The XC2S200-6FGG1047C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, a 1047-ball Fine-Pitch BGA package, and a blazing -6 speed grade, this device is engineered for engineers and designers who demand programmable logic flexibility without the high cost of mask-programmed ASICs. Whether you are prototyping a new digital system or deploying a high-volume embedded solution, the XC2S200-6FGG1047C delivers the logic density, I/O capacity, and clock performance your design requires.
What Is the XC2S200-6FGG1047C? – Part Number Breakdown
Understanding the part number helps you quickly identify the exact variant you need:
| Part Number Segment |
Description |
| XC2S200 |
Xilinx Spartan-II family, 200K system gates |
| -6 |
Speed Grade 6 (fastest available for commercial range) |
| FGG |
Fine-Pitch Ball Grid Array (FBGA), Pb-free (“G” suffix) |
| 1047 |
1047-pin package |
| C |
Commercial temperature range (0°C to +85°C) |
Note: The “G” in “FGG” indicates a Pb-free (RoHS-compliant) package option, making it suitable for designs that require compliance with environmental regulations.
XC2S200-6FGG1047C Key Specifications
Core Logic Resources
| Parameter |
XC2S200 Value |
| System Gates (Logic + RAM) |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
Electrical & Timing Specifications
| Parameter |
Value |
| Core Supply Voltage |
2.5V |
| Technology Node |
0.18 µm |
| Maximum Frequency |
Up to 263 MHz |
| Speed Grade |
-6 (Commercial only) |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Package Type |
1047-Ball Fine-Pitch BGA |
| Package Dimensions |
Fine-Pitch BGA (FGG) |
XC2S200-6FGG1047C Features and Architecture
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1047C contains 1,176 CLBs arranged in a 28×42 array. Each CLB includes four logic cells, each built around a 4-input Look-Up Table (LUT), a D-type flip-flop, and fast carry logic. This architecture enables efficient implementation of both combinational and sequential logic functions.
Block RAM – Embedded Memory
The device provides 56K bits of block RAM distributed in two columns on either side of the CLB array. Block RAM supports true dual-port operation, allowing simultaneous read and write access from two independent ports — ideal for FIFO buffers, data caches, and lookup tables in embedded applications.
Distributed RAM
In addition to block RAM, the XC2S200-6FGG1047C supports 75,264 bits of distributed RAM implemented within the CLB LUTs. Distributed RAM is perfect for small, fast memory structures that are tightly coupled with logic.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (DLLs) — one at each corner of the die — enable precise clock management. DLLs eliminate clock distribution delay, support clock frequency synthesis, and allow phase shifting, ensuring clean, jitter-minimized clocking across the entire device.
Input/Output Blocks (IOBs)
The XC2S200-6FGG1047C supports up to 284 user I/Os, each featuring programmable drive strength, slew rate control, and support for multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, SSTL, and more. Each IOB includes three storage elements for registered I/O operation.
Package and Ordering Information
Package Options for XC2S200
| Package Code |
Package Type |
Pin Count |
| PQ / PQG |
Plastic Quad Flat Pack (PQFP) |
208 |
| FG / FGG |
Fine-Pitch Ball Grid Array (FBGA) |
256 |
| FG / FGG |
Fine-Pitch Ball Grid Array (FBGA) |
456 |
| FGG |
Fine-Pitch Ball Grid Array (FBGA), Pb-Free |
1047 |
The FGG1047 package of the XC2S200-6FGG1047C offers a high pin count in a compact BGA footprint, making it suitable for advanced PCB designs requiring high I/O density. The Pb-free suffix “G” ensures compliance with RoHS directives.
Temperature Range & Speed Grade Availability
| Speed Grade |
Commercial (0°C to +85°C) |
Industrial (-40°C to +100°C) |
| -6 |
✅ Available |
❌ Not Available |
| -5 |
✅ Available |
✅ Available |
| -4 |
✅ Available |
✅ Available |
The -6 speed grade is exclusively available in the commercial temperature range, making the XC2S200-6FGG1047C ideal for consumer and commercial electronics applications.
Spartan-II Family Comparison – Where Does XC2S200 Fit?
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
56K |
The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic cell count, maximum user I/O, and the most block RAM of any device in the lineup.
Why Choose the XC2S200-6FGG1047C?
Cost-Effective Alternative to ASICs
The XC2S200-6FGG1047C eliminates the non-recurring engineering (NRE) costs and lengthy mask-set development cycles associated with traditional ASICs. Designers can reprogram the FPGA in the field, enabling rapid iteration and post-deployment upgrades — something impossible with fixed-silicon ASIC solutions.
Proven 0.18 µm CMOS Technology
Built on a mature 0.18 µm CMOS process, the Spartan-II XC2S200 offers a well-characterized, reliable silicon platform that has been deployed in millions of end products across industrial, telecom, consumer, and automotive applications.
High-Speed Performance at -6 Speed Grade
The -6 speed grade is the fastest available for the Spartan-II commercial range, supporting system frequencies up to 263 MHz. This makes it suitable for demanding applications such as high-speed data processing, DSP pipelines, and communication protocol interfaces.
Versatile I/O Standards Support
With support for LVTTL, LVCMOS2, PCI, GTL, SSTL2, SSTL3, CTT, AGP, and more, the XC2S200-6FGG1047C integrates seamlessly into mixed-voltage system designs and interfaces with a wide variety of processors, memory devices, and peripherals.
