°C to +85°C). Industrial temperature versions use lower speed grades.

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Configuration Methods for the XC2S200-6FGG1050C

Spartan-II FPGAs, including the XC2S200-6FGG1050C, support multiple configuration modes:

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Typical Applications of the XC2S200-6FGG1050C

The XC2S200-6FGG1050C is well-suited for a wide range of applications:

• Embedded systems — Replace hard-to-source ASICs with a programmable alternative
• Communications equipment — High I/O count enables complex bus interfacing
• Industrial control — Implement custom control logic with on-chip memory
• Prototyping and development — Rapidly iterate designs before committing to silicon
• Signal processing — DLLs and block RAM enable efficient DSP implementations
• Consumer electronics — Cost-effective and high-density for volume production

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Why Choose the XC2S200-6FGG1050C Over Other FPGAs?

Cost-Effective Alternative to ASICs

The Spartan-II family was purpose-built as a superior, low-cost alternative to mask-programmed ASICs. The XC2S200-6FGG1050C eliminates NRE (non-recurring engineering) costs while offering reprogrammability throughout the product lifecycle.

Pb-Free Packaging (FGG)

The “G” in FGG1050 confirms this is a Pb-free (RoHS-compliant) package, meeting environmental regulations for global distribution without requiring special handling.

Broad I/O Standard Support

With support for multiple single-ended I/O standards, the XC2S200-6FGG1050C integrates easily into mixed-voltage systems — a critical advantage in multi-board designs.

Proven Silicon from AMD/Xilinx

As part of Xilinx’s (now AMD) Spartan-II portfolio, this device benefits from decades of proven deployment across thousands of production designs worldwide. For a broader overview of the full product range, visit Xilinx FPGA for additional options and sourcing guidance.

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Ordering Information and Part Number Decoding

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XC2S200-6FGG1050C vs. Similar Parts: Quick Comparison

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Frequently Asked Questions (FAQ)

What does the “C” at the end of XC2S200-6FGG1050C mean?

The “C” designates the commercial temperature range: 0°C to +85°C ambient operating temperature.

Is the XC2S200-6FGG1050C RoHS compliant?

Yes. The “G” in the FGG package code confirms this is a Pb-free, RoHS-compliant device.

What programming software is used for the XC2S200-6FGG1050C?

The XC2S200-6FGG1050C is supported by Xilinx ISE Design Suite (the legacy Xilinx toolchain for Spartan-II devices). HDL entry in VHDL or Verilog is fully supported.

Can the XC2S200-6FGG1050C replace an ASIC?

Yes. The Spartan-II family was designed specifically as a programmable ASIC replacement for high-volume applications, eliminating mask costs and enabling field updates.

What is the core voltage for the XC2S200-6FGG1050C?

The device operates at a 2.5V core supply voltage, with I/O banks supporting 2.5V and 3.3V standards.

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Summary

The XC2S200-6FGG1050C is the flagship device of Xilinx’s Spartan-II 2.5V FPGA family. With 200,000 system gates, 5,292 logic cells, 284 user I/Os, 56K bits of block RAM, and the fastest available -6 speed grade in a commercial-temperature Pb-free BGA package, it is an excellent choice for engineers who need maximum logic density and I/O flexibility in a proven, production-tested platform. Its reprogrammability, broad I/O standard support, and low NRE make it a superior long-term investment compared to fixed-function ASICs.