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XC2S200-6FGG1047C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1047C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, a 1047-ball Fine-Pitch BGA package, and a blazing -6 speed grade, this device is engineered for engineers and designers who demand programmable logic flexibility without the high cost of mask-programmed ASICs. Whether you are prototyping a new digital system or deploying a high-volume embedded solution, the XC2S200-6FGG1047C delivers the logic density, I/O capacity, and clock performance your design requires.


What Is the XC2S200-6FGG1047C? – Part Number Breakdown

Understanding the part number helps you quickly identify the exact variant you need:

Part Number Segment Description
XC2S200 Xilinx Spartan-II family, 200K system gates
-6 Speed Grade 6 (fastest available for commercial range)
FGG Fine-Pitch Ball Grid Array (FBGA), Pb-free (“G” suffix)
1047 1047-pin package
C Commercial temperature range (0°C to +85°C)

Note: The “G” in “FGG” indicates a Pb-free (RoHS-compliant) package option, making it suitable for designs that require compliance with environmental regulations.


XC2S200-6FGG1047C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
System Gates (Logic + RAM) 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits

Electrical & Timing Specifications

Parameter Value
Core Supply Voltage 2.5V
Technology Node 0.18 µm
Maximum Frequency Up to 263 MHz
Speed Grade -6 (Commercial only)
Operating Temperature 0°C to +85°C (Commercial)
Package Type 1047-Ball Fine-Pitch BGA
Package Dimensions Fine-Pitch BGA (FGG)

XC2S200-6FGG1047C Features and Architecture

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1047C contains 1,176 CLBs arranged in a 28×42 array. Each CLB includes four logic cells, each built around a 4-input Look-Up Table (LUT), a D-type flip-flop, and fast carry logic. This architecture enables efficient implementation of both combinational and sequential logic functions.

Block RAM – Embedded Memory

The device provides 56K bits of block RAM distributed in two columns on either side of the CLB array. Block RAM supports true dual-port operation, allowing simultaneous read and write access from two independent ports — ideal for FIFO buffers, data caches, and lookup tables in embedded applications.

Distributed RAM

In addition to block RAM, the XC2S200-6FGG1047C supports 75,264 bits of distributed RAM implemented within the CLB LUTs. Distributed RAM is perfect for small, fast memory structures that are tightly coupled with logic.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — enable precise clock management. DLLs eliminate clock distribution delay, support clock frequency synthesis, and allow phase shifting, ensuring clean, jitter-minimized clocking across the entire device.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1047C supports up to 284 user I/Os, each featuring programmable drive strength, slew rate control, and support for multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, SSTL, and more. Each IOB includes three storage elements for registered I/O operation.


Package and Ordering Information

Package Options for XC2S200

Package Code Package Type Pin Count
PQ / PQG Plastic Quad Flat Pack (PQFP) 208
FG / FGG Fine-Pitch Ball Grid Array (FBGA) 256
FG / FGG Fine-Pitch Ball Grid Array (FBGA) 456
FGG Fine-Pitch Ball Grid Array (FBGA), Pb-Free 1047

The FGG1047 package of the XC2S200-6FGG1047C offers a high pin count in a compact BGA footprint, making it suitable for advanced PCB designs requiring high I/O density. The Pb-free suffix “G” ensures compliance with RoHS directives.

Temperature Range & Speed Grade Availability

Speed Grade Commercial (0°C to +85°C) Industrial (-40°C to +100°C)
-6 ✅ Available ❌ Not Available
-5 ✅ Available ✅ Available
-4 ✅ Available ✅ Available

The -6 speed grade is exclusively available in the commercial temperature range, making the XC2S200-6FGG1047C ideal for consumer and commercial electronics applications.


Spartan-II Family Comparison – Where Does XC2S200 Fit?

Device Logic Cells System Gates CLB Array Max User I/O Block RAM
XC2S15 432 15,000 8×12 86 16K
XC2S30 972 30,000 12×18 92 24K
XC2S50 1,728 50,000 16×24 176 32K
XC2S100 2,700 100,000 20×30 176 40K
XC2S150 3,888 150,000 24×36 260 48K
XC2S200 5,292 200,000 28×42 284 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic cell count, maximum user I/O, and the most block RAM of any device in the lineup.


Why Choose the XC2S200-6FGG1047C?

Cost-Effective Alternative to ASICs

The XC2S200-6FGG1047C eliminates the non-recurring engineering (NRE) costs and lengthy mask-set development cycles associated with traditional ASICs. Designers can reprogram the FPGA in the field, enabling rapid iteration and post-deployment upgrades — something impossible with fixed-silicon ASIC solutions.

Proven 0.18 µm CMOS Technology

Built on a mature 0.18 µm CMOS process, the Spartan-II XC2S200 offers a well-characterized, reliable silicon platform that has been deployed in millions of end products across industrial, telecom, consumer, and automotive applications.

High-Speed Performance at -6 Speed Grade

The -6 speed grade is the fastest available for the Spartan-II commercial range, supporting system frequencies up to 263 MHz. This makes it suitable for demanding applications such as high-speed data processing, DSP pipelines, and communication protocol interfaces.