Typical Applications of the XC2S200-6FGG1047C
The XC2S200-6FGG1047C FPGA is commonly used across a broad range of industries and applications:
| Application Area |
Use Cases |
| Communications |
Protocol bridging, line card logic, signal processing |
| Industrial Control |
Motor control, PLC logic, sensor interfaces |
| Consumer Electronics |
Display controllers, set-top box logic, multimedia processing |
| Embedded Systems |
Custom soft-core processors, peripheral interfaces |
| Test & Measurement |
Signal capture, pattern generation, data logging |
| Networking |
Packet processing, switching logic, Ethernet bridging |
Configuration and Programming
Supported Configuration Modes
The XC2S200-6FGG1047C supports multiple configuration modes, offering flexibility in how the device is programmed in end systems:
- Master Serial Mode – using Xilinx Serial PROMs
- Slave Serial Mode – driven by an external controller
- Master Parallel (SelectMAP) Mode – fast byte-wide configuration
- Slave Parallel (SelectMAP) Mode – for processor-controlled configuration
- JTAG Boundary Scan – IEEE 1149.1 compliant in-system programming and testing
Configuration Memory
The XC2S200 stores its configuration in SRAM-based configuration cells, which means the device must be reconfigured on every power-up. Xilinx serial or parallel PROMs (such as XC17V and XC18V series) are the recommended configuration storage solutions for standalone designs.
XC2S200-6FGG1047C vs. Competing FPGAs
| Feature |
XC2S200-6FGG1047C (Spartan-II) |
Comparable Competitor Device |
| Gate Count |
200,000 |
~200K class |
| Core Voltage |
2.5V |
2.5V / 3.3V |
| Speed Grade |
-6 (263 MHz) |
Varies |
| Package |
1047-pin FBGA |
Multiple options |
| Configuration |
SRAM-based |
SRAM-based |
| DLLs |
4 |
Varies |
| Block RAM |
56K bits |
Varies |
For engineers looking at the broader landscape of programmable logic, the Xilinx FPGA portfolio offers a wide range of devices from the cost-optimized Spartan series to the high-performance Virtex family, ensuring the right fit for every design requirement.
Design Tools and Software Support
The XC2S200-6FGG1047C is fully supported by Xilinx ISE Design Suite (now AMD’s legacy toolchain). Key tools include:
- XST (Xilinx Synthesis Technology) – for RTL synthesis from VHDL or Verilog
- ISE Project Navigator – integrated design environment
- ChipScope Pro – in-system logic analysis and debugging
- CORE Generator – IP core generation for common functions (FIFOs, DSP, memory controllers)
- iMPACT – device programming and configuration utility
Note: As a legacy device, the XC2S200-6FGG1047C is supported under ISE 14.7, the final release of Xilinx’s ISE toolchain, which remains freely available for download.
Frequently Asked Questions (FAQ)
What does the “-6” speed grade mean on the XC2S200-6FGG1047C?
The -6 speed grade represents the fastest timing characterization available for the Spartan-II commercial range. A lower number in Xilinx speed grade notation indicates faster propagation delays and higher maximum operating frequencies. The -6 grade supports system clock frequencies up to 263 MHz.
Is the XC2S200-6FGG1047C RoHS compliant?
Yes. The “G” in the “FGG” package code indicates a Pb-free, RoHS-compliant package. This makes the XC2S200-6FGG1047C suitable for products requiring compliance with European Union RoHS directives and similar environmental regulations worldwide.
What is the operating voltage of the XC2S200-6FGG1047C?
The device operates on a 2.5V core supply voltage. I/O voltage levels are configurable and depend on the I/O standard selected for each bank, supporting standards from 1.5V to 3.3V.
Can the XC2S200-6FGG1047C be used in industrial temperature applications?
No. The “C” suffix in the part number denotes the commercial temperature range (0°C to +85°C). For industrial temperature range (-40°C to +100°C) applications, consider the XC2S200-5FGG1047I or similar industrial-grade variants.
What configuration PROM is compatible with the XC2S200-6FGG1047C?
Xilinx XC18V04 or XC18V08 serial PROMs are commonly used for configuring the XC2S200-6FGG1047C in master serial mode. For parallel configuration, the XC17V series platform flash devices are compatible.
Summary: XC2S200-6FGG1047C at a Glance
| Attribute |
Value |
| Manufacturer |
Xilinx (AMD) |
| Family |
Spartan-II |
| Part Number |
XC2S200-6FGG1047C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Speed Grade |
-6 |
| Package |
1047-Ball FBGA (Pb-Free) |
| Core Voltage |
2.5V |
| Max Frequency |
263 MHz |
| User I/O |
284 |
| Block RAM |
56K bits |
| Distributed RAM |
75,264 bits |
| DLLs |
4 |
| Temperature Range |
Commercial (0°C to +85°C) |
| Configuration |
SRAM-based (external PROM required) |
| RoHS Compliance |
Yes (Pb-Free) |
| Design Tool |
Xilinx ISE 14.7 |
The XC2S200-6FGG1047C remains a reliable, proven solution for engineers who need a high-I/O, cost-effective FPGA for commercial-temperature applications. Its combination of 200K gates, 284 user I/Os, 1047-pin BGA packaging, and -6 speed grade performance makes it one of the most capable devices in the Spartan-II lineup.