Versatile I/O Standards Support

With support for LVTTL, LVCMOS2, PCI, GTL, SSTL2, SSTL3, CTT, AGP, and more, the XC2S200-6FGG1047C integrates seamlessly into mixed-voltage system designs and interfaces with a wide variety of processors, memory devices, and peripherals.


Typical Applications of the XC2S200-6FGG1047C

The XC2S200-6FGG1047C FPGA is commonly used across a broad range of industries and applications:

Application Area Use Cases
Communications Protocol bridging, line card logic, signal processing
Industrial Control Motor control, PLC logic, sensor interfaces
Consumer Electronics Display controllers, set-top box logic, multimedia processing
Embedded Systems Custom soft-core processors, peripheral interfaces
Test & Measurement Signal capture, pattern generation, data logging
Networking Packet processing, switching logic, Ethernet bridging

Configuration and Programming

Supported Configuration Modes

The XC2S200-6FGG1047C supports multiple configuration modes, offering flexibility in how the device is programmed in end systems:

  • Master Serial Mode – using Xilinx Serial PROMs
  • Slave Serial Mode – driven by an external controller
  • Master Parallel (SelectMAP) Mode – fast byte-wide configuration
  • Slave Parallel (SelectMAP) Mode – for processor-controlled configuration
  • JTAG Boundary Scan – IEEE 1149.1 compliant in-system programming and testing

Configuration Memory

The XC2S200 stores its configuration in SRAM-based configuration cells, which means the device must be reconfigured on every power-up. Xilinx serial or parallel PROMs (such as XC17V and XC18V series) are the recommended configuration storage solutions for standalone designs.


XC2S200-6FGG1047C vs. Competing FPGAs

Feature XC2S200-6FGG1047C (Spartan-II) Comparable Competitor Device
Gate Count 200,000 ~200K class
Core Voltage 2.5V 2.5V / 3.3V
Speed Grade -6 (263 MHz) Varies
Package 1047-pin FBGA Multiple options
Configuration SRAM-based SRAM-based
DLLs 4 Varies
Block RAM 56K bits Varies

For engineers looking at the broader landscape of programmable logic, the Xilinx FPGA portfolio offers a wide range of devices from the cost-optimized Spartan series to the high-performance Virtex family, ensuring the right fit for every design requirement.


Design Tools and Software Support

The XC2S200-6FGG1047C is fully supported by Xilinx ISE Design Suite (now AMD’s legacy toolchain). Key tools include:

  • XST (Xilinx Synthesis Technology) – for RTL synthesis from VHDL or Verilog
  • ISE Project Navigator – integrated design environment
  • ChipScope Pro – in-system logic analysis and debugging
  • CORE Generator – IP core generation for common functions (FIFOs, DSP, memory controllers)
  • iMPACT – device programming and configuration utility

Note: As a legacy device, the XC2S200-6FGG1047C is supported under ISE 14.7, the final release of Xilinx’s ISE toolchain, which remains freely available for download.


Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean on the XC2S200-6FGG1047C?

The -6 speed grade represents the fastest timing characterization available for the Spartan-II commercial range. A lower number in Xilinx speed grade notation indicates faster propagation delays and higher maximum operating frequencies. The -6 grade supports system clock frequencies up to 263 MHz.

Is the XC2S200-6FGG1047C RoHS compliant?

Yes. The “G” in the “FGG” package code indicates a Pb-free, RoHS-compliant package. This makes the XC2S200-6FGG1047C suitable for products requiring compliance with European Union RoHS directives and similar environmental regulations worldwide.

What is the operating voltage of the XC2S200-6FGG1047C?

The device operates on a 2.5V core supply voltage. I/O voltage levels are configurable and depend on the I/O standard selected for each bank, supporting standards from 1.5V to 3.3V.

Can the XC2S200-6FGG1047C be used in industrial temperature applications?

No. The “C” suffix in the part number denotes the commercial temperature range (0°C to +85°C). For industrial temperature range (-40°C to +100°C) applications, consider the XC2S200-5FGG1047I or similar industrial-grade variants.

What configuration PROM is compatible with the XC2S200-6FGG1047C?

Xilinx XC18V04 or XC18V08 serial PROMs are commonly used for configuring the XC2S200-6FGG1047C in master serial mode. For parallel configuration, the XC17V series platform flash devices are compatible.


Summary: XC2S200-6FGG1047C at a Glance

Attribute Value
Manufacturer Xilinx (AMD)
Family Spartan-II
Part Number XC2S200-6FGG1047C
System Gates 200,000
Logic Cells 5,292
Speed Grade -6
Package 1047-Ball FBGA (Pb-Free)
Core Voltage 2.5V
Max Frequency 263 MHz
User I/O 284
Block RAM 56K bits
Distributed RAM 75,264 bits
DLLs 4
Temperature Range Commercial (0°C to +85°C)
Configuration SRAM-based (external PROM required)
RoHS Compliance Yes (Pb-Free)
Design Tool Xilinx ISE 14.7

The XC2S200-6FGG1047C remains a reliable, proven solution for engineers who need a high-I/O, cost-effective FPGA for commercial-temperature applications. Its combination of 200K gates, 284 user I/Os, 1047-pin BGA packaging, and -6 speed grade performance makes it one of the most capable devices in the Spartan-II lineup.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